يعرض 1 - 10 نتائج من 48 نتيجة بحث عن '"Ho, Cheng-En"', وقت الاستعلام: 3.33s تنقيح النتائج
  1. 1
    مؤتمر
    Speed-Aware Flow Management with Packet Classification to Mitigate Congestion in VANETs

    المؤلفون: Wang, You-Chiun, Ho, Cheng-En

    المصدر: 2023 VTS Asia Pacific Wireless Communications Symposium (APWCS) Wireless Communications Symposium (APWCS), 2023 VTS Asia Pacific. :1-5 Aug, 2023

    Relation: 2023 VTS Asia Pacific Wireless Communications Symposium (APWCS)

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  2. 2
    دورية أكاديمية
    Through glass via (TGV) copper metallization and its microstructure modification

    المؤلفون: Chang, Yu-Hsun, Lin, Yu-Ming, Lee, Cheng-Yu, Hsu, Pei-Chia, Chen, Chih-Ming, Ho, Cheng-En

    المصدر: In Journal of Materials Research and Technology July-August 2024 31:1008-1016

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  3. 3
    دورية أكاديمية
    Enhanced adhesion strength between electroplated Cu and ABF substrate with isothermal annealing treatment

    المؤلفون: Hsu, Pei-Chia, Chang, Shun-Cheng, Lu, Wen-Xuan, Liu, Hung-Cheng, Ho, Cheng-En

    المصدر: In Surface & Coatings Technology 15 March 2024 479

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  4. 4
    دورية أكاديمية
    Synergistic effects of additives on impurity residues in high-speed copper electrodeposition and voiding propensity in solder joints

    المؤلفون: Tsai, Kun-Lin, Chen, Chih-Ming, Ho, Cheng-En

    المصدر: In Journal of the Taiwan Institute of Chemical Engineers March 2024 156

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  5. 5
    مؤتمر
    White X-ray Nanodiffraction Study of Allotropic Phase Transformation of Hexagonal- into Monoclinic-Cu6Sn5

    المؤلفون: Lee, Pei-Tzu, Hsieh, Wan-Zhen, Lee, Cheng-Yu, Kao, C. R., Ho, Cheng-En

    المصدر: 2021 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2021 International Conference on. :113-114 May, 2021

    Relation: 2021 International Conference on Electronics Packaging (ICEP)

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  6. 6
    دورية أكاديمية
    High-frequency signal transmission in a coplanar waveguide structure with different surface finishes

    المؤلفون: Chiang, Ying-Chih, Tseng, Hao-Wei, Yu, Chun-Jou, Lee, Cheng-Yu, Huang, Chien-Chang, Ho, Cheng-En

    المصدر: In Thin Solid Films 1 November 2023 784

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  7. 7
    دورية أكاديمية
    Theoretical investigation of the displacement ductility capacity of scoured fixed-head piles in cohesive soil

    المؤلفون: Chiou, Jiunn-Shyang, Ho, Cheng-En

    المصدر: In Engineering Structures 15 October 2023 293

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  8. 8
    دورية أكاديمية
    Electromigration-induced remarkable intermetallic compound (IMC) formation in micro joints and its prevention

    المؤلفون: Lee, Pei-Tzu, Lee, Cheng-Yu, Hsieh, Wan-Zhen, Chen, Chih-Tsung, Ho, Cheng-En

    المصدر: In Journal of Materials Research and Technology May-June 2023 24:3889-3900

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  9. 9
    دورية أكاديمية
    Significantly improving the mechanical/electrical characteristics of blind-hole Cu filling through crystal coherent modification

    المؤلفون: Lin, Yu-Ming, Lee, Cheng-Yu, Chen, Yu-Lien, Pan, Chih-Pin, Ho, Cheng-En

    المصدر: In Surface & Coatings Technology 15 March 2022 433

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  10. 10
    دورية أكاديمية
    High-speed electrodeposition for Cu pillar fabrication and Cu pillar adhesion to an Ajinomoto build-up film (ABF)

    المؤلفون: Lee, Pei-Tzu, Chang, Chih-Hao, Lee, Cheng-Yu, Wu, Ying-Syuan, Yang, Cheng-Hsien, Ho, Cheng-En

    المصدر: In Materials & Design August 2021 206

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