المؤلفون: Chen, Yi-Fan, Chang, Yu-Jen, Chiu, Ching-Te, Huang, Ming-Long, Liang, Geng-Ming, Lee, Chao-Lin, Lee, Jenq-Kuen, Hsieh, Ping-Yu, Lai, Wei-Chih

المصدر: 2024 IEEE International Symposium on Circuits and Systems (ISCAS) Circuits and Systems (ISCAS), 2024 IEEE International Symposium on. :1-5 May, 2024

Relation: 2024 IEEE International Symposium on Circuits and Systems (ISCAS)

المؤلفون: Lin, Yun-Te, Huang, Ming-Long, Wang, Chung-Ming

المصدر: 2016 IEEE/ACIS 15th International Conference on Computer and Information Science (ICIS) Computer and Information Science (ICIS), 2016 IEEE/ACIS 15th International Conference on. :1-6 Jun, 2016

Relation: 2016 IEEE/ACIS 15th International Conference on Computer and Information Science (ICIS)

المؤلفون: Chen, Wei-Sung, Huang, Ming-Long, Wang, Chung-Ming

المصدر: 2016 IEEE/ACIS 15th International Conference on Computer and Information Science (ICIS) Computer and Information Science (ICIS), 2016 IEEE/ACIS 15th International Conference on. :1-6 Jun, 2016

Relation: 2016 IEEE/ACIS 15th International Conference on Computer and Information Science (ICIS)

المؤلفون: Huang, Ming-Long^Aff1, Zhou, Yi-Cai^Aff1, Wang, Chung-Ming^Aff1

المساهمون: Hutchison, David, editor, Kanade, Takeo, editor, Kittler, Josef, editor, Kleinberg, Jon M., editor, Mattern, Friedemann, editor, Mitchell, John C., editor, Naor, Moni, editor, Nierstrasz, Oscar, editor, Rangan, C. Pandu, editor, Steffen, Bernhard, editor, Sudan, Madhu, editor, Terzopoulos, Demetri, editor, Tygar, Doug, editor, Vardi, Moshe Y., editor, Weikum, Gerhard, editor, Gagalowicz, André, editor, Philips, Wilfried, editor

المصدر: Computer Vision/Computer Graphics Collaboration Techniques : Third International Conference, MIRAGE 2007, Rocquencourt, France, March 28-30, 2007. Proceedings. 4418:1-11

المؤلفون: Wang, Chung-Ming, Huang, Yao-Hsien, Huang, Ming-Long

المصدر: In Mathematical and Computer Modelling 2006 44(7):608-627

لا يتم عرض هذه النتيجة على الضيوف.
تسجيل الدخول للوصول الكامل.

المؤلفون: Huang, Ming Long, Liu, Yu Hong, Zhang, Hong Wei, Duan, Bao Sheng

المصدر: Advanced Materials Research; May 2013, Vol. 694 Issue: 1 p263-266, 4p