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1مؤتمر
المؤلفون: Ambrosi, E., Wu, C. H., Song, M. Y., Lee, H. Y., Li, K. S., Lin, C. C., Hsu, C. F., Kuo, C. C., Chang, W. N., Chen, Y. J., Lin, C. H., Shieh, J. M., Shen, C. H., Lee, T. Y., Hou, T. H., Bao, X. Y.
المصدر: 2023 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2023 International. :1-4 Dec, 2023
Relation: 2023 International Electron Devices Meeting (IEDM)
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2مؤتمر
المؤلفون: Yu, X.-R., Hsieh, C.-C., Chuang, M.-H., Chiu, M.-Y., Sun, T.-C., Geng, W.-Z., Chang, W.-H., Shih, Y.-J., Lu, W.-H., Chang, W.-C., Lin, Y.-C., Pai, Y.-C., Lai, C.-Y., Dei, Y., Yang, C.-Y., Lu, H.-Y., Lin, N.-C., Wu, C.-T., Kao, K.-H., Ma, W. C.-Y., Lu, D. D., Lee, Y.-J., Luo, G.-L., Chiang, M.-H., Maeda, T., Wu, W.-F., Li, Y.-M., Hou, T.-H.
المصدر: 2023 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2023 International. :1-4 Dec, 2023
Relation: 2023 International Electron Devices Meeting (IEDM)
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3مؤتمر
المؤلفون: Lin, Y.L., Liu, Y. R., Kao, T. C., Lee, M. Y., Guo, J. C., Hou, T. -H., Chung, Steve S.
المصدر: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA) Technology, Systems and Applications (VLSI TSA), 2024 International VLSI Symposium on. :1-2 Apr, 2024
Relation: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA)
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4مؤتمر
المؤلفون: Hsiang, K.-Y., Lee, J.-Y., Lou, Z.-F., Chang, F.-S., Li, Z.-X., Liu, C. W., Hou, T.-H., Su, P., Lee, M. H.
المصدر: 2023 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2023 IEEE International. :1-4 Mar, 2023
Relation: 2023 IEEE International Reliability Physics Symposium (IRPS)
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5مؤتمر
المؤلفون: Hsiang, K.-Y., Lee, J.-Y., Chang, F.-S., Lou, Z.-F., Li, Z.-X., Li, Z.-H., Chen, J.-H., Liu, C. W., Hou, T.-H., Lee, M. H.
المصدر: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) VLSI Technology and Circuits (VLSI Technology and Circuits), 2023 IEEE Symposium on. :1-2 Jun, 2023
Relation: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)
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6مؤتمر
المؤلفون: Hsiang, K.-Y., Chen, Y.-C., Chang, F.-S., Lin, C.-Y., Liao, C.-Y., Lou, Z.-F., Lee, J.-Y., Ray, W.-C., Li, Z.-X., Wang, C.-C., Tseng, H.-C., Chen, P.-H., Tsai, J.-H., Liao, M. H., Hou, T.-H., Liu, C. W., Huang, P.-T., Su, P., Lee, M. H.
المصدر: 2022 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2022 International. :32.5.1-32.54 Dec, 2022
Relation: 2022 IEEE International Electron Devices Meeting (IEDM)
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7مؤتمر
المؤلفون: Lou, Z.-F., Liao, C.-Y., Hsiang, K.-Y., Lin, C.-Y., Lin, Y.-D., Yeh, P.-C., Wang, C.-Y., Yang, H.-Y., Tzeng, P.-J., Hou, T.-H., Tang, Y.-T., Lee, M. H.
المصدر: 2022 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA) VLSI Technology, Systems and Applications (VLSI-TSA), 2022 International Symposium on. :1-2 Apr, 2022
Relation: 2022 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA)
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8مؤتمر
المؤلفون: Hsiang, K.-Y., Liao, C.-Y., Lin, Y.-Y., Lou, Z.-F., Lin, C.-Y., Lee, J.-Y., Chang, F.-S., Li, Z.-X., Tseng, H.-C., Wang, C.-C., Ray, W.-C., Hou, T.-H., Chen, T.-C., Chang, C.-S., Lee, M. H.
المصدر: 2022 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2022 IEEE International. :P9-1-P9-4 Mar, 2022
Relation: 2022 IEEE International Reliability Physics Symposium (IRPS)
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9مؤتمر
المؤلفون: Pan, T.-L., Li, S.-T., Liu, C., Hou, T.-H., Jou, S.-J., Chang, T.-S.
المصدر: 2021 International Symposium on VLSI Design, Automation and Test (VLSI-DAT) VLSI Design, Automation and Test (VLSI-DAT), 2021 International Symposium on. :i-i Apr, 2021
Relation: 2021 International Symposium on VLSI Design, Automation and Test (VLSI-DAT)
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10مؤتمر
المؤلفون: Chen, P.-Y., Lin, B., Wang, I., Hou, T.-H., Ye, J., Vrudhula, S., Seo, J.-S., Cao, Y., Yu, S.
المصدر: 2015 IEEE/ACM International Conference on Computer-Aided Design (ICCAD) Computer-Aided Design (ICCAD), 2015 IEEE/ACM International Conference on. :194-199 Nov, 2015
Relation: 2015 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)