المؤلفون: Huang, H.-C., Liu, F.-B., Hu, C.-K., Hu, C.-F.^{Aff4, IDs40899024011017_cor4}

المصدر: Sustainable Water Resources Management. 10(3)

المؤلفون: Nguyen, Son Van, Shobha, H., Haigh, T., Chen, J., Lee, J., Nogami, T., Liniger, E., Cohen, S., Hu, C. K., Huang, H., Yao, Y., Canaperi, D., Peethala, B., Standaert, T., Bonilla, G.

المصدر: 2020 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA) VLSI Technology, Systems and Applications (VLSI-TSA), 2020 International Symposium on. :117-118 Aug, 2020

Relation: 2020 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA)

المؤلفون: Penny, C., Gates, S., Peethala, B., Lee, J., Priyadarshini, D., Nguyen, S., McLaughlin, P., Liniger, E., Hu, C.-K., Clevenger, L., Hook, T., Shobha, H., Kerber, P., Seshadri, I., Chen, J., Edelstein, D., Quon, R., Bonilla, G., Paruchuri, V., Huang, E.

المصدر: 2017 IEEE International Interconnect Technology Conference (IITC) Interconnect Technology Conference (IITC), 2017 IEEE International. :1-4 May, 2017

Relation: 2017 IEEE International Interconnect Technology Conference (IITC)

المؤلفون: Motoyama, K., van der Straten, O., Maniscalco, J., Huang, H., Kim, YB., Choi, JK., Lee, JH., Hu, C.-K., McLaughlin, P., Standaert, T., Quon, R., Bonilla, G.

المصدر: 2018 IEEE International Interconnect Technology Conference (IITC) Interconnect Technology Conference (IITC), 2018 IEEE International. :40-42 Jun, 2018

Relation: 2018 IEEE International Interconnect Technology Conference (IITC)

المؤلفون: Chen, Q., McKeon, B.S., Becker, J., Zhang, S., Hu, C.-K., Gfroerer, T.H., Wanlass, M.W., Zhang, Y.-H., Smith, D.J., Zhang, Y.

المصدر: 2018 IEEE 7th World Conference on Photovoltaic Energy Conversion (WCPEC) (A Joint Conference of 45th IEEE PVSC, 28th PVSEC & 34th EU PVSEC) Photovoltaic Energy Conversion (WCPEC), 2018 IEEE 7th World Conference on. :3234-3236 Jun, 2018

Relation: 2018 IEEE 7th World Conference on Photovoltaic Energy Conversion (WCPEC) (A Joint Conference of 45th IEEE PVSC, 28th PVSEC & 34th EU PVSEC)

المؤلفون: Bonilla, Griselda, Lanzillo, N., Hu, C.-K., Penny, C.J., Kumar, A.

المصدر: 2020 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2020 IEEE International. :20.4.1-20.4.4 Dec, 2020

Relation: 2020 IEEE International Electron Devices Meeting (IEDM)

المؤلفون: Hu, C.-K., Kelly, J., Chen, J. H-C, Huang, H., Ostrovski, Y., Patlolla, R., Peethala, B., Adusumilli, P., Spooner, T., Gignac, L. M., Bruley, J., Breslin, C., Cohen, S. A., Lian, G., Ali, M., Long, R., Hornicek, G., Kane, T., Kamineni, V., Zhang, X., Mont, F., Siddiqui, S.

المصدر: 2017 IEEE International Interconnect Technology Conference (IITC) Interconnect Technology Conference (IITC), 2017 IEEE International. :1-3 May, 2017

Relation: 2017 IEEE International Interconnect Technology Conference (IITC)

المؤلفون: Nogami, Takeshi, Huang, H., Shobha, H., Patlolla, R., Kelly, J., Penny, C., Hu, C.-K., Sil, D., DeVries, S., Lee, J., Nguyen, S., Jiang, L., Demarest, J., Li, J., Lian, G., Ali, M., Bhosale, P., Lanzillo, N., Motoyama, K., Lian, S., Standaert, T., Bonilla, G., Edelstein, D., Haran, B.

المصدر: 2019 Symposium on VLSI Technology VLSI Technology, 2019 Symposium on. :T18-T19 Jun, 2019

Relation: 2019 Symposium on VLSI Technology

المؤلفون: Kelly, J., Chen, J. H.-C., Huang, H., Hu, C. K., Liniger, E., Patlolla, R., Peethala, B., Adusumilli, P., Shobha, H., Nogami, T., Spooner, T., Huang, E., Edelstein, D., Canaperi, D., Kamineni, V., Mont, F., Siddiqui, S.

المصدر: 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC), 2016 IEEE International. :40-42 May, 2016

Relation: 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC)

المؤلفون: Nogami, T., Chae, M., Penny, C., Shaw, T., Shobha, H., Li, J., Cohen, S., Hu, C-K., Zhang, X., He, M., Tanwar, K., Patlolla, R., Chen, S-T., Kelly, J., Lin, X., Straten, O., Simon, A., Motoyama, K., Bonilla, G., Huang, E., Spooner, T., Edelstein, D.

المصدر: IEEE International Interconnect Technology Conference Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC), 2014 IEEE International. :223-226 May, 2014

Relation: 2014 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC)