يعرض 1 - 10 نتائج من 136,917 نتيجة بحث عن '"Hongwei An"', وقت الاستعلام: 0.97s تنقيح النتائج
  1. 1
    مؤتمر
    Communication Architecture Under Siege: An In-depth Analysis of Fault Attack Vulnerabilities and Countermeasures

    المؤلفون: Zhao, Hongwei, Lapotre, Vianney, Gogniat, Guy

    المصدر: 2024 IEEE International Conference on Cyber Security and Resilience (CSR) Cyber Security and Resilience (CSR), 2024 IEEE International Conference on. :890-896 Sep, 2024

    Relation: 2024 IEEE International Conference on Cyber Security and Resilience (CSR)

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  2. 2
    مؤتمر
    A High Linearity ADC Front-End Circuit for Single-Ended Inputs

    المؤلفون: Zhang, Rui, Wang, Yabin, Li, Fule, Yuan, Yidong, Hu, Yi, Shen, Hongwei, Li, Zhenguo, Pan, Jiaming, Hou, Jiali

    المصدر: 2024 IEEE 67th International Midwest Symposium on Circuits and Systems (MWSCAS) Circuits and Systems (MWSCAS), 2024 IEEE 67th International Midwest Symposium on. :942-945 Aug, 2024

    Relation: 2024 IEEE 67th International Midwest Symposium on Circuits and Systems (MWSCAS)

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  3. 3
    مؤتمر
    Electro-Thermo-Mechanical Simulation Analysis Of Multichip SiC MOSFET Power Modules

    المؤلفون: Fan, Yi, Qian, Haoquan, Liu, Hongwei, Wang, Yongzhi, Zhu, Wenhui, Wang, Liancheng

    المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :01-06 Aug, 2024

    Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

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  4. 4
    مؤتمر
    Fabrication and Performance Test of Nano Cu@Ag Core-Shell Particles for Power Device Packaging

    المؤلفون: Tan, Wei, Ma, Haoran, Liang, Hongwei

    المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-4 Aug, 2024

    Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

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  5. 5
    مؤتمر
    Parasitic RLGC Properties of High-density Through-Glass Via

    المؤلفون: Liu, Jinxu, Zhang, Jihua, Fang, Zhen, Fu, Juefeng, Jili, Xiaobing, Zhang, Baichuan, Li, Jia, Li, Shuang, Liu, Ting, Wang, Dongbin, Gao, Libin, Chen, Hongwei

    المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-6 Aug, 2024

    Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

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  6. 6
    مؤتمر
    High Inductance Density Solenoid Inductors Based on Glass Blind Groove for 3-D Glass Packaging

    المؤلفون: Zhao, Lei, Zhang, Jihua, He, Siqi, Li, Wenlei, Gao, Libin, Chen, Hongwei, Li, Shuang, Liu, Ting, Wang, Dongbin, Cai, Xingzhou, Li, Yong, Zhang, Wanli

    المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-6 Aug, 2024

    Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

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  7. 7
    مؤتمر
    Design and Modeling of Non-Uniform through-Glass Vias and its Optimization Methods

    المؤلفون: Fang, Zhen, Shi, Hongbin, Zhang, Jihua, Liu, Jinxu, Wang, Dongbin, Chen, Hongwei

    المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-6 Aug, 2024

    Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

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  8. 8
    مؤتمر
    Thermal and Thermomechanical Performance Enhancement of Electric Vehicle Power Modules Utilizing Diamond-Copper Composite Interposers

    المؤلفون: Cai, Zhao, Sun, Guoliao, Liu, Hongwei

    المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-5 Aug, 2024

    Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

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  9. 9
    مؤتمر
    Research on a Charging Pile Fault Prediction Method Based on Improved C4.5 Algorithm

    المؤلفون: Liu, Hongpeng, Xu, Ziqi, Sun, Yirui, Wang, Liyuan, Li, Hongwei

    المصدر: 2024 IEEE 19th Conference on Industrial Electronics and Applications (ICIEA) Industrial Electronics and Applications (ICIEA), 2024 IEEE 19th Conference on. :1-5 Aug, 2024

    Relation: 2024 IEEE 19th Conference on Industrial Electronics and Applications (ICIEA)

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  10. 10
    مؤتمر
    Prioritized Experience Replay Method Based on TD Error and Reducible Loss

    المؤلفون: HongWei, Han, GuangHong, Gong, Ni, Li

    المصدر: 2024 IEEE 19th Conference on Industrial Electronics and Applications (ICIEA) Industrial Electronics and Applications (ICIEA), 2024 IEEE 19th Conference on. :1-6 Aug, 2024

    Relation: 2024 IEEE 19th Conference on Industrial Electronics and Applications (ICIEA)

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