المؤلفون: Zamani, Milad, Ronchini, Margherita, Huynh, Hai Au, Farkhani, Hooman, Moradi, Farshad

المصدر: 2021 IEEE International Symposium on Circuits and Systems (ISCAS). :1-5 May, 2021

Relation: 2021 IEEE International Symposium on Circuits and Systems (ISCAS)

المؤلفون: Huynh, Hai Au, Ronchini, Margherita, Rashidi, Amin, Tohidi, Mohammad, Farkhani, Hooman, Moradi, Farshad

المصدر: 2019 26th IEEE International Conference on Electronics, Circuits and Systems (ICECS) Electronics, Circuits and Systems (ICECS), 2019 26th IEEE International Conference on. :887-890 Nov, 2019

Relation: 2019 26th IEEE International Conference on Electronics, Circuits and Systems (ICECS)

المؤلفون: Lee, SeungHyuk, Huynh, Hai Au, Han, YoungBong, Choi, DaeHan, Kim, SoYoung

المصدر: 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC) Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), 2019 Joint International Symposium on. :266-269 Jun, 2019

Relation: 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC)

المؤلفون: Han, Youngbong, Lee, SeungHyuk, Huynh, Hai Au, Kim, SoYoung

المصدر: 2019 International Conference on Electronics, Information, and Communication (ICEIC) Electronics, Information, and Communication (ICEIC), 2019 International Conference on. :1-4 Jan, 2019

Relation: 2019 International Conference on Electronics, Information, and Communication (ICEIC)

المؤلفون: Huynh, Hai Au, Zamani, Milad, Ronchini, Margherita, Farkhani, Homan, Moradi, Farshad

المصدر: 2021 IEEE Custom Integrated Circuits Conference (CICC) Custom Integrated Circuits Conference (CICC), 2021 IEEE. :1-2 Apr, 2021

Relation: 2021 IEEE Custom Integrated Circuits Conference (CICC)

المؤلفون: Huynh, Hai Au, Han, Yongbong, Hwang, Jisoo, Song, Eunseok, Kim, SoYoung

المصدر: 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), 2018 IEEE International Symposium on. :345-349 May, 2018

Relation: 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC)

المؤلفون: Huynh, Hai Au, Han, Yongbong, Van Nguyen, Hoang, Kim, SoYoung

المصدر: 2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2018 IEEE. :1-3 Dec, 2018

Relation: 2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)

المؤلفون: Park, SangHyeok, Kim, Kyungsoo, Huynh, Hai Au, Joo, Soyeon, Kim, SoYoung

المصدر: 2016 URSI Asia-Pacific Radio Science Conference (URSI AP-RASC) URSI Asia-Pacific Radio Science Conference (URSI AP-RASC). :915-918 Aug, 2016

Relation: 2016 URSI Asia-Pacific Radio Science Conference (URSI AP-RASC)

المؤلفون: Huynh, Hai Au, Kim, SoYoung

المصدر: 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2015 IEEE. :209-212 Dec, 2015

Relation: 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)

المؤلفون: Park, SangHyeok, Huynh, Hai Au, Kim, SoYoung

المصدر: 2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) Electromagnetic Compatibility of Integrated Circuits (EMC Compo), 2015 10th International Workshop on the. :92-96 Nov, 2015

Relation: 2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)