المؤلفون: Chia-Chi Tsai, Li-Ling Liao, Yen-Fu Su, Hung, Tuan-Yu, Chiang, Kuo-Ning

المصدر: 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2015 16th International Conference on. :1-4 Apr, 2015

Relation: 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

المؤلفون: Liao, Li-Ling, Hung, Tuan-Yu, Liu, Chun-Kai, Yen-Fu Su, Chiang, Kuo-Ning

المصدر: 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (eurosime), 2014 15th international conference on. :1-4 Apr, 2014

Relation: 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

المؤلفون: Chen, Hao-Chih, Chiang, Yi-Che, Hung, Tuan-Yu, Chiang, Kuo-Ning

المصدر: 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) Electronics Packaging Technology Conference (EPTC 2013), 2013 IEEE 15th. :516-519 Dec, 2013

Relation: 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013)

المؤلفون: Lin, Kuan-Chung, Tsai, Chia-Chi, Su, Yen-Fu, Hung, Tuan-Yu, Chiang, Kuo-Ning

المصدر: 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2013 8th International. :105-108 Oct, 2013

Relation: 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

المؤلفون: Hung, Tuan-Yu, Chin-Chun Wang, Kuo-Ning Chiang

المصدر: 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013 14th International Conference on. :1-6 Apr, 2013

Relation: 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

المؤلفون: Su, Yen-Fu, Hung, Tuan-Yu, Yang, Shin-Yueh, Chiang, Kuo-Ning

المصدر: 2010 IEEE CPMT Symposium Japan CPMT Symposium Japan, 2010 IEEE. :1-4 Aug, 2010

Relation: 2010 IEEE CPMT Symposium Japan (Formerly VLSI Packaging Workshop of Japan)

المؤلفون: Hung, Tuan-Yu, Chiang, Shih-Ying, Chou, Chan-Yen, Chiu, Chien-Chia, Chiang, Kuo-Ning

المصدر: 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2010 12th IEEE Intersociety Conference on. :1-5 Jun, 2010

Relation: 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

المؤلفون: Masafumi Sano, Chou, Chan-Yen, Hung, Tuan-Yu, Yang, Shin-Yueh, Chao-Jen Huang, Chiang, Kuo-Ning

المصدر: 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International. :537-540 Oct, 2009

Relation: 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

المؤلفون: Hung, Tuan-Yu, Yew, Ming-Chih, Chou, Chan-Yen, Chiang, Kuo-Ning

المصدر: 2009 European Microelectronics and Packaging Conference Microelectronics and Packaging Conference, 2009. EMPC 2009. European. :1-6 Jun, 2009

Relation: 2009 European Microelectronics and Packaging Conference (EMPC)

المؤلفون: Masafumi Sano, Chou, Chan-Yen, Hung, Tuan-Yu, Shin-Yueh Yang, Kuo-Ning Chiang

المصدر: EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009. 10th International Conference on. :1-6 Apr, 2009

Relation: 2009 10th International Conferene on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems (EuroSimE)