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1دورية أكاديمية
المؤلفون: Wen-Ting Chu, Hao-Hsiung Lin, Chia-Ta Hsieh, Hung-Cheng Sung, Yu-Hsiung Wang, Yung-Tao Lin, Wang, C.S.
المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 51(10):1667-1671 Oct, 2004
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2دورية أكاديمية
المؤلفون: Hung-Cheng Sung, Tan Fu Lei, Te-Hsun Hsu, Wang, S.W., Ya-Chen Kao, Yung-Tao Lin, Wang, C.S.
المصدر: IEEE Electron Device Letters IEEE Electron Device Lett. Electron Device Letters, IEEE. 26(10):770-772 Oct, 2005
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3دورية أكاديمية
المؤلفون: Hung-Cheng Sung, Tan Fu Lei, Te-Hsun Hsu, Ya-Chen Kao, Yung-Tao Lin, Wang, C.S.
المصدر: IEEE Electron Device Letters IEEE Electron Device Lett. Electron Device Letters, IEEE. 26(3):194-196 Mar, 2005
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4دورية أكاديمية
المؤلفون: Wen-Ting Chu, Hao-Hsiung Lin, Yeur-Luen Tu, Yu-Hsiung Wang, Chia-Ta Hsieh, Hung-Cheng Sung, Yung-Tao Lin, Chia-Shiung Tsai, Wang, C.S.
المصدر: IEEE Electron Device Letters IEEE Electron Device Lett. Electron Device Letters, IEEE. 25(9):616-618 Sep, 2004
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5دورية أكاديمية
المؤلفون: Wen-Ting Chu, Hao-Hsiung Lin, Yu-Hsiung Wang, Chia-Ta Hsieh, Hung-Cheng Sung, Yung-Tao Lin, Wang, C.S.
المصدر: IEEE Electron Device Letters IEEE Electron Device Lett. Electron Device Letters, IEEE. 25(7):498-500 Jul, 2004
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6دورية أكاديمية
المؤلفون: Kuo-Ching Huang, Yean-Kuen Fang, Dun-Nian Yang, Chii-Wen Chen, Hung-Cheng Sung, Di-Son Kuo, Wang, C.S., Mong-Song Liang
المصدر: IEEE Electron Device Letters IEEE Electron Device Lett. Electron Device Letters, IEEE. 21(7):359-361 Jul, 2000
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7دورية أكاديمية
المؤلفون: Kuo-Ching Huang, Yean-Kuen Fang, Dun-Nian Yaung, Chii-Wen Chen, Hung-Cheng Sung, Di-Son Kuo, Wang, C.S., Mong-Song Liang
المصدر: IEEE Electron Device Letters IEEE Electron Device Lett. Electron Device Letters, IEEE. 20(8):412-414 Aug, 1999
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8
المؤلفون: C.S. Wang, Chia-Ta Hsieh, Wen-Ting Chu, Yu-Hsiung Wang, Hao-Hsiung Lin, Yung-Tao Lin, Hung-Cheng Sung
المصدر: IEEE Transactions on Electron Devices. 51:1667-1671
مصطلحات موضوعية: Interconnection, Materials science, business.industry, Electrical engineering, Copper interconnect, Integrated circuit, Aspect ratio (image), Flash memory, Electronic, Optical and Magnetic Materials, law.invention, law, Flash (manufacturing), Electric field, Low-power electronics, Optoelectronics, Electrical and Electronic Engineering, business
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9
المؤلفون: Chung Wang, J.P Wu, Ching-Hsiang Hsu, Juang-Ke Yeh, H.J Tao, D.S Shyu, C.S Tsai, T.J Fong, Michael Liang, Wen-Ting Chu, S.H Lin, Y.D Chih, S.P Peng, Chia-Ta Hsieh, Hung-Cheng Sung, Sam Chu, Y.C Huang, Chen Hsin-Ming, Di-Son Kuo, Chrong Jun Lin, S.C Wong, Y.T Chen, K.Y Lee
المصدر: Microelectronic Engineering. 59:203-211
مصطلحات موضوعية: business.industry, Computer science, Electrical engineering, Integrated circuit, Condensed Matter Physics, computer.software_genre, Atomic and Molecular Physics, and Optics, Flash memory, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, law.invention, Flash (photography), law, Logic gate, Systems design, Computer Aided Design, System on a chip, Electrical and Electronic Engineering, Electric current, business, computer
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10
المؤلفون: C.S. Wang, Hung-Cheng Sung, Te-Hsun Hsu, Yung-Tao Lin, Shyh-Wei Wang, Ya-Chen Kao, Tan Fu Lei
المصدر: IEEE Electron Device Letters. 26:770-772
مصطلحات موضوعية: Materials science, business.industry, Electrical engineering, Copper interconnect, High voltage, Integrated circuit, Electronic, Optical and Magnetic Materials, law.invention, Atomic layer deposition, law, Optoelectronics, Electrical and Electronic Engineering, EPROM, business, Hot-carrier injection, High-κ dielectric, EEPROM