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المساهمون: Schüßler, Florian, Rösch, Michael, Hörber, Johannes, Feldmann, Klaus, Hearer, John
الإتاحة: http://data.europeana.eu/aggregation/europeana/2048441/item_MVWQMYNNBT2JR32LGRD6KNDN5H5O7PBC
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2مؤتمر
المؤلفون: Frohlich, Jan, Graf, Daniel, Franke, Jorg, Horber, Johannes, Hedges, Martin
المصدر: 2020 Pan Pacific Microelectronics Symposium (Pan Pacific) Pan Pacific Microelectronics Symposium (Pan Pacific), 2020. :1-6 Feb, 2020
Relation: 2020 Pan Pacific Microelectronics Symposium (Pan Pacific)
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3مؤتمر
المؤلفون: Ischdonat, Nils, Dreyer, Christian, Graf, Daniel, Franke, Jorg, Horber, Johannes, Hedges, Martin
المصدر: 2018 13th International Congress Molded Interconnect Devices (MID) Molded Interconnect Devices (MID), 2018 13th International Congress. :1-5 Sep, 2018
Relation: 2018 13th International Congress Molded Interconnect Devices (MID)
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4مؤتمر
المؤلفون: Graf, Daniel, Franke, Jorg, Ischdonat, Nils, Hedges, Martin, Horber, Johannes
المصدر: 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition Microelectronics and Packaging Conference (EMPC) & Exhibition, 2017 21st European. :1-6 Sep, 2017
Relation: 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition
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