المؤلفون: Wei-You Hsu, Shih-Chi Yang, You-Yi Lin, Wan-Zhen Hsieh, King-Ning Tu, Wei-Lan Chiu, Hsiang-Hung Chang, Ching-Yu Chiang, Chih Chen

المصدر: Nanomaterials, Vol 13, Iss 17, p 2448 (2023)

مصطلحات موضوعية: synchrotron radiation, X-ray nanodiffraction, thermal strain distribution, Cu/SiO2 hybrid bonding, nanotwinned Cu, Chemistry, QD1-999

وصف الملف: electronic resource

Relation: https://www.mdpi.com/2079-4991/13/17/2448; https://doaj.org/toc/2079-4991

URL الوصول: https://doaj.org/article/29123c55454c49d8833f2e1aa2e5d138

المؤلفون: Jia-Juen Ong, Wei-Lan Chiu, Ou-Hsiang Lee, Chia-Wen Chiang, Hsiang-Hung Chang, Chin-Hung Wang, Kai-Cheng Shie, Shih-Chi Yang, Dinh-Phuc Tran, King-Ning Tu, Chih Chen

المصدر: Materials, Vol 15, Iss 5, p 1888 (2022)

مصطلحات موضوعية: Cu/SiO2 hybrid bonding, highly (111)-nanotwinned Cu, low temperature bonding, microelectronic packaging, Technology, Electrical engineering. Electronics. Nuclear engineering, TK1-9971, Engineering (General). Civil engineering (General), TA1-2040, Microscopy, QH201-278.5, Descriptive and experimental mechanics, QC120-168.85

وصف الملف: electronic resource

Relation: https://www.mdpi.com/1996-1944/15/5/1888; https://doaj.org/toc/1996-1944

URL الوصول: https://doaj.org/article/277bad7c4c904d249e62bf45845afc01

المؤلفون: Wen-Wei Shen, Yu-Min Lin, Shang-Chun Chen, Hsiang-Hung Chang, Tao-Chih Chang, Wei-Chung Lo, Chien-Chung Lin, Yung-Fa Chou, Ding-Ming Kwai, Ming-Jer Kao, Kuan-Neng Chen

المصدر: IEEE Journal of the Electron Devices Society, Vol 6, Pp 396-402 (2018)

مصطلحات موضوعية: Backside-via-last TSV, three-dimensional heterogeneous integration, Electrical engineering. Electronics. Nuclear engineering, TK1-9971

وصف الملف: electronic resource

Relation: https://ieeexplore.ieee.org/document/8315112/; https://doaj.org/toc/2168-6734

URL الوصول: https://doaj.org/article/1d238410db6a483cb1ab34389244d60e

المؤلفون: Ching-Kuan Lee, Jen-Chun Wang, Yu-Min Lin, Chau-Jie Zhan, Wen-Wei Shen, Huan-Chun Fu, Yuan-Chang Lee, Chia-Wen Chiang, Su-Ching Chung, Su-Mei Chen, Chia-Wen Fan, Hsiang-Hung Chang, Wei-Chung Lo, Yung Jean Lu

المصدر: 2016 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2016 International Conference on. :48-51 Apr, 2016

Relation: 2016 International Conference on Electronics Packaging (ICEP)

المؤلفون: Li-Cheng Shen, Wei-Chung Lo, Hsiang-Hung Chang, Huan-Chun Fu, Yuan-Chang Lee, Shu-Ming Chang, Yu-Chih Chen, Wun-Yan Chen

المصدر: Proceedings Electronic Components and Technology, 2005. ECTC '05. Electronic components and technology Electronic Components and Technology Conference, 2005. Proceedings. 55th. :1039-1043 2005

Relation: 2005 Proceedings. 55th Electronic Components and Technology Conference

المؤلفون: Li-Cheng Shen, Wei-Chung Lo, Hsiang-Hung Chang, Huan-Chun Fu, Yuan-Chang Lee, Yu-Chih Chen, Shu-Ming Chang, Wun-Yan Chen, Ming-Chieh Chou

المصدر: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) Electronics packaging technology Electronics Packaging Technology Conference, 2004. EPTC 2004. Proceedings of 6th. :753-758 2004

Relation: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004)

المؤلفون: Chen, Erh-Hao, Tzu-Chien Hsu, Cha-Hsin Lin, Tzeng, Pei-jer, Chung-Chih Wang, Shang-Chun Chen, Chen, Jui-Chin, Chien-Chou Chen, Hsin, Yu-Chen, Po-Chih Chang, Yiu-Hsiang Chang, Shin-Chiang Chen, Yu-Ming Lin, Sue-Chen Liao, Cheng-Ta Ko, Chau-Jie Zhan, Hsiang-Hung Chang, Chun-Hsien Chien, Yung-Fa Chou, Ding-Ming Kwai, Wei-Chung Lo, Tzu-Kun Ku, Ming-Jer Kao

المصدر: Proceedings of Technical Program - 2014 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA) VLSI Technology, Systems and Application (VLSI-TSA), Proceedings of Technical Program - 2014 International Symposium on. :1-2 Apr, 2014

Relation: 2014 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA)

المؤلفون: Tzu-Ying Kuo, Ying-Ching Shih, Yuan-Chang Lee, Hsiang-Hung Chang, Zhi-Cheng Hsiao, Chia-Wen Chiang, Shu-Man Li, Yu-Jiau Hwang, Cheng-Ta Ko, Yu-Hua Chen

المصدر: 2009 59th Electronic Components and Technology Conference Electronic Components and Technology Conference, 2009. ECTC 2009. 59th. :1749-1753 May, 2009

Relation: 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009)

المؤلفون: Hsiang-Hung Chang, Wei-Chung Lo, Li-Cheng Shen, Huan-Chun Fu, Yuan-Chang Lee, Shu-Ming Chang

المصدر: 2006 International Microsystems, Package, Assembly Conference Taiwan Microsystems, Packaging, Assembly Conference Taiwan, 2006. IMPACT 2006. International. :1-4 Oct, 2006

Relation: 2006 International Microsystems, Package, Assembly Conference Taiwan

المؤلفون: Pei-Jer Tzeng, Yu-Chen Hsin, Jui-Chin Chen, Shang-Chun Chen, Chien-Ying Wu, Wen-Li Tsai, Chung-Chih Wang, Chi-Hon Ho, Chien-Chou Chen, Yi-Feng Hsu, Shang-Hung Shen, Sue-Chen Liao, Chun-Hsien Chien, Hsiang-Hung Chang, Cha-Hsin Lin, Tzu-Kun Ku, Ming-Jer Kao

المصدر: Proceedings of Technical Program of 2012 VLSI Technology, System and Application VLSI Technology, Systems, and Applications (VLSI-TSA), 2012 International Symposium on. :1-2 Apr, 2012

Relation: 2012 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA)