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1دورية أكاديمية
المصدر: IEEE Electron Device Letters IEEE Electron Device Lett. Electron Device Letters, IEEE. 45(6):956-959 Jun, 2024
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2دورية أكاديمية
المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 71(5):3383-3389 May, 2024
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3
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4دورية أكاديمية
المؤلفون: Wang, S.‑H.Aff1, Aff2, Lee, C.-Y.Aff3, Aff4, Hsieh, W.-C., Yen, J.-B., Tseng, I.-M., Wong, C.-H.Aff8, IDs10029024030553_cor6, Ho, D.-R.Aff2, Aff9, Aff10, IDs10029024030553_cor7
المصدر: Hernia: The World Journal of Hernia and Abdominal Wall Surgery. 28(4):1365-1372
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5دورية أكاديمية
المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 70(6):3166-3171 Jun, 2023
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6دورية أكاديمية
المؤلفون: Hsieh, W., Ku, C.C., Hwang, H.P., Tsai, M., Chen, Z.
المصدر: IEEE Journal of Translational Engineering in Health and Medicine IEEE J. Transl. Eng. Health Med. Translational Engineering in Health and Medicine, IEEE Journal of. 11:375-383 2023
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7دورية أكاديمية
المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 69(7):3611-3616 Jul, 2022
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8دورية أكاديمية
المصدر: IEEE Electron Device Letters IEEE Electron Device Lett. Electron Device Letters, IEEE. 43(5):682-685 May, 2022
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9مؤتمر
المؤلفون: Su, Frank, Hsieh, W. F., Lin, Henry, Chen, Vincent, Lou, Y. S.
المصدر: 2021 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2021 IEEE International Symposium on the. :1-4 Sep, 2021
Relation: 2021 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
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