المؤلفون: CHEN Siyu, SUN Jianhong, SUN Zhi, HOU Bin, LIU Hao

المصدر: Hangkong gongcheng jinzhan, Vol 13, Iss 6, Pp 134-143 (2022)

مصطلحات موضوعية: wing-in-ground aircraft, broken step, water landing slamming, overload, pitch angle, Motor vehicles. Aeronautics. Astronautics, TL1-4050

وصف الملف: electronic resource

Relation: http://hkgcjz.cnjournals.com/hkgcjz/article/abstract/2022018?st=article_issue; https://doaj.org/toc/1674-8190

URL الوصول: https://doaj.org/article/b2582f6ffbd94cc8aa0bcaaffef8e28f

المؤلفون: Hou Bin, Fei Liu, Yanling Zheng, Qiuru Yao, Yun Zhang

المصدر: Systems, Vol 11, Iss 10, p 497 (2023)

مصطلحات موضوعية: carbon emission efficiency, the integration of manufacturing and producer service, technological innovation, intermediary effect, environmental management, Systems engineering, TA168, Technology (General), T1-995

وصف الملف: electronic resource

Relation: https://www.mdpi.com/2079-8954/11/10/497; https://doaj.org/toc/2079-8954

URL الوصول: https://doaj.org/article/82cc7ba976604bce91b75f8732e048df

المؤلفون: LIAN Weixin, HOU Bin, SUN Jianhong, WANG Conglei, ZHANG Tong

المصدر: Hangkong gongcheng jinzhan, Vol 13, Iss 1, Pp 68-75 (2022)

مصطلحات موضوعية: airdrop system, soil model, cushion airbag, finite element, soil deformation, Motor vehicles. Aeronautics. Astronautics, TL1-4050

وصف الملف: electronic resource

Relation: http://hkgcjz.cnjournals.com/hkgcjz/article/abstract/2021014?st=article_issue; https://doaj.org/toc/1674-8190

URL الوصول: https://doaj.org/article/61834b6d0e2a4dc382e9468144781ac5

المؤلفون: Hou, Bin, Feng, Shiying, Wang, Baoli, Yin, Jiali, Dai, Jiapeng, Ma, Xiyu

المصدر: 2023 IEEE 6th International Conference on Automation, Electronics and Electrical Engineering (AUTEEE) Automation, Electronics and Electrical Engineering (AUTEEE), 2023 IEEE 6th International Conference on. :309-313 Dec, 2023

Relation: 2023 IEEE 6th International Conference on Automation, Electronics and Electrical Engineering (AUTEEE)

المؤلفون: Yang, Ling, Jia, Fuchun, Lu, Hao, Hou, Bin, Zhang, Meng, Du, Jiale, Chang, Qingyuan, Deng, Longge, Yu, Qian, Li, Shiming, Wu, Mei, Mi, Minhan, Ma, Xiaohua, Hao, Yue

المصدر: 2023 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2023 International. :1-4 Dec, 2023

Relation: 2023 International Electron Devices Meeting (IEDM)

المؤلفون: Guojie Xie, Lijuan Huang, Hou Bin, Chrysostomos Apostolidis, Yaohui Jiang, Guokai Li, Weiwei Cai

المصدر: Frontiers in Environmental Science, Vol 10 (2022)

مصطلحات موضوعية: rural e-commerce, entrepreneurs, sustainable entrepreneurship, entrepreneurship event model, neural networks, Environmental sciences, GE1-350

وصف الملف: electronic resource

Relation: https://www.frontiersin.org/articles/10.3389/fenvs.2022.840479/full; https://doaj.org/toc/2296-665X

URL الوصول: https://doaj.org/article/007c7fdd00da485a85d8b3a9dd82882f

المؤلفون: Hou Bin, Feng Zhao, Guojie Xie, Lijuan Huang, Huanfang Wang, Ruidong Zhu, Li Jiang

المصدر: IEEE Access, Vol 8, Pp 225064-225075 (2020)

مصطلحات موضوعية: Crowd logistics, crowdsourcers, influencing factors, TOE model, stakeholder analysis, Electrical engineering. Electronics. Nuclear engineering, TK1-9971

وصف الملف: electronic resource

Relation: https://ieeexplore.ieee.org/document/9294119/; https://doaj.org/toc/2169-3536

URL الوصول: https://doaj.org/article/a77410df3165405bacdbfdd4b8c6c9c9

المؤلفون: Hou, Bin, Li, Wenwen^{Aff1, IDS0025654424600053_cor2}

المصدر: Mechanics of Solids. :1-10

المؤلفون: Hao, Xiao-lu, Chen, Ran, Liu, Wei, Hou, Bao-ke, Qu, Ling-hui, Li, Zhao-hui, Wang, Da-jiang, Jin, Xin^{Aff1, IDs1159602429031_cor8}, Huang, Hou-bin^{Aff1, IDs1159602429031_cor9}

المصدر: Current Medical Science. :1-7

المؤلفون: Bai, Jinwen^{Aff1, Aff2, Aff3}, Zhao, Yantong^{Aff1, Aff2, Aff3}, Shi, Xudong^{Aff1, Aff2, Aff3, IDs0060302404050x_cor3}, Feng, Guorui^{Aff1, Aff2, Aff3, IDs0060302404050x_cor4}, Wang, Shanyong, Hou, Bin^{Aff1, Aff2, Aff3}, Mi, Jiachen^{Aff1, Aff2, Aff3}, Ma, Junbiao^{Aff1, Aff2, Aff3}, Li, Jian^{Aff1, Aff2, Aff3}

المصدر: Rock Mechanics and Rock Engineering. :1-18