المؤلفون: Ouyang, T. Y., Hung, Y. T., Lee, O. H., Li, S. Y., Chiu, W. L., Hung, T. Y., Wu, S. H., Chang, H. H.

المصدر: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2022 17th International. :1-4 Oct, 2022

Relation: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

المؤلفون: Hung, T.-Y., Liao, L.-L., Wang, C. C., Chi, W. H., Chiang, K.-N.

المصدر: IEEE Transactions on Device and Materials Reliability IEEE Trans. Device Mater. Relib. Device and Materials Reliability, IEEE Transactions on. 14(1):484-492 Mar, 2014

المؤلفون: Chou, C.-Y., Hung, T.-Y., Huang, C.-J., Chiang, K.-N.

المصدر: IEEE Transactions on Advanced Packaging IEEE Trans. Adv. Packag. Advanced Packaging, IEEE Transactions on. 33(3):681-689 Aug, 2010

المؤلفون: Shih, T.-T., Lin, M.-C., Tseng, P.-H., Li, C.-Y., Hung, T.-Y., Chiu, Y.-J., Cheng, W.-H.

المصدر: Journal of Lightwave Technology J. Lightwave Technol. Lightwave Technology, Journal of. 25(11):3488-3494 Nov, 2007

المؤلفون: Tseng, Y.-T., Hung, T.-Y., Liu, J.-H.

المصدر: Journal of Lightwave Technology J. Lightwave Technol. Lightwave Technology, Journal of. 25(3):803-810 Mar, 2007

المؤلفون: Chen, Y.-C., Hung, T.-Y., Chang, Y.-L., Shieh, K., Hsu, C.-L., Huang, C., Yan, WH, Ashtiani, K., Pisharoty, D., Lei, W., Chang, S., Huang, F., Collins, J., Tzou, S. F.

المصدر: 2007 IEEE International Interconnect Technology Conferencee International Interconnect Technology Conference, IEEE 2007. :105-107 Jun, 2007

Relation: 2007 IEEE International Interconnect Technology Conferencee

المؤلفون: Hung, T.-Y., Hagelstein, P.L.

المصدر: IEEE Journal of Quantum Electronics IEEE J. Quantum Electron. Quantum Electronics, IEEE Journal of. 28(5):1376-1383 May, 1992

المؤلفون: Lai, C. T., Hung, T. Y., Chiang, K. N.

المصدر: 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2012 13th International Conference on. :1/6-6/6 Apr, 2012

Relation: 2012 13th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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