المؤلفون: Wen-Ting Chu, Hao-Hsiung Lin, Chia-Ta Hsieh, Hung-Cheng Sung, Yu-Hsiung Wang, Yung-Tao Lin, Wang, C.S.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 51(10):1667-1671 Oct, 2004

المؤلفون: Hung-Cheng Sung, Tan Fu Lei, Te-Hsun Hsu, Wang, S.W., Ya-Chen Kao, Yung-Tao Lin, Wang, C.S.

المصدر: IEEE Electron Device Letters IEEE Electron Device Lett. Electron Device Letters, IEEE. 26(10):770-772 Oct, 2005

المؤلفون: Hung-Cheng Sung, Tan Fu Lei, Te-Hsun Hsu, Ya-Chen Kao, Yung-Tao Lin, Wang, C.S.

المصدر: IEEE Electron Device Letters IEEE Electron Device Lett. Electron Device Letters, IEEE. 26(3):194-196 Mar, 2005

المؤلفون: Wen-Ting Chu, Hao-Hsiung Lin, Yeur-Luen Tu, Yu-Hsiung Wang, Chia-Ta Hsieh, Hung-Cheng Sung, Yung-Tao Lin, Chia-Shiung Tsai, Wang, C.S.

المصدر: IEEE Electron Device Letters IEEE Electron Device Lett. Electron Device Letters, IEEE. 25(9):616-618 Sep, 2004

المؤلفون: Wen-Ting Chu, Hao-Hsiung Lin, Yu-Hsiung Wang, Chia-Ta Hsieh, Hung-Cheng Sung, Yung-Tao Lin, Wang, C.S.

المصدر: IEEE Electron Device Letters IEEE Electron Device Lett. Electron Device Letters, IEEE. 25(7):498-500 Jul, 2004

المؤلفون: Kuo-Ching Huang, Yean-Kuen Fang, Dun-Nian Yang, Chii-Wen Chen, Hung-Cheng Sung, Di-Son Kuo, Wang, C.S., Mong-Song Liang

المصدر: IEEE Electron Device Letters IEEE Electron Device Lett. Electron Device Letters, IEEE. 21(7):359-361 Jul, 2000

المؤلفون: Kuo-Ching Huang, Yean-Kuen Fang, Dun-Nian Yaung, Chii-Wen Chen, Hung-Cheng Sung, Di-Son Kuo, Wang, C.S., Mong-Song Liang

المصدر: IEEE Electron Device Letters IEEE Electron Device Lett. Electron Device Letters, IEEE. 20(8):412-414 Aug, 1999

المؤلفون: C.S. Wang, Chia-Ta Hsieh, Wen-Ting Chu, Yu-Hsiung Wang, Hao-Hsiung Lin, Yung-Tao Lin, Hung-Cheng Sung

المصدر: IEEE Transactions on Electron Devices. 51:1667-1671

مصطلحات موضوعية: Interconnection, Materials science, business.industry, Electrical engineering, Copper interconnect, Integrated circuit, Aspect ratio (image), Flash memory, Electronic, Optical and Magnetic Materials, law.invention, law, Flash (manufacturing), Electric field, Low-power electronics, Optoelectronics, Electrical and Electronic Engineering, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::55109258ab7c6f5631de10e35ce49a7e
https://doi.org/10.1109/ted.2004.835995

المؤلفون: Chung Wang, J.P Wu, Ching-Hsiang Hsu, Juang-Ke Yeh, H.J Tao, D.S Shyu, C.S Tsai, T.J Fong, Michael Liang, Wen-Ting Chu, S.H Lin, Y.D Chih, S.P Peng, Chia-Ta Hsieh, Hung-Cheng Sung, Sam Chu, Y.C Huang, Chen Hsin-Ming, Di-Son Kuo, Chrong Jun Lin, S.C Wong, Y.T Chen, K.Y Lee

المصدر: Microelectronic Engineering. 59:203-211

مصطلحات موضوعية: business.industry, Computer science, Electrical engineering, Integrated circuit, Condensed Matter Physics, computer.software_genre, Atomic and Molecular Physics, and Optics, Flash memory, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, law.invention, Flash (photography), law, Logic gate, Systems design, Computer Aided Design, System on a chip, Electrical and Electronic Engineering, Electric current, business, computer

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::77c300a992f2a3159d3aaeb6147d3034
https://doi.org/10.1016/s0167-9317(01)00623-2

المؤلفون: C.S. Wang, Hung-Cheng Sung, Te-Hsun Hsu, Yung-Tao Lin, Shyh-Wei Wang, Ya-Chen Kao, Tan Fu Lei

المصدر: IEEE Electron Device Letters. 26:770-772

مصطلحات موضوعية: Materials science, business.industry, Electrical engineering, Copper interconnect, High voltage, Integrated circuit, Electronic, Optical and Magnetic Materials, law.invention, Atomic layer deposition, law, Optoelectronics, Electrical and Electronic Engineering, EPROM, business, Hot-carrier injection, High-κ dielectric, EEPROM

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::27f8fea4a50e7c29a6b9ab71dae0c7c9
https://doi.org/10.1109/led.2005.856014