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1
المؤلفون: Guenter Mayer, Thomas Strach, Yiu-Hing Chan, Gerard M. Salem, Ayan Datta, Doug Malone, David L. Rude, Adam R. Jatkowski, James D. Warnock, Donald W. Plass, Anne E. Gattiker, C-L Kevin Shum, Charles F. Webb, Jeffrey A. Zitz, Aditya Bansal, L. Sigal, Gerald Strevig, Pak-Kin Mak, Howard H. Smith, Ruchir Puri, S. Carey, Hubert Harrer, M. Mayo, Huajun Wen, Yuen Chan
المصدر: IEEE Journal of Solid-State Circuits. 49:9-18
مصطلحات موضوعية: Engineering, Multi-core processor, Hardware_MEMORYSTRUCTURES, business.industry, Circuit design, Multi-chip module, Hardware_PERFORMANCEANDRELIABILITY, Integrated circuit design, eDRAM, Chip, law.invention, Microprocessor, law, Embedded system, Hardware_INTEGRATEDCIRCUITS, Electrical and Electronic Engineering, Physical design, business, Computer hardware
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2
المؤلفون: Howard H. Smith, Antonio R. Pelella, Patrick J. Meaney, Pradip Patel, D. Malone, G. Gerwig, S. Carey, William V. Huott, James D. Warnock, David L. Rude, Thomas Strach, Frank Malgioglio, Huajun Wen, Daniel Rodko, Yuen Chan, Paul A. Bunce, Jose L. Neves, Yiu-Hing Chan, John Davis
المصدر: IEEE Journal of Solid-State Circuits. 47:151-163
مصطلحات موضوعية: Very-large-scale integration, Engineering, business.industry, Design for testing, Hardware_PERFORMANCEANDRELIABILITY, Integrated circuit design, Chip, Network on a chip, Hardware_INTEGRATEDCIRCUITS, Electronic engineering, System on a chip, Electrical and Electronic Engineering, Physical design, business, Power network design
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3
المؤلفون: Kaustav Banerjee, Barry J. Rubin, Chuan Xu, Alain Caron, Alina Deutsch, Li Jun Jiang, Howard H. Smith, A J Weger
المصدر: IEEE Transactions on Advanced Packaging. 33:777-786
مصطلحات موضوعية: Very-large-scale integration, Interconnection, Engineering, business.industry, Computation, Design flow, Electronic packaging, Integrated circuit, law.invention, Thermal conductivity, law, Heat transfer, Hardware_INTEGRATEDCIRCUITS, Electronic engineering, Electrical and Electronic Engineering, business
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4
المؤلفون: David W. Lewis, Joachim Keinert, R. D. Morel, Jack DiLullo, A. E. Barish, Peter J. Camporese, P. E. Dudley, D. Thomas, Howard H. Smith, J. R. Ripley, R. Berridge, R. Averill, Thomas Edward Rosser, Phillip J. Restle, Michael Alexander Bowen, Nicole Schwartz, Patrick M. Williams, P. Shephard, Steve Runyon
المصدر: IBM Journal of Research and Development. 51:685-714
مصطلحات موضوعية: Engineering, General Computer Science, business.industry, POWER6, Clock rate, law.invention, Microprocessor, law, Embedded system, IBM, Macro, Physical design, business, Design methods, Random logic
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5
المؤلفون: G.V. Kopcsay, Howard H. Smith, Barry J. Rubin, Byron L. Krauter, Alina Deutsch
المصدر: IEEE Transactions on Advanced Packaging. 29:11-20
مصطلحات موضوعية: Interconnection, Engineering, Computational complexity theory, business.industry, Transmission loss, Integrated circuit, Lossy compression, law.invention, Computer Science::Hardware Architecture, law, Transmission line, Hardware_INTEGRATEDCIRCUITS, Electronic engineering, Commutation, Electrical and Electronic Engineering, business, Electronic circuit
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6A Multiconductor Transmission Line Methodology for Global On-Chip Interconnect Modeling and Analysis
المؤلفون: Barry J. Rubin, Howard H. Smith, G.V. Kopcsay, Alina Deutsch, Ibrahim M. Elfadel
المصدر: IEEE Transactions on Advanced Packaging. 27:71-78
مصطلحات موضوعية: Interconnection, Engineering, business.industry, Circuit design, Integrated circuit, computer.software_genre, law.invention, Inductance, Electric power transmission, CMOS, Transmission line, law, Hardware_INTEGRATEDCIRCUITS, Electronic engineering, Computer Aided Design, Electrical and Electronic Engineering, business, computer
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7
المؤلفون: B.J. Rubin, G.V. Kopcsay, Howard H. Smith, David J. Widiger, Alina Deutsch, Byron L. Krauter
المصدر: IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 10:695-711
مصطلحات موضوعية: Very-large-scale integration, Model order reduction, Engineering, business.industry, Equivalent series inductance, Static timing analysis, Integrated circuit, law.invention, Inductance, Electric power transmission, Hardware and Architecture, law, Electronic engineering, Electrical and Electronic Engineering, business, Electrical impedance, Software
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8
المؤلفون: Howard H. Smith, Peter J. Camporese, Brian W. Curran, D. T. Hui, Y.H. Chan, Gregory A. Northrop, J. P. Eckhardt, Lisa Bryant Lacey, R. F. Hatch, Peng Wu
المصدر: IBM Journal of Research and Development. 46:631-644
مصطلحات موضوعية: General Computer Science, Computer science, business.industry, Circuit design, Pipeline (computing), Overhead (engineering), Hardware_PERFORMANCEANDRELIABILITY, Circuit extraction, law.invention, Microarchitecture, Microprocessor, Computer architecture, law, Hardware_INTEGRATEDCIRCUITS, Circuit complexity, Physical design, business, Computer hardware, Hardware_LOGICDESIGN
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9
المؤلفون: Daniel C. Edelstein, Byron L. Krauter, Howard H. Smith, Paul W. Coteus, C.W. Surovic, G.V. Kopcsay, Alina Deutsch, P.L. Restle
المصدر: Proceedings of the IEEE. 89:529-555
مصطلحات موضوعية: Interconnection, Engineering, business.industry, Circuit design, Integrated circuit, Integrated circuit design, Clock skew, computer.software_genre, law.invention, Modeling and simulation, Electric power transmission, law, Hardware_INTEGRATEDCIRCUITS, Electronic engineering, Computer Aided Design, Electrical and Electronic Engineering, business, computer
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10
المؤلفون: Patrick M. Williams, Allan H. Dansky, T. J. McPherson, Timothy G. McNamara, David A. Webber, Dale Eugene Hoffman, Michael Alexander Bowen, Robert M. Averill, Gregory A. Northrop, Howard H. Smith, L. Sigal, S. A. McCabe, M. Mayo, Peter J. Camporese, R. F. Hatch, K. G. Barkley Iii
المصدر: IBM Journal of Research and Development. 43:681-706
مصطلحات موضوعية: Engineering, General Computer Science, business.industry, Embedded system, IBM, business, Chip