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1مؤتمر
المؤلفون: Tanaka, Masaya, Okazaki, Yumi, Suyama, Junichi, Kuramochi, Satoru, Han, Younggun, Horiuchi, Osamu, Katoh, Yoshihisa
المصدر: 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), 2018 International Conference on. :184-188 Apr, 2018
Relation: 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)
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2مؤتمر
المؤلفون: Yoshizawa, Masamitsu, Hattori, Atsunori, Hatano, Hirotaka, Han, Younggun, Horiuchi, Osamu, Katoh, Yoshihisa, Nakura, Toru
المصدر: 2017 IEEE CPMT Symposium Japan (ICSJ) CPMT Symposium Japan (ICSJ), 2017 IEEE. :163-166 Nov, 2017
Relation: 2017 IEEE CPMT Symposium Japan (ICSJ)
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3مؤتمر
المؤلفون: Enami, Toshio, Horiuchi, Osamu, Han, Young-Gun, Tomokage, Hajime
المصدر: 2016 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2016 International Conference on. :469-472 Apr, 2016
Relation: 2016 International Conference on Electronics Packaging (ICEP)
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4مؤتمر
المصدر: 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) Electronics Packaging and Technology Conference (EPTC), 2015 IEEE 17th. :1-6 Dec, 2015
Relation: 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC)
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5مؤتمر
المؤلفون: Young-Gun Han, Horiuchi, Osamu, Hayashi, Shigehiro, Nogita, Kanta, Katoh, Yoshihisa, Tomokage, Hajime
المصدر: 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) Electronics Packaging and iMAPS All Asia Conference (ICEP-IACC), 2015 International Conference on. :174-179 Apr, 2015
Relation: 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)
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6مؤتمر
المصدر: 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) Electronics Packaging and iMAPS All Asia Conference (ICEP-IACC), 2015 International Conference on. :795-799 Apr, 2015
Relation: 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)
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7كتاب إلكتروني
المؤلفون: Fukazawa, TakashiAff2, Fuwa, NarutoAff2, Ikeno, Jun-ichiAff3, Shibutanic, HideoAff4, Horiuchi, OsamuAff4, Suzuki, HirofumiAff4
المساهمون: Inasaki, Ichiro, editorAff1
المصدر: Initiatives of Precision Engineering at the Beginning of a Millennium : 10th International Conference on Precision Engineering (ICPE) July 18–20, 2001, Yokohama, Japan. :366-370
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8دورية أكاديمية
المؤلفون: Wada, Ikuo, Sakuma, Eisuke, Otsuka, Takanobu, Wakabayashi, Kenjiro, Ito, Kinya, Horiuchi, Osamu, Asagai, Yoshimi, Kamegaya, Makoto, Goto, Eiji, Satsuma, Shinichi, Kobayashi, Daisuke, Saito, Susumu, Taketa, Mayuki, Takikawa, Kazuharu, Nakashima, Yasuharu, Hattori, Tadashi, Mitani, Shigeru, Wada, Akifusa
المصدر: Journal of Orthopaedic Science: Official Journal of the Japanese Orthopaedic Association. September 2013 18(5):749-753
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9دورية أكاديمية
المؤلفون: Masadome, TakashiAff1, IDArt4_cor1, Nakamura, Kazuki, Iijima, Daisuke, Horiuchi, Osamu, Tossanaitada, Benjaporn, Wakida, Shin-Ichi, Imato, Toshihiko
المصدر: Analytical Sciences. 26(4):417-423
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10دورية أكاديمية
المؤلفون: Kojima, Hiroshi, Sakuma, Eisuke, Mabuchi, Yoshio, Mizutani, Jun, Horiuchi, Osamu, Wada, Ikuo, Horiba, Mitsuya, Yamashita, Yutaka, Herbert, Damon C., Soji, Tsuyoshi, Otsuka, Takanobu
المصدر: Journal of Orthopaedic Science: Official Journal of the Japanese Orthopaedic Association. May 2008 13(3):233-239