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المؤلفون: W. H. Lin, Yi-Li Hsiao, Doug C. H. Yu, S. T. Hsiao, Hsu-Hsien Chen, T. L. Shao, C. H. Tung, Chung-Jung Wu
المصدر: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: 010302 applied physics, Interconnection, Materials science, business.industry, Stacking, chemistry.chemical_element, 02 engineering and technology, 021001 nanoscience & nanotechnology, 01 natural sciences, Copper, chemistry, Chemical bond, 0103 physical sciences, Electronic engineering, Optoelectronics, Bumping, Wafer, Adhesive, 0210 nano-technology, business, Flip chip
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::796dd1c16fe3a5148fccd18282725d4f
https://doi.org/10.1109/ectc.2017.22 -
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المؤلفون: Victor C. Y. Chang, C. S. Liu, Jeng-Shien Hsieh, Feng Wei Kuo, Doug C. H. Yu, Hao-Yi Tsai, En-Hsiang Yeh, Chih-Hua Chen, Chewn-Pu Jou, Ron Chen, Ying-Ta Lu, Hsu-Hsien Chen, Chuei-Tang Wang
المصدر: 3DIC
مصطلحات موضوعية: Voltage-controlled oscillator, Engineering, CMOS, business.industry, Q factor, Noise reduction, Electrical engineering, Electronic engineering, Fan-out, Wafer, business, Inductor, Wafer-level packaging
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::e9662d9d155b6ef1cb8e138ba1ce90f0
https://doi.org/10.1109/3dic.2015.7334573 -
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المؤلفون: H.Y. Lo, W. S. Liao, T.J. Wu, C. H. Fan, S.P. Jeng, Chen Tzu-Chiang, Cheng-Hsiang Hsieh, Doug C. H. Yu, W.M. Wu, C.C. Chiu, Chung-Shi Chiang, S.L. Chiu, Hsu-Hsien Chen, Shang-Yun Hou, L.C. Huang, W. C. Chiou
المصدر: 2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers.
مصطلحات موضوعية: Substrate (building), Materials science, business.industry, Chip-scale package, Ball grid array, Interposer, Electronic engineering, Optoelectronics, Three-dimensional integrated circuit, Wafer, Temperature cycling, business, Chip
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::ff8df8c63a819c1b8d7c33a942d02433
https://doi.org/10.1109/vlsit.2014.6894398 -
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المؤلفون: Chung-Shi Liu, En-Hsiang Yeh, Monsen Liu, Jeng-Shien Hsieh, Ching-Wen Hsiao, Chuei-Tang Wang, Chung-Hao Tsai, Doug C. H. Yu, Chen-Shien Chen, Hsu-Hsien Chen, Mirng-Ji Lii
المصدر: 2013 IEEE International Electron Devices Meeting.
مصطلحات موضوعية: Engineering, Coaxial antenna, business.industry, Antenna measurement, Electrical engineering, Antenna factor, law.invention, Antenna array, Microstrip antenna, law, Dipole antenna, Antenna (radio), business, Monopole antenna
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::f24c7397624ab8f65cd58e6369ec3cc9
https://doi.org/10.1109/iedm.2013.6724687