يعرض 1 - 10 نتائج من 92 نتيجة بحث عن '"Huang, Jia-qiang"', وقت الاستعلام: 0.93s تنقيح النتائج
  1. 1
    كتاب إلكتروني
    The Way and Application of Fracture Pre-stack Prediction of Carbonate Rock Based on Azimuthal and Anistropic Travelling Time in Carbonate Rock Fractured Reservoir

    المؤلفون: Liu, Jun-yingAff3, Guo, Zhen-huaAff3, Liu, Xiao-huaAff3, Zhang, LinAff3, Huang, Jia-qiangAff3, Yang, Rong-junAff3

    المساهمون: Wu, Wei, Series EditorAff1, Lin, Jia'en, editorAff2

    المصدر: Proceedings of the International Field Exploration and Development Conference 2023 : Volume 2. :243-250

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  2. 2
    دورية أكاديمية
    Selenium deficiency-induced multiple tissue damage with dysregulation of immune and redox homeostasis in broiler chicks under heat stress

    المؤلفون: Zhao, Ling, Liu, Meng, Sun, Hua, Yang, Jia-Cheng, Huang, Yu-Xuan, Huang, Jia-QiangAff2, IDs1142702222261_cor6, Lei, Xingen, Sun, Lv-HuiAff1, IDs1142702222261_cor8

    المصدر: Science China Life Sciences. 66(9):2056-2069

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  3. 3
    مؤتمر
    Tensile performance of line-type microscale Cu/Sn-58Bi/Cu joints under electro-thermo-mechanical coupled loads

    المؤلفون: Li, Xing-Min, Gui, Jun, Li, Wang-Yun, Yan, Hai-Dong, Qin, Hong-Bo, Huang, Jia-Qiang, Yang, Dao-Guo

    المصدر: 2020 21st International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2020 21st International Conference on. :1-4 Aug, 2020

    Relation: 2020 21st International Conference on Electronic Packaging Technology (ICEPT)

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  4. 4
    مؤتمر
    Shear performance of BGA structure Cu/Sn-3.0Ag-0.5Cu/Cu solder joints after deep cryogenic treatment with different time

    المؤلفون: Gui, Jun, Li, Xing-Min, Li, Wang-Yun, Yan, Hai-Dong, Qin, Hong-Bo, Huang, Jia-Qiang, Yang, Dao-Guo

    المصدر: 2020 21st International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2020 21st International Conference on. :1-4 Aug, 2020

    Relation: 2020 21st International Conference on Electronic Packaging Technology (ICEPT)

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  5. 5
    مؤتمر
    Shear performance of microscale BGA structure Cu/Sn-3.0Ag-0.5Cu/Cu joints with shrinking volume at low and cryogenic temperatures

    المؤلفون: Li, Wang-Yun, Peng, Guan-Qiang, Cheng, Tian-Xiang, Qin, Hong-Bo, Huang, Jia-Qiang, Yang, Dao-Guo

    المصدر: 2019 20th International Conference on Electronic Packaging Technology(ICEPT) Electronic Packaging Technology(ICEPT), 2019 20th International Conference on. :1-4 Aug, 2019

    Relation: 2019 20th International Conference on Electronic Packaging Technology(ICEPT)

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  6. 6
    مؤتمر
    Effect of electromigration on the microstructural evolution and shear fracture behavior of mixed assembled Cu/Sn–3.0Ag–0.5Cu-ball/Sn–58Bi-paste/Cu joints in board-level packaging

    المؤلفون: Huang, Jia-Qiang, Zhou, Min-Bo, Zhang, Xin-Ping

    المصدر: 2018 19th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2018 19th International Conference on. :531-535 Aug, 2018

    Relation: 2018 19th International Conference on Electronic Packaging Technology (ICEPT)

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  7. 7
    مؤتمر
    Effect of electric current stressing on the shear strength and fracture behavior of micro-scale BGA structured Cu/Sn–3.0Ag–0.5Cu/Cu joints

    المؤلفون: Le, Wen-Kai, Ning, Xiang, Huang, Jia-Qiang, Zhou, Min-Bo, Zhang, Xin-Ping

    المصدر: 2018 19th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2018 19th International Conference on. :610-614 Aug, 2018

    Relation: 2018 19th International Conference on Electronic Packaging Technology (ICEPT)

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  8. 8
    كتاب إلكتروني
    An Effective High Resolution Seismic Processing Method with a BiDirectional Iterative and Progressive Frequency Extension Algorithm and Its Application

    المؤلفون: Liu, Jun-yingAff1, Aff2, Zhang, JingAff1, Aff2, Guo, Zheng-huaAff2, Zhang, LinAff2, Huang, JIa-qiangAff2, Yang, RongjunAff1, Aff2, Li, Xin-yuAff2

    المساهمون: Wu, Wei, Series EditorAff101, Lin, Jia’en, editorAff102

    المصدر: Proceedings of the International Field Exploration and Development Conference 2022. :479-485

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  9. 9
    مؤتمر
    Microstructures and shear properties of mixed assembly BGA structure SnAgCu/SnBi(Ag)/Cu joints in board-level packaging

    المؤلفون: Huang, Jia-Qiang, Zhou, Min-Bo, Zhao, Xing-Fei, Zhang, Xin-Ping

    المصدر: 2017 18th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2017 18th International Conference on. :1649-1654 Aug, 2017

    Relation: 2017 18th International Conference on Electronic Packaging Technology (ICEPT)

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  10. 10
    دورية أكاديمية

    لا يتم عرض هذه النتيجة على الضيوف.

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