المؤلفون: Yi-Sheng Chen, Kuo-Tsai Wu, Ming-Hong Tsai, Sheng-Jye Hwang, Huei-Huang Lee, Hsin-Shu Peng, Hsiao-Yeh Chu

المصدر: Journal of Low Frequency Noise, Vibration and Active Control, Vol 40 (2021)

مصطلحات موضوعية: Control engineering systems. Automatic machinery (General), TJ212-225, Acoustics. Sound, QC221-246

وصف الملف: electronic resource

Relation: https://doaj.org/toc/1461-3484; https://doaj.org/toc/2048-4046

URL الوصول: https://doaj.org/article/b360a6f91759489aa6fbfbf749c18f62

المؤلفون: Jia-Chen Fan-Jiang, Chi-Wei Su, Guan-Yan Liou, Sheng-Jye Hwang, Huei-Huang Lee, Hsin-Shu Peng, Hsiao-Yeh Chu

المصدر: Polymers, Vol 13, Iss 4, p 555 (2021)

مصطلحات موضوعية: injection molding process, pressure curve, peak pressure, viscosity index, V/P switchover point, adaptively adjustment system, Organic chemistry, QD241-441

وصف الملف: electronic resource

Relation: https://www.mdpi.com/2073-4360/13/4/555; https://doaj.org/toc/2073-4360

URL الوصول: https://doaj.org/article/121c68ed996642d6bb097d1abe19ddfa

المؤلفون: Kuo-Tsai Wu, Sheng-Jye Hwang, Huei-Huang Lee

المصدر: Applied Sciences, Vol 9, Iss 19, p 4110 (2019)

مصطلحات موضوعية: wafer-level lens, exposure uniformity, uv led curing, Technology, Engineering (General). Civil engineering (General), TA1-2040, Biology (General), QH301-705.5, Physics, QC1-999, Chemistry, QD1-999

وصف الملف: electronic resource

Relation: https://www.mdpi.com/2076-3417/9/19/4110; https://doaj.org/toc/2076-3417

URL الوصول: https://doaj.org/article/3354a7bb646e44168a97db7379ab6580

المؤلفون: Kuo-Tsai Wu, Sheng-Jye Hwang, Huei-Huang Lee

المصدر: Sensors, Vol 17, Iss 5, p 1004 (2017)

مصطلحات موضوعية: CMOS image sensor (CIS), layered structures, finite element analysis (FEA), Chemical technology, TP1-1185

وصف الملف: electronic resource

Relation: http://www.mdpi.com/1424-8220/17/5/1004; https://doaj.org/toc/1424-8220

URL الوصول: https://doaj.org/article/dee3512833c440328dcc78e0d0432b88

المؤلفون: Yu-Ting Sung, Sheng-Jye Hwang, Huei-Huang Lee, Durn-Yuan Huang

المصدر: Advances in Mechanical Engineering, Vol 6 (2014)

مصطلحات موضوعية: Mechanical engineering and machinery, TJ1-1570

وصف الملف: electronic resource

Relation: https://doaj.org/toc/1687-8132

URL الوصول: https://doaj.org/article/bcb00979e25f46c6bbd0898faa9d2a01

المؤلفون: Chi-Han Chiou, Yu-Yen Huang, Meng-Han Chiang, Huei-Huang Lee, Gwo-Bin Lee

المصدر: 19th IEEE International Conference on Micro Electro Mechanical Systems Micro Electro Mechanical Systems, 2006. MEMS 2006 Istanbul. 19th IEEE International Conference on. :142-145 2006

Relation: 19th IEEE International Conference on Micro Electro Mechanical Systems

المؤلفون: Chih-Hao Wang, Yi-Yu Chen, Chia-Sheng Liao, Huei-Huang Lee, Gwo-Bin Lee

المصدر: 19th IEEE International Conference on Micro Electro Mechanical Systems Micro Electro Mechanical Systems, 2006. MEMS 2006 Istanbul. 19th IEEE International Conference on. :374-377 2006

Relation: 19th IEEE International Conference on Micro Electro Mechanical Systems

المؤلفون: Li-Ching Hong, Sheng-Jye Hwang, Huei-Huang Lee, Durn-Yuan Huang

المصدر: 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004. Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004. 4th IEEE International Conference on. :78-84 2004

Relation: 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004.

المؤلفون: Chien-Chang Pei, Su, F., Sheng-Jye Hwang, Durn-Yuan Huang, Huei-Huang Lee

المصدر: 2002 Proceedings. 8th International Advanced Packaging Materials Symposium (Cat. No.02TH8617) Advanced packaging materials symposium Advanced Packaging Materials, 2002. Proceedings. 2002 8th International Symposium on. :160-165 2002

Relation: 2002 8th International Advanced Packaging Materials Symposium

المؤلفون: Shang-Shiuan Deng, Sheng-Jye Hwang, Huei-Huang Lee, Durn-Yuan Huang, Yu-Ren Chen, Geng-Shin Shen

المصدر: 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International. :48-51 Oct, 2009

Relation: 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)