المؤلفون: Vaibhav, G.^{Aff11, Aff11}, Lokesh Babu, M.^Aff11, Ramakrishna, V. V.^Aff11, Ram Kumar, R.^Aff11, Anil Kumar, C.^Aff11, Sankaran, S.^Aff11, Rajarajan, A.^Aff11

المساهمون: Ghosh, Arindam, Series Editor^Aff1, Chua, Daniel, Series Editor^Aff2, de Souza, Flavio Leandro, Series Editor^Aff3, Aktas, Oral Cenk, Series Editor^Aff4, Han, Yafang, Series Editor^Aff5, Gong, Jianghong, Series Editor^Aff6, Jawaid, Mohammad, Series Editor^Aff7, Manohara Babu, Mulakaluri Rama, editor^Aff8, Buragohain, Manoj Kumar, editor^Aff9, Kuchipudi, Srinivas, editor^Aff10

المصدر: Recent Advances in Composites Engineering and Research : Proceedings of 17th ISAMPE National Conference on Composites (INCCOM-17). 39:277-297

المؤلفون: Shakoorzadeh Chase, Niloofar, Sahoo, Krutikesh, Tao Yang, Yu, Iyer, Subramanian S.

المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :1241-1246 Jun, 2020

Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

المؤلفون: Shakoorzadeh, Niloofar, Jangam, Siva Chandra, Rahim, Kaysar, Ambhore, Pranav, Chien, Han, Hanna, Amir, Iyer, Subramanian S.

المصدر: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :800-805 May, 2019

Relation: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

المؤلفون: Shakoorzadeh, Niloofar, Hanna, Amir, Iyer, Subramanian

المصدر: 2019 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2019 IEEE International. :1-5 Mar, 2019

Relation: 2019 IEEE International Reliability Physics Symposium (IRPS)

المؤلفون: Li, Jiaqiang, Xu, Xiaoming, Cao, Jian, Dai, Wei, Zhang, Jinyu

المصدر: 2018 IEEE International Conference on Mechatronics and Automation (ICMA) Mechatronics and Automation (ICMA), 2018 IEEE International Conference on. :1446-1451 Aug, 2018

Relation: 2018 IEEE International Conference on Mechatronics and Automation (ICMA)

المؤلفون: Lahokallio, Sanna, Kiilunen, Janne, Frisk, Laura

المصدر: 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition Microelectronics and Packaging Conference (EMPC) & Exhibition, 2017 21st European. :1-4 Sep, 2017

Relation: 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition

المؤلفون: Gupta, Lava Kumar, Kumar, Kuldeep, Sikarwar, Samiksha, Yadav, B. C.^{Aff2, IDs00396021049244_cor4}, Golubeva, Nina D., Shershnev, Vitaly A., Dzhardimalieva, Gulzhian I.^{Aff3, Aff4}, Shripal^{Aff1, IDs00396021049244_cor8}

المصدر: Colloid and Polymer Science: Kolloid-Zeitschrift und Zeitschrift für Polymere. 300(3):191-202

المؤلفون: Kokko, Kati H.

المصدر: 2013 Eurpoean Microelectronics Packaging Conference (EMPC) Microelectronics Packaging Conference (EMPC) , 2013 European. :1-6 Sep, 2013

Relation: 2013 European Microelectronics Packaging Conference (EMPC)

المؤلفون: Lahokallio, Sanna, Saarinen, Kirsi, Frisk, Laura

المصدر: 18th European Microelectronics & Packaging Conference Microelectronics and Packaging Conference (EMPC), 2011 18th European. :1-6 Sep, 2011

Relation: 2011 18th European Microelectronics and Packaging Conference (EMPC)

المؤلفون: Kiilunen, J., Frisk, L.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 4(2):181-189 Feb, 2014