يعرض 1 - 10 نتائج من 1,996 نتيجة بحث عن '"Hsu, B"', وقت الاستعلام: 1.14s تنقيح النتائج
  1. 1
    دورية أكاديمية

    المصدر: IEEE Transactions on Computational Social Systems IEEE Trans. Comput. Soc. Syst. Computational Social Systems, IEEE Transactions on. 11(1):756-769 Feb, 2024

  2. 2
    دورية أكاديمية

    المؤلفون: Hsu, B., Yeh, L., Chang, M., Shen, C.

    المصدر: IEEE Transactions on Knowledge and Data Engineering IEEE Trans. Knowl. Data Eng. Knowledge and Data Engineering, IEEE Transactions on. 35(8):8672-8686 Aug, 2023

  3. 3
    دورية أكاديمية

    المصدر: IEEE Internet of Things Journal IEEE Internet Things J. Internet of Things Journal, IEEE. 9(12):9379-9388 Jun, 2022

  4. 4
    مؤتمر

    المصدر: 2021 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2021 IEEE International. :1-5 Mar, 2021

    Relation: 2021 IEEE International Reliability Physics Symposium (IRPS)

  5. 5
    مؤتمر

    المصدر: 2020 IEEE 15th International Conference on Solid-State & Integrated Circuit Technology (ICSICT) Solid-State & Integrated Circuit Technology (ICSICT, 2020 IEEE 15th International Conference on. :1-4 Nov, 2020

    Relation: 2020 IEEE 15th International Conference on Solid-State & Integrated Circuit Technology (ICSICT)

  6. 6
    دورية أكاديمية

    المؤلفون: Hsu, B., Shen, C., Yan, X.

    المصدر: IEEE Transactions on Knowledge and Data Engineering IEEE Trans. Knowl. Data Eng. Knowledge and Data Engineering, IEEE Transactions on. 33(5):2121-2136 May, 2021

  7. 7
    دورية أكاديمية
  8. 8
    دورية أكاديمية

    المؤلفون: Hsu, B., Velazquez, J.

    المصدر: IEEE Power Electronics Magazine IEEE Power Electron. Mag. Power Electronics Magazine, IEEE. 7(1):28-34 Mar, 2020

  9. 9
  10. 10
    مؤتمر

    المؤلفون: Chen, D., Su, T., Hsu, J., Li, Y.L., Hsu, B.

    المصدر: 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2018 13th International. :282-284 Oct, 2018

    Relation: 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)