المؤلفون: Kuo, C. -H., Hsiao, Y. -C., Jhang, C. -Y., Chen, Y. -D., Tung, S.

المصدر: Sci. Rep. 14, 18524 (2024)

مصطلحات موضوعية: Physics - Atomic Physics, Quantum Physics

URL الوصول: http://arxiv.org/abs/2309.11809

المؤلفون: Kuo, C.-H.^{Aff1, Aff2}, Hsiao, Y.-C.^{Aff1, Aff2}, Jhang, C.-Y.^{Aff1, Aff2}, Chen, Y.-D.^{Aff1, Aff2}, Tung, S.^{Aff1, Aff2, IDs41598024691660_cor5}

المصدر: Scientific Reports. 14(1)

المؤلفون: Hong, Y.-W.P., Cheng, R.-H., Hsiao, Y.-C., Sheu, J.-P.

المصدر: IEEE Transactions on Green Communications and Networking IEEE Trans. on Green Commun. Netw. Green Communications and Networking, IEEE Transactions on. 4(4):1106-1119 Dec, 2020

المؤلفون: Chen, C-Y., Pai, H., Chen, H-M., Yougbaré, S., Husain, S., Hsiao, Y-C., Lin, L-Y.

المصدر: In Materials Today Sustainability December 2023 24

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Alternate Title: El volumen tidal intermedio es una opción aceptable para pacientes ventilados con síndrome de dificultad respiratoria aguda (Spanish; Castilian)

المؤلفون: Wu, S.-H., Kor, C.-T., Li, C.-Y., Hsiao, Y.-C.

المصدر: In Medicina Intensiva (English Edition) November 2022 46(11):609-618

المؤلفون: Hsiao, Y.-C., Meng, C. C., Yang, C.

المصدر: IEEE Transactions on Microwave Theory and Techniques IEEE Trans. Microwave Theory Techn. Microwave Theory and Techniques, IEEE Transactions on. 64(2):519-532 Feb, 2016

المؤلفون: Hsiao, Y.-C., Meng, C., Wei, H.-J., Wang, T.-W., Huang, G.-W., Chang, M.-C.F.

المصدر: 2013 IEEE Radio Frequency Integrated Circuits Symposium (RFIC) Radio Frequency Integrated Circuits Symposium (RFIC), 2013 IEEE. :415-418 Jun, 2013

Relation: 2013 IEEE Radio Frequency Integrated Circuits Symposium (RFIC)

المؤلفون: Young, C.-M., Chu, N.-Y., Chen, L.-R., Hsiao, Y.-C., Li, C.-Z.

المصدر: IEEE Transactions on Industrial Electronics IEEE Trans. Ind. Electron. Industrial Electronics, IEEE Transactions on. 60(5):1972-1978 May, 2013

المؤلفون: Lu, S.-K., Yang, C.-L., Hsiao, Y.-C., Wu, C.-W.

المصدر: IEEE Transactions on Very Large Scale Integration (VLSI) Systems IEEE Trans. VLSI Syst. Very Large Scale Integration (VLSI) Systems, IEEE Transactions on. 18(2):184-193 Feb, 2010