المؤلفون: Tanaka, Masaya, Okazaki, Yumi, Suyama, Junichi, Kuramochi, Satoru, Han, Younggun, Horiuchi, Osamu, Katoh, Yoshihisa

المصدر: 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), 2018 International Conference on. :184-188 Apr, 2018

Relation: 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)

المؤلفون: Yoshizawa, Masamitsu, Hattori, Atsunori, Hatano, Hirotaka, Han, Younggun, Horiuchi, Osamu, Katoh, Yoshihisa, Nakura, Toru

المصدر: 2017 IEEE CPMT Symposium Japan (ICSJ) CPMT Symposium Japan (ICSJ), 2017 IEEE. :163-166 Nov, 2017

Relation: 2017 IEEE CPMT Symposium Japan (ICSJ)

المؤلفون: Enami, Toshio, Horiuchi, Osamu, Han, Young-Gun, Tomokage, Hajime

المصدر: 2016 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2016 International Conference on. :469-472 Apr, 2016

Relation: 2016 International Conference on Electronics Packaging (ICEP)

المؤلفون: Enami, Toshio, Nanami, Kyosuke, Horiuchi, Osamu, Han, Young-Gun, Tomokage, Hajime

المصدر: 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) Electronics Packaging and Technology Conference (EPTC), 2015 IEEE 17th. :1-6 Dec, 2015

Relation: 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC)

المؤلفون: Young-Gun Han, Horiuchi, Osamu, Hayashi, Shigehiro, Nogita, Kanta, Katoh, Yoshihisa, Tomokage, Hajime

المصدر: 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) Electronics Packaging and iMAPS All Asia Conference (ICEP-IACC), 2015 International Conference on. :174-179 Apr, 2015

Relation: 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)

المؤلفون: Enami, Toshio, Nanami, Kyosuke, Horiuchi, Osamu, Han, Young-Gun, Tomokage, Hajime

المصدر: 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) Electronics Packaging and iMAPS All Asia Conference (ICEP-IACC), 2015 International Conference on. :795-799 Apr, 2015

Relation: 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)

المؤلفون: Fukazawa, Takashi^Aff2, Fuwa, Naruto^Aff2, Ikeno, Jun-ichi^Aff3, Shibutanic, Hideo^Aff4, Horiuchi, Osamu^Aff4, Suzuki, Hirofumi^Aff4

المساهمون: Inasaki, Ichiro, editor^Aff1

المصدر: Initiatives of Precision Engineering at the Beginning of a Millennium : 10th International Conference on Precision Engineering (ICPE) July 18–20, 2001, Yokohama, Japan. :366-370

المؤلفون: Wada, Ikuo, Sakuma, Eisuke, Otsuka, Takanobu, Wakabayashi, Kenjiro, Ito, Kinya, Horiuchi, Osamu, Asagai, Yoshimi, Kamegaya, Makoto, Goto, Eiji, Satsuma, Shinichi, Kobayashi, Daisuke, Saito, Susumu, Taketa, Mayuki, Takikawa, Kazuharu, Nakashima, Yasuharu, Hattori, Tadashi, Mitani, Shigeru, Wada, Akifusa

المصدر: Journal of Orthopaedic Science: Official Journal of the Japanese Orthopaedic Association. September 2013 18(5):749-753

المؤلفون: Masadome, Takashi^{Aff1, IDArt4_cor1}, Nakamura, Kazuki, Iijima, Daisuke, Horiuchi, Osamu, Tossanaitada, Benjaporn, Wakida, Shin-Ichi, Imato, Toshihiko

المصدر: Analytical Sciences. 26(4):417-423

المؤلفون: Kojima, Hiroshi, Sakuma, Eisuke, Mabuchi, Yoshio, Mizutani, Jun, Horiuchi, Osamu, Wada, Ikuo, Horiba, Mitsuya, Yamashita, Yutaka, Herbert, Damon C., Soji, Tsuyoshi, Otsuka, Takanobu

المصدر: Journal of Orthopaedic Science: Official Journal of the Japanese Orthopaedic Association. May 2008 13(3):233-239