المؤلفون: Yi, Z., Wan, Y., Qin, M., Huang, Q.

المصدر: Journal of Microelectromechanical Systems J. Microelectromech. Syst. Microelectromechanical Systems, Journal of. 33(1):37-45 Feb, 2024

المؤلفون: Lin, Nien-Chun, Shih, Hsin-Chih, Tsai, Ching-I, Kao, Chin-Li, Wang, Chen-Chao, Hung, C.P.

المصدر: 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :179-180 Apr, 2024

Relation: 2024 International Conference on Electronics Packaging (ICEP)

المؤلفون: Rummel, B.D., Glaser, C.E., Gurule, R.T., Groves, M., Binder, A.T., Floyd, R., Yates, L., Reilly, K.J., Kaplar, R.J.

المصدر: 2024 IEEE International Reliability Physics Symposium (IRPS) International Reliability Physics Symposium (IRPS), 2024 IEEE. :P52.RT-1-P52.RT-6 Apr, 2024

Relation: 2024 IEEE International Reliability Physics Symposium (IRPS)

المؤلفون: Ji, Yatai, Giangrande, Paolo, Madonna, Vincenzo, Zhao, Weiduo, Galea, Michael, Li, Jing, Zhang, He

المصدر: 2022 International Conference on Electrical Machines (ICEM) Electrical Machines (ICEM), 2022 International Conference on. :2325-2330 Sep, 2022

Relation: 2022 International Conference on Electrical Machines (ICEM)

المؤلفون: Yanik, Yusuf, Aymelek, Abdullah, Yildirim, Ömer, Demirtaş, Betül, Türker, Temel^{Aff1, IDs1334902300745x_cor5}

المصدر: Journal of Civil Structural Health Monitoring. 14(3):635-661

المؤلفون: Mao, Hangyu^{Aff1, Aff2}, Shen, Chaomin^{Aff1, Aff3, IDs0060302303414z_cor2}, Liu, Sihong^{Aff1, Aff3}, Wang, Liujiang^{Aff1, Aff3}, Fu, Zhongzhi

المصدر: Rock Mechanics and Rock Engineering. 56(9):6529-6543

المؤلفون: Kikuchi, Yusuke, Ishida, Takahiro, Ueno, Takahisa, Kanazawa, Seiji, Nagao, Masayuki, Hikita, Masayuki, Murakami, Yoshinobu, Nagata, Masayoshi

المصدر: 2017 International Symposium on Electrical Insulating Materials (ISEIM) Electrical Insulating Materials (ISEIM), 2017 International Symposium on. 1:159-162 Sep, 2017

Relation: 2017 International Symposium on Electrical Insulating Materials (ISEIM)

المؤلفون: Cadilha Marques, G., von Seggern, F., Dehm, S., Breitung, B., Hahn, H., Dasgupta, S., Tahoori, M.B., Aghassi-Hagmann, J.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 66(5):2202-2207 May, 2019

المؤلفون: Gianni Ferrero, Malgorzata K. Pierchala, Konstantin Astafiev, Erling Ringgaard, Bhaskar Reddy Sudireddy, Astri Bjørnetun Haugen

المصدر: Open Ceramics, Vol 15, Iss , Pp 100404- (2023)

مصطلحات موضوعية: Piezoelectric ceramics, Humidity effects, Lead-free ceramics, Clay industries. Ceramics. Glass, TP785-869

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2666539523000767; https://doaj.org/toc/2666-5395

URL الوصول: https://doaj.org/article/4b8fe8f40a584092884307fc396c2528

المؤلفون: Lall, Pradeep, Zhang, Hao, Davis, Lynn

المصدر: 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2017 16th IEEE Intersociety Conference on. :1161-1175 May, 2017

Relation: 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)