المؤلفون: Hsu, Jimmy, Lin, Lemon, Ho, Brian, Hsiao, Neo, Chen, Denis, Su, Thonas, Zhang, Xinjun

المصدر: 2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2021 16th International. :119-122 Dec, 2021

Relation: 2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)