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1دورية أكاديميةSolid/solid state interfacial reactions in the lead-free solders/Cu- 2.3%wt. Fe alloy (C194) couples
المؤلفون: Yen, Yee-Wen, Laksono, Andromeda Dwi, Liou, Yi-Chin, Ramadhani, Mavindra, Lee, Yu-Yen, Huang, Ssu-Chi
المصدر: In Journal of the Taiwan Institute of Chemical Engineers February 2024 155
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2دورية أكاديمية
المؤلفون: Huang, Ya-Chi, Lin, Tzu-Yu, Huang, Ssu-Chi, Yang, Tsung-Ying, Shih, Chi-Jen
المصدر: In Journal of Non-Crystalline Solids 15 May 2022 584
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3كتاب إلكتروني
المؤلفون: Wen, Cai TingAff10, Chang, Chia JungAff11, Huang, Ssu ChiAff10, Chang, Ming HuaAff10, Chiang, Shih Hsun FanAff10, Liu, Chen ChungAff10, Hwang, Fu KwunAff12, Chang, Hsin YiAff12, Yang, Chih WeiAff13
المساهمون: Filipe, Joaquim, Editorial Board MemberAff1, Ghosh, Ashish, Editorial Board MemberAff2, Kotenko, Igor, Editorial Board MemberAff3, Prates, Raquel Oliveira, Editorial Board MemberAff4, Zhou, Lizhu, Editorial Board MemberAff5, Shen, Jian, editorAff6, Chang, Yao-Chung, editorAff7, Su, Yu-Sheng, editorAff8, Ogata, Hiroaki, editorAff9
المصدر: Cognitive Cities : Second International Conference, IC3 2019, Kyoto, Japan, September 3–6, 2019, Revised Selected Papers. 1227:316-322