المؤلفون: Rich, D.A., Carroll, M.S., Frei, M.R., Ivanov, T.G., Mastrapasqua, M., Moinian, S., Chen, A.S., King, C.A., Harris, E., De Blauwe, J., Hong-Ha Vuong, Archer, V., Ng, K.

المصدر: IEEE Microwave Magazine IEEE Microwave Microwave Magazine, IEEE. 3(2):44-55 Jun, 2002

المؤلفون: Hidetoshi Onodera, Hong-Ha Vuong

المصدر: 2008 IEEE Custom Integrated Circuits Conference Custom Integrated Circuits Conference, 2008. CICC 2008. IEEE. :xxvii-xxviii Sep, 2008

Relation: 2008 IEEE Custom Integrated Circuits Conference - CICC 2008

المؤلفون: Darwish, M.N., Lentz, J.L., Pinto, M.R., Zeitzoff, P.M., Krutsick, T.J., Hong Ha Vuong

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 44(9):1529-1538 Sep, 1997

المؤلفون: Hong-Ha Vuong, Yuhua Cheng

المصدر: Proceedings of the IEEE 2005 Custom Integrated Circuits Conference, 2005. Custom Integrated Circuits Custom Integrated Circuits Conference, 2005. Proceedings of the IEEE 2005. :586-587 2005

Relation: Proceedings of the IEEE 2005 Custom Integrated Circuits Conference

المؤلفون: C.A. King, D.A. Rich, K. Ng, M.R. Frei, S. Moinian, A.S. Chen, V.D. Archer, J. De Blauwe, Hong-Ha Vuong, Marco Mastrapasqua, Tony Ivanov, M.S. Carroll, Edward B. Harris

المصدر: IEEE Microwave Magazine. 3:44-55

مصطلحات موضوعية: Digital electronics, Engineering, Radiation, business.industry, Electrical engineering, Process (computing), Hardware_PERFORMANCEANDRELIABILITY, Integrated circuit, Condensed Matter Physics, Digital analog, Bicmos technology, law.invention, Hardware_GENERAL, law, Hardware_INTEGRATEDCIRCUITS, Electronic engineering, Bicmos integrated circuits, System on a chip, Hardware_ARITHMETICANDLOGICSTRUCTURES, Electrical and Electronic Engineering, business, Hardware_LOGICDESIGN, Electronic circuit

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::e9ccb845b21a544d7adbbc1d2b2a1da4
https://doi.org/10.1109/mmw.2002.1004051

المؤلفون: Hong Ha Vuong, P.M. Zeitzoff, T.J. Krutsick, Mohamed N. Darwish, M.R. Pinto, J.L. Lentz

المصدر: IEEE Transactions on Electron Devices. 44:1529-1538

مصطلحات موضوعية: Electron mobility, Mobility model, Materials science, Condensed matter physics, Electric field, MOSFET, Doping, Induced high electron mobility transistor, Charge carrier, Electron, Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::62d9013d9819d90e7264de162e1382af
https://doi.org/10.1109/16.622611

المؤلفون: Peter Lloyd, Janet L. Lentz, Colin C. McAndrew, Michael J. McLennan, Ken Haruta, Kishore Singhal, Sani R. Nassif, Conor S. Rafferty, M.R. Pinto, Peter M. Zeitzoff, Mohamed N. Darwish, Hong-Ha Vuong, Kumud Singhal, Isik C. Kizilyalli

المصدر: Microelectronics Journal. 26:79-97

مصطلحات موضوعية: Engineering, Computer simulation, Process (engineering), business.industry, General Engineering, Interval (mathematics), Integrated circuit, computer.software_genre, law.invention, Reliability engineering, law, Hardware_INTEGRATEDCIRCUITS, Computer Aided Design, Sensitivity (control systems), business, Technology CAD, computer, Simulation, Design technology

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::a1a859575b2e80331963c88dcbadc22d
https://doi.org/10.1016/0026-2692(95)98915-e

المؤلفون: Manoj Sachdev, Hong-Ha Vuong

المصدر: CICC

مصطلحات موضوعية: Engineering, Electrostatic discharge, business.industry, Electrical engineering, Hardware_PERFORMANCEANDRELIABILITY, CMOS, Parasitic capacitance, Gate oxide, Hardware_INTEGRATEDCIRCUITS, Electronic engineering, Electronic design automation, System on a chip, Integrated circuit packaging, business, Hardware_LOGICDESIGN, Electronic circuit

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::b22acf7c98da8581d5ebe8beb33f48ef
https://doi.org/10.1109/cicc.2009.5280757

المؤلفون: Hong-Ha Vuong, Yuhua Cheng

المصدر: CICC

مصطلحات موضوعية: Interconnection, Computer science, business.industry, Electronic engineering, Semiconductor device modeling, Electrical engineering, Propagation delay, Size measurement, Process variability, business, Characterization (materials science)

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::efe552f8ce43f07d374fad01ab2e808c
https://doi.org/10.1109/cicc.2005.1568737