يعرض 1 - 10 نتائج من 136 نتيجة بحث عن '"Hsu, Jimmy"', وقت الاستعلام: 0.81s تنقيح النتائج
  1. 1
    مؤتمر
    Enhanced System Level Channel Characterization Methodology with Seamless Correlation among Hardware, Signal Integrity and Electrical Validation for Design Robustness

    المؤلفون: Hsu, Jimmy, Wu, Kuan-Ting, Ho, Brian, Lin, Lemon, Chen, Betty, Su, Thonas, Wu, Steven, Hung, Gary, Tseng, Jim

    المصدر: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2022 17th International. :1-4 Oct, 2022

    Relation: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

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  2. 2
    مؤتمر
    An Innovative Customized PCB Surface Printing for Performance Enhancement

    المؤلفون: Hsu, Jimmy, Chang, Ryan, Ye, Xiaoning, Su, Thonas, Liu, Zoe

    المصدر: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2022 17th International. :1-4 Oct, 2022

    Relation: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

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  3. 3
    مؤتمر
    Board Design Architecture and optimization for High-power 48V Voltage Regulator

    المؤلفون: Qin, Shijuan, Chang, Patt, Lee, Falconee, Su, Thonas, Chen, Denis, Guo, Ariel, Yuan, Weijie, Cao, Mark, Chang, Aje, Fan, Donald, Li, Yl, Hsu, Jimmy, Liang, Kevin, Tsai, Bryant, Tzeng, Kate

    المصدر: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2022 17th International. :1-4 Oct, 2022

    Relation: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

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  4. 4
    مؤتمر
    DDR Debug Methodology for Board Design Quality and System Robustness

    المؤلفون: Su, Thonas, Liu, Zoe, Hsu, Jimmy, Chen, Denis, Chen, Paul

    المصدر: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2022 17th International. :1-4 Oct, 2022

    Relation: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

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  5. 5
    مؤتمر
    PCIe-Express Channel Design Optimization for Out-of-Guideline Three Connector Topology

    المؤلفون: Teng, Timo, Wang, Mark, Hsu, Jimmy, Lee, Wayne, Su, Thonas, Kan, Jenny, Chen, Betty

    المصدر: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2022 17th International. :1-4 Oct, 2022

    Relation: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

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  6. 6
    مؤتمر
    Fast End-to-end Channel Electrical Characterization Methodology for Design and Manufacture Quality Check

    المؤلفون: Hsu, Jimmy, Lee, Leo, Hsiao, Eric, Yang, Joseph, Wu, Dian-Ying, Wu, Jay, Wu, Dong-Han, Yang, Tina, Chen, Denis

    المصدر: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2022 17th International. :1-4 Oct, 2022

    Relation: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

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  7. 7
    مؤتمر
    Printed Circuit Board (PCB) Routing optimization with an Innovative Edge Connector for PCI-Express 5.0 and Beyond

    المؤلفون: Ju, Huafang, Li, Xiang, Hsu, Jimmy, Li, Shaohua, Su, Thonas, Liu, Mo, Xiao, Kai

    المصدر: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2022 17th International. :1-4 Oct, 2022

    Relation: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

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  8. 8
    مؤتمر
    High-speed Data Center PCB Design Challenges and Findings by Intel ® Automatic In-board Characterization

    المؤلفون: Hsu, Jimmy, Hung, Gary, Tseng, Jim, Ho, Brian, Lin, Lemon, Su, Thonas

    المصدر: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2022 17th International. :1-4 Oct, 2022

    Relation: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

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  9. 9
    مؤتمر
    Insertion Loss Reduction Using Rounded Corners to Mitigate Surface Roughness Effect in PCB Transmission Lines

    المؤلفون: Guo, Yuandong, Kim, DongHyun, Liu, Yuanzhuo, Ye, Xiaoning, Hsu, Jimmy, Fan, Jun

    المصدر: 2022 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC) Electromagnetic Compatibility (APEMC), 2022 Asia-Pacific International Symposium on. :735-738 Sep, 2022

    Relation: 2022 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC)

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  10. 10
    مؤتمر
    Board Level Probe-on-Pin Power Delivery Network Characterization

    المؤلفون: Chang, Patt, Li, Y.L., Hsu, Jimmy, Cheng, Yang Hung, Chen, Chien Hsun, Wei, Hao, Lee, Falconee, Qin, Shijuan, Liang, Kevin, Tzeng, Kate

    المصدر: 2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), 2022 IEEE International Symposium on. :542-545 Aug, 2022

    Relation: 2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)

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