المؤلفون: Cheng, H. Y., Grun, A., Chien, W C., Yeh, C. W., Ray, A., Cheng, C. W., Lai, E. K., Lavoie, C., Gignac, L., Hopstaken, M., Kuo, I. T., Hsu, C. S., Buzi, L., Bruce, R. L., Lee, D. Y., Gong, N., Bishop, D., BrightSky, M., Lung, H. L.

المصدر: 2022 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2022 International. :18.5.1-18.5.4 Dec, 2022

Relation: 2022 IEEE International Electron Devices Meeting (IEDM)

المؤلفون: Cartier, E., Majumdar, A., Lee, K.-T., Ando, T., Frank, M. M., Rozen, J., Jenkins, K. A., Liang, C., Cheng, C.-W., Bruley, J., Hopstaken, M., Kerber, P., Yau, J.-B., Sun, X., Mo, R. T., Yeh, C.-C., Leobandung, E., Narayanan, V.

المصدر: 2017 47th European Solid-State Device Research Conference (ESSDERC) Solid-State Device Research Conference (ESSDERC), 2017 47th European. :292-295 Sep, 2017

Relation: ESSDERC 2017 - 47th IEEE European Solid-State Device Research Conference (ESSDERC)

المؤلفون: Cheng, H. Y., Kuo, I. T., Chien, W. C., Yeh, C. W., Chou, Y. C., Gong, N., Gignac, L., Yang, C. H., Cheng, C. W., Lavoie, C., Hopstaken, M., Bruce, R. L., Buzi, L., Lai, E. K., Carta, F., Ray, A., Lee, M. H., Ho, H. Y., Kim, W., BrightSky, M., Lung, H. L.

المصدر: 2020 IEEE Symposium on VLSI Technology VLSI Technology, 2020 IEEE Symposium on. :1-2 Jun, 2020

Relation: 2020 IEEE Symposium on VLSI Technology

المؤلفون: Zhang, Z., Hengstebeck, B., Stevie, F. A., Hopstaken, M.

المصدر: 2016 27th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) Advanced Semiconductor Manufacturing Conference (ASMC), 2016 27th Annual SEMI. :172-175 May, 2016

Relation: 2016 27th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)

المؤلفون: Cowern, N., Colombeau, B., Roozeboom, F., Hopstaken, M., Snijders, H., Meunier-Beillard, P., Lerch, W.

المصدر: 32nd European Solid-State Device Research Conference Solid-State Device Research Conference, 2002. Proceeding of the 32nd European. :203-206 2002

Relation: 32nd European Solid-State Device Research Conference

المؤلفون: Zhang, Z., Atkin, J., Hopstaken, M., Hatzistergos, M., Ronsheim, P., Liniger, E., Laibowitz, R., Solomon, P. M.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 59(8):2027-2032 Aug, 2012

المؤلفون: Yamashita, T., Mehta, S., Basker, V.S., Southwick, R., Kumar, A., Kambhampati, R., Sathiyanarayanan, R., Johnson, J., Hook, T., Cohen, S., Li, J., Madan, A., Zhu, Z., Tai, L., Yao, Y., Chinthamanipeta, P., Hopstaken, M., Liu, Z., Lu, D., Chen, F., Khan, S., Canaperi, D., Haran, B., Stathis, J., Oldiges, P., Lin, C-H., Narasimha, S., Bryant, A., Henson, W.K., Kanakasabapathy, S., Murali, K.V.R.M., Gow, T., McHerron, D., Bu, H., Khare, M.

المصدر: 2015 Symposium on VLSI Technology (VLSI Technology) VLSI Technology (VLSI Technology), 2015 Symposium on. :T154-T155 Jun, 2015

Relation: 2015 Symposium on VLSI Technology

المؤلفون: Majumdar, A., Sun, Y., Cheng, C., Kim, Y., Rana, U., Martin, R.M., Bruce, R.L., Shiu, K., Zhu, Y., Farmer, D.B., Hopstaken, M., Joseph, E.A., de Souza, J.P., Frank, M.M., Cheng, S., Kobayashi, M., Duch, E.A., Sadana, D.K., Park, D., Leobandung, E.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 61(10):3399-3404 Oct, 2014

المؤلفون: Linder, Barry P., Dasgupta, A., Ando, T., Cartier, E., Kwon, U., Southwick, R., Wang, M., Krishnan, S. A., Hopstaken, M., Bajaj, M., Pandey, R., Chang, W., Yamashita, T., Gluschenkov, O., Narayanan, V., Stathis, J., Ray, S., Liu, J.

المصدر: 2016 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2016 IEEE International. :4B-1-1-4B-1-5 Apr, 2016

Relation: 2016 IEEE International Reliability Physics Symposium (IRPS)

المؤلفون: Zhang, Z., Koswatta, S. O., Bedell, S. W., Baraskar, A., Guillorn, M., Engelmann, S. U., Zhu, Y., Gonsalves, J., Pyzyna, A., Hopstaken, M., Witt, C., Yang, L., Liu, F., Newbury, J., Song, W., Cabral, C., Lofaro, M., Ozcan, A. S., Raymond, M., Lavoie, C., Sleight, J. W., Rodbell, K. P., Solomon, P. M.

المصدر: IEEE Electron Device Letters IEEE Electron Device Lett. Electron Device Letters, IEEE. 34(6):723-725 Jun, 2013