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1مؤتمر
المؤلفون: Hsu, Yu-Wen, Chen, Chun-Ching
المصدر: 2021 IEEE International Conference on Consumer Electronics-Taiwan (ICCE-TW) Consumer Electronics-Taiwan (ICCE-TW), 2021 IEEE International Conference on. :1-2 Sep, 2021
Relation: 2021 IEEE International Conference on Consumer Electronics-Taiwan (ICCE-TW)
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2مؤتمر
المؤلفون: Hsu, Yu-Wen, Chen, Chun-Ching
المصدر: 2021 IEEE International Conference on Consumer Electronics-Taiwan (ICCE-TW) Consumer Electronics-Taiwan (ICCE-TW), 2021 IEEE International Conference on. :1-2 Sep, 2021
Relation: 2021 IEEE International Conference on Consumer Electronics-Taiwan (ICCE-TW)
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3دورية أكاديمية
المؤلفون: Hsu, Yu-Wen, Wong, Henry Sung-Ching, Huang, Wan-ChenAff3, Aff4, Yeh, Yi-Hung, Hsiao, Chwan-Deng, Chang, Wei-ChiaoAff2, Aff6, Aff7, IDs12929022008221_cor6, Hsieh, Shie-LiangAff8, Aff9, Aff10, Aff11, IDs12929022008221_cor7
المصدر: Journal of Biomedical Science. 29(1)
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4مؤتمر
المؤلفون: Chiu, Sheng-Ren, Sue, Chung-Yang, Lin, Chih-Hsiou, Lin, Shih-Ting, Lin, Shih-Chieh, Hsu, Yu-Wen, Su, Yan-Kuin
المصدر: 2012 IEEE Sensors Sensors, 2012 IEEE. :1-4 Oct, 2012
Relation: 2012 IEEE Sensors
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5مؤتمر
المؤلفون: Chiu, Sheng-Ren, Sue, Chung-Yang, Lin, Chih-Hsiou, Teng, Li-Tao, Liao, Lu-Pu, Hsu, Yu-Wen, Su, Yan-Kuin
المصدر: 2012 IEEE Sensors Sensors, 2012 IEEE. :1-4 Oct, 2012
Relation: 2012 IEEE Sensors
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6مؤتمر
المؤلفون: Chiu, Sheng-Ren, Sue, Chung-Yang, Lin, Shih-Ting, Lin, Shih-Chieh, Hsu, Yu-Wen, Su, Yan-Kuin
المصدر: 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2011 6th International. :319-322 Oct, 2011
Relation: 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
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7مؤتمر
المؤلفون: Chiu, Sheng-Ren, Sue, Chung-Yang, Liao, Lu-Pu, Teng, Li-Tao, Hsu, Yu-Wen, Su, Yan-Kuin
المصدر: 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2011 6th International. :315-318 Oct, 2011
Relation: 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
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8مؤتمر
المؤلفون: Sun, Hongzhi, Jia, Kemiao, Liu, Xuesong, Yan, Guizhen, Hsu, Yu-Wen, Xie, Huikai
المصدر: 2010 IEEE Sensors Sensors, 2010 IEEE. :1029-1032 Nov, 2010
Relation: 2010 IEEE Sensors
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9مؤتمر
المؤلفون: Chiu, Sheng-Ren, Chen, Jen-Yi, Teng, Li-Tao, Sue, Chung-Yang, Lin, Shih-Ting, Hsu, Yu-Wen, Su, Yan-Kuin
المصدر: 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International. :1-4 Oct, 2010
Relation: 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
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10مؤتمر
المؤلفون: Chiu, Sheng-Ren, Chen, Jen-Yi, Lin, Shih-Chieh, Teng, Li-Tao, Lin, Shih-Ting, Shiau, Jieh-Ling, Hsu, Yu-Wen, Su, Yan-Kuin
المصدر: 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International. :1-4 Oct, 2010
Relation: 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
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