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المؤلفون: Hsiang-En Ding, Tzong-Lin Wu, Shih-Hsien Wu, Chung-Yuan Liu
المصدر: IEEE Transactions on Microwave Theory and Techniques. 69:4010-4020
مصطلحات موضوعية: Interconnection, Radiation, Materials science, business.industry, Dielectric, Condensed Matter Physics, Printed circuit board, Planar, Backplane, Extremely high frequency, Optoelectronics, Equivalent circuit, Electrical and Electronic Engineering, business, Quadrature amplitude modulation
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المؤلفون: Tzong-Lin Wu, Chung-Yuan Liu, Hsiang-En Ding, Shih-Hsien Wu
المصدر: IEEE Transactions on Microwave Theory and Techniques. 69:1316-1326
مصطلحات موضوعية: Electromagnetic field, Radiation, Materials science, business.industry, 020206 networking & telecommunications, 02 engineering and technology, Dielectric, Degrees of freedom (mechanics), Condensed Matter Physics, Crosstalk, Planar, 0202 electrical engineering, electronic engineering, information engineering, Optoelectronics, Electrical and Electronic Engineering, Photonics, business, Dielectric waveguides, Photonic crystal
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3
المؤلفون: Chia-Hsin Lee, Wei-Chung Lo, Ou-Hsiang Lee, Yu-Min Lin, Lin Ang-Ying, Sheng-Tsai Wu, Xiao Liu, Te Pei Hsiang, Hsiang-En Ding, Tao-Chih Chang, Chao-Jung Chen, Ren-Shin Cheng, Baron Huang, Wei-Lan Chiu, Jennifer See, Hsiang-Hung Chang, Chang-Chun Lee
المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: Packaging engineering, Computer science, business.industry, Interposer, Three-dimensional integrated circuit, Power integrity, Chip, business, Daisy chain, Wafer-level packaging, Flip chip, Computer hardware
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::7d3d13c4028baa0082c4ffc6e4c0dfb7
https://doi.org/10.1109/ectc32696.2021.00176 -
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المؤلفون: Hsiang-Hung Chang, Ren-Shin Cheng, Jennifer See, Hsiang-En Ding, Wei-Lan Chiu, Lin Ang-Ying, Kuan-Neng Chen, Chao-Jung Chen, Yu-Min Lin, Baron Huang, Chia-Hsin Lee, Ou-Hsiang Lee, Tao-Chih Chang, Xiao Liu, Sheng-Tsai Wu
المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: Wafer-scale integration, Laser ablation, Materials science, business.industry, Molding (process), engineering.material, Laser, law.invention, Coating, law, Transmittance, engineering, Optoelectronics, Wafer, business, Wafer-level packaging
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::5d9cb5864f0802f644f35212e9dcc2a5
https://doi.org/10.1109/ectc32696.2021.00127