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1مؤتمر
المؤلفون: Huynen, M., De Zutter, D., Ginste, D. Vande, Okhmatovski, V.
المصدر: 2024 IEEE/MTT-S International Microwave Symposium - IMS 2024 Microwave Symposium - IMS 2024, 2024 IEEE/MTT-S International. :662-665 Jun, 2024
Relation: 2024 IEEE/MTT-S International Microwave Symposium - IMS 2024
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2دورية أكاديمية
المؤلفون: Bosman, D., Huynen, M., De Zutter, D., Sun, X., Pantano, N., Van der Plas, G., Beyne, E., Ginste, D.V.
المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 13(10):1567-1575 Oct, 2023
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3دورية أكاديمية
المؤلفون: Bosman, D., Huynen, M., De Zutter, D., Sun, X., Pantano, N., Van der Plas, G., Beyne, E., Vande Ginste, D.
المصدر: IEEE Transactions on Microwave Theory and Techniques IEEE Trans. Microwave Theory Techn. Microwave Theory and Techniques, IEEE Transactions on. 71(7):2794-2806 Jul, 2023
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4مؤتمر
المؤلفون: Peeters, M., Sinha, S., Sun, X., Desset, C., Gramegna, G., Slabbekoorn, J., Bex, P., Pinho, N., Webers, T., Velenis, D., Miller, A., Collaert, N., Van der Plas, G., Beyne, E., Huynen, M., Broucke, R.
المصدر: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) VLSI Technology and Circuits (VLSI Technology and Circuits), 2022 IEEE Symposium on. :256-257 Jun, 2022
Relation: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)
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5دورية أكاديمية
المؤلفون: Huynen, M., Kapusuz, K.Y., Sun, X., Van der Plas, G., Beyne, E., De Zutter, D., Vande Ginste, D.
المصدر: IEEE Transactions on Microwave Theory and Techniques IEEE Trans. Microwave Theory Techn. Microwave Theory and Techniques, IEEE Transactions on. 68(4):1217-1233 Apr, 2020
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6مؤتمر
المؤلفون: Huynen, M., De Zutter, D., Vande Ginste, D.
المصدر: 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Electrical Performance of Electronic Packaging and Systems (EPEPS), 2018 IEEE 27th Conference on. :241-243 Oct, 2018
Relation: 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
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7دورية أكاديمية
المؤلفون: Huynen, M., De Zutter, D., Vande Ginste, D.
المصدر: IEEE Microwave and Wireless Components Letters IEEE Microw. Wireless Compon. Lett. Microwave and Wireless Components Letters, IEEE. 28(6):455-457 Jun, 2018
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8دورية أكاديمية
المؤلفون: Franken, G. A. C., Huynen, M. A., Martínez-Cruz, L. A., Bindels, R. J. M., de Baaij, J. H. F.Aff1, IDs00018022044428_cor5
المصدر: Cellular and Molecular Life Sciences. 79(8)
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9دورية أكاديمية
المؤلفون: Gossye, M., Huynen, M., Vande Ginste, D., De Zutter, D., Rogier, H.
المصدر: IEEE Transactions on Antennas and Propagation IEEE Trans. Antennas Propagat. Antennas and Propagation, IEEE Transactions on. 66(2):808-818 Feb, 2018
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10دورية أكاديمية
المؤلفون: Huynen, M., Gossye, M., De Zutter, D., Ginste, D.V.
المصدر: IEEE Antennas and Wireless Propagation Letters Antennas Wirel. Propag. Lett. Antennas and Wireless Propagation Letters, IEEE. 16:1052-1055 2017
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