المؤلفون: Zhang, XiaWen, Qiu, Zhao, Huang, Ping, Hu, JianZheng, Luo, JingYu

المصدر: 2018 International Conference on Cyber-Enabled Distributed Computing and Knowledge Discovery (CyberC) CYBERC Cyber-Enabled Distributed Computing and Knowledge Discovery (CyberC), 2018 International Conference on. :138-1383 Oct, 2018

Relation: 2018 International Conference on Cyber-Enabled Distributed Computing and Knowledge Discovery (CyberC)

المؤلفون: Luo, JingYu, Qiu, Zhao, Xie, GengQuan, Feng, Jun, Hu, JianZheng, Zhang, XiaWen

المصدر: 2018 International Conference on Cyber-Enabled Distributed Computing and Knowledge Discovery (CyberC) CYBERC Cyber-Enabled Distributed Computing and Knowledge Discovery (CyberC), 2018 International Conference on. :180-1803 Oct, 2018

Relation: 2018 International Conference on Cyber-Enabled Distributed Computing and Knowledge Discovery (CyberC)

المؤلفون: Hu, JianZheng, Li, CaiMao, Qiu, Zhao, Huang, Ping, Xie, GengQuan

المصدر: 2018 International Conference on Cyber-Enabled Distributed Computing and Knowledge Discovery (CyberC) CYBERC Cyber-Enabled Distributed Computing and Knowledge Discovery (CyberC), 2018 International Conference on. :174-1745 Oct, 2018

Relation: 2018 International Conference on Cyber-Enabled Distributed Computing and Knowledge Discovery (CyberC)

المؤلفون: Hu, Jianzheng, Yan, Long, Zhou, Ning, Chen, Yao, Yang, Xiaoni, Yang, Lianqiao, Guo, Shiping

المصدر: In Journal of Crystal Growth 15 January 2024 626

المؤلفون: Luo, Changfan, Xu, Yiping, Shao, Yongkang, Wang, Zihan, Hu, Jianzheng, Yuan, Jiawei, Liu, Yuchen, Duan, Meiyu, Huang, Lan, Zhou, Fengfeng

المصدر: In Information Sciences June 2023 629:109-122

المؤلفون: Yang, Lianqiao, Hu, Jianzheng, Zhang, Jianhua

المصدر: 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on. :1-3 Aug, 2011

Relation: 2011 12th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

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المؤلفون: Qiu, Zhao^Aff12, Lei, ShiYao^Aff12, Hu, JianZheng^Aff12, Luo, JingYu^Aff12

المساهمون: Barbosa, Simone Diniz Junqueira, Series editor^Aff1, Chen, Phoebe, Series editor^Aff2, Filipe, Joaquim, Series editor^Aff3, Kotenko, Igor, Series editor^Aff4, Sivalingam, Krishna M., Series editor^Aff5, Washio, Takashi, Series editor^Aff6, Yuan, Junsong, Series editor^Aff7, Zhou, Lizhu, Series editor^Aff8, Chen, Guoliang, editor^Aff9, Shen, Hong, editor^Aff10, Chen, Mingrui, editor^Aff11

المصدر: Parallel Architecture, Algorithm and Programming : 8th International Symposium, PAAP 2017, Haikou, China, June 17–18, 2017, Proceedings. 729:464-470

المؤلفون: Luo, JingYu^Aff12, Qiu, Zhao^Aff12, Hu, JianZheng^Aff12, Zhang, XiaWen^Aff12

المساهمون: Barbosa, Simone Diniz Junqueira, Series editor^Aff1, Chen, Phoebe, Series editor^Aff2, Filipe, Joaquim, Series editor^Aff3, Kotenko, Igor, Series editor^Aff4, Sivalingam, Krishna M., Series editor^Aff5, Washio, Takashi, Series editor^Aff6, Yuan, Junsong, Series editor^Aff7, Zhou, Lizhu, Series editor^Aff8, Chen, Guoliang, editor^Aff9, Shen, Hong, editor^Aff10, Chen, Mingrui, editor^Aff11

المصدر: Parallel Architecture, Algorithm and Programming : 8th International Symposium, PAAP 2017, Haikou, China, June 17–18, 2017, Proceedings. 729:393-399

المؤلفون: Hu, Jianzheng, Yang, Lianqiao, Whan Shin, Moo

المصدر: In Microelectronics Journal February 2007 38(2):157-163