المؤلفون: Wu, P., Su, J., Chung, Y., Hong, L., Ren, J., Chang, F., Wu, Y., Chen, H., Lin, C., Hsiao, H., Li, S., Sheu, S., Chang, S., Lo, W., Wu, C., Lo, C., Liu, R., Hsieh, C., Tang, K., Chang, M.

المصدر: IEEE Journal of Solid-State Circuits IEEE J. Solid-State Circuits Solid-State Circuits, IEEE Journal of. 59(7):2297-2309 Jul, 2024

المؤلفون: Tsai, C., Hsu, C., Chen, C., Hung, Y., Hsieh, C.

المصدر: IEEE Transactions on Power Electronics IEEE Trans. Power Electron. Power Electronics, IEEE Transactions on. 39(6):7238-7251 Jun, 2024

المؤلفون: Lin, W., Lo, C., Cheng, M., Zeng, R., Hsieh, Y., Hou, P., Yeh, C., Hsieh, C., Chang, M., Liao, C.

المصدر: IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 24(7):11515-11526 Apr, 2024

المؤلفون: Su, J., Lu, P., Wu, P., Chou, Y., Liu, T., Chung, Y., Hung, L., Ren, J., Huang, W., Chien, C., Mei, P., Li, S., Sheu, S., Lo, W., Chang, S., Hong, H., Lo, C., Liu, R., Hsieh, C., Tang, K., Chang, M.

المصدر: IEEE Transactions on Circuits and Systems II: Express Briefs IEEE Trans. Circuits Syst. II Circuits and Systems II: Express Briefs, IEEE Transactions on. 71(4):2304-2308 Apr, 2024

المؤلفون: Hsieh, C., Tsai, H., Lu, Y., Li, J.C.

المصدر: IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst. Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on. 43(3):826-839 Mar, 2024

المؤلفون: Shen, L., Hsieh, C., Hsiao, A., Feng, K.

المصدر: IEEE Internet of Things Journal IEEE Internet Things J. Internet of Things Journal, IEEE. 11(3):5491-5510 Feb, 2024

المؤلفون: Yu, X.-R., Hsieh, C.-C., Chuang, M.-H., Chiu, M.-Y., Sun, T.-C., Geng, W.-Z., Chang, W.-H., Shih, Y.-J., Lu, W.-H., Chang, W.-C., Lin, Y.-C., Pai, Y.-C., Lai, C.-Y., Dei, Y., Yang, C.-Y., Lu, H.-Y., Lin, N.-C., Wu, C.-T., Kao, K.-H., Ma, W. C.-Y., Lu, D. D., Lee, Y.-J., Luo, G.-L., Chiang, M.-H., Maeda, T., Wu, W.-F., Li, Y.-M., Hou, T.-H.

المصدر: 2023 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2023 International. :1-4 Dec, 2023

Relation: 2023 International Electron Devices Meeting (IEDM)

المؤلفون: Lin, C., Hsieh, C., Lin, J.

المصدر: IEEE Transactions on Geoscience and Remote Sensing IEEE Trans. Geosci. Remote Sensing Geoscience and Remote Sensing, IEEE Transactions on. 62:1-18 2024

المؤلفون: Lin, C., Hsu, C., Young, S., Hsieh, C., Tai, S.

المصدر: IEEE Transactions on Geoscience and Remote Sensing IEEE Trans. Geosci. Remote Sensing Geoscience and Remote Sensing, IEEE Transactions on. 62:1-15 2024

المؤلفون: Hsieh, C., Hou, P., Hsieh, Y., Lin, W., Liao, C.

المصدر: IEEE Sensors Letters IEEE Sens. Lett. Sensors Letters, IEEE. 7(12):1-4 Dec, 2023