يعرض 1 - 6 نتائج من 6 نتيجة بحث عن '"Hsu Shao-En"', وقت الاستعلام: 1.09s تنقيح النتائج
  1. 1
    مؤتمر
    Enhanced Heterogeneous mmWave AiP Design with Machine Learning

    المؤلفون: Lin, Po-An, Hsu, Shao-En, Lai, Yan-Chen, Chang, Wei-Tung, Tseng, Chu-Tsung, Lu, Shih-Wen

    المصدر: 2023 Asia-Pacific Microwave Conference (APMC) Microwave Conference (APMC), 2023 Asia-Pacific. :694-697 Dec, 2023

    Relation: 2023 Asia-Pacific Microwave Conference (APMC)

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  2. 2
    مؤتمر
    A Substrate Integrated Waveguide-Fed Slot Antenna for 5G-NR Applications

    المؤلفون: Wang, Yen-Ting, Chen, Guan-Wei, Hsu, Shao-En, Lin, Po-An, Cho, Huei-Shyong, Lu, Shih-Wen

    المصدر: 2023 Asia-Pacific Microwave Conference (APMC) Microwave Conference (APMC), 2023 Asia-Pacific. :679-681 Dec, 2023

    Relation: 2023 Asia-Pacific Microwave Conference (APMC)

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  3. 3
    مؤتمر
    An Angular-Stable FSS Unit Cell Design Using PNN Model and Genetic Algorithm

    المؤلفون: Chen, Guan-Wei, Cho, Huei-Shyong, Lai, Yan-Chen, Tseng, Chu-Tsung, Hsu, Shao-En, Lu, Shih-Wen

    المصدر: 2023 Asia-Pacific Microwave Conference (APMC) Microwave Conference (APMC), 2023 Asia-Pacific. :727-729 Dec, 2023

    Relation: 2023 Asia-Pacific Microwave Conference (APMC)

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  4. 4
    مؤتمر
    Heterogeneous Substrate and its Characterization for 5G mmWave Antenna in Package

    المؤلفون: Chang, Wei-Tung, Hsu, Shao-En, Kao, Jen Chieh, Cho, Huei-Shyong, Lu, Shihwen, Yeh, Ye, Chang, Harrison

    المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :1713-1720 Jun, 2021

    Relation: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

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  5. 5
    دورية أكاديمية

    لا يتم عرض هذه النتيجة على الضيوف.

    View this record from ISI Web of Science
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  6. 6
    Heterogeneous Substrate and its Characterization for 5G mmWave Antenna in Package

    المؤلفون: Wei-Tung Chang, Shihwen Lu, Harrison Chang, Huei-Shyong Cho, Jen Chieh Kao, Hsu Shao-En, Ye Yeh

    المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC).

    مصطلحات موضوعية: Materials science, Manufacturing process, ComputerSystemsOrganization_COMPUTER-COMMUNICATIONNETWORKS, Data_CODINGANDINFORMATIONTHEORY, Substrate (printing), Characterization (materials science), Reliability (semiconductor), ComputerApplications_MISCELLANEOUS, visual_art, Electronic component, Hardware_INTEGRATEDCIRCUITS, Electronic engineering, visual_art.visual_art_medium, Radio frequency, Antenna (radio), 5G

    URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::1708a432878c78c7d48e163861e29ea3
    https://doi.org/10.1109/ectc32696.2021.00271

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