المؤلفون: Bao, Huynh ND, Osako, Kazufumi, Ohshima, Toshiaki

المصدر: Journal of the Science of Food & Agriculture; Aug2010, Vol. 90 Issue 10, p1634-1641, 8p

المؤلفون: Boulogne LH; Radboud university medical center, P.O. Box 9101, 6500HB Nijmegen, The Netherlands. Electronic address: luuk.boulogne@radboudumc.nl., Lorenz J; University of Augsburg, Universitätsstraße 2, 86159 Augsburg, Germany. Electronic address: julian.lorenz@uni-a.de., Kienzle D; University of Augsburg, Universitätsstraße 2, 86159 Augsburg, Germany., Schön R; University of Augsburg, Universitätsstraße 2, 86159 Augsburg, Germany., Ludwig K; University of Augsburg, Universitätsstraße 2, 86159 Augsburg, Germany., Lienhart R; University of Augsburg, Universitätsstraße 2, 86159 Augsburg, Germany., Jégou S; Independent researcher. Electronic address: simon.jegou.ia@gmail.com., Li G; Keya medical technology co. ltd, Floor 20, Building A, 1 Ronghua South Road, Yizhuang Economic Development Zone, Daxing District, Beijing, PR China. Electronic address: guangl@keyamedical.com., Chen C; Keya medical technology co. ltd, Floor 20, Building A, 1 Ronghua South Road, Yizhuang Economic Development Zone, Daxing District, Beijing, PR China., Wang Q; Keya medical technology co. ltd, Floor 20, Building A, 1 Ronghua South Road, Yizhuang Economic Development Zone, Daxing District, Beijing, PR China., Shi D; Keya medical technology co. ltd, Floor 20, Building A, 1 Ronghua South Road, Yizhuang Economic Development Zone, Daxing District, Beijing, PR China., Maniparambil M; ML-Labs, Dublin City University, N210, Marconi building, Dublin City University, Glasnevin, Dublin 9, Ireland. Electronic address: mayug.maniparambil2@mail.dcu.ie., Müller D; University of Augsburg, Universitätsstraße 2, 86159 Augsburg, Germany; Faculty of Applied Computer Science, University of Augsburg, Germany., Mertes S; Faculty of Applied Computer Science, University of Augsburg, Germany., Schröter N; Faculty of Applied Computer Science, University of Augsburg, Germany., Hellmann F; Faculty of Applied Computer Science, University of Augsburg, Germany., Elia M; Faculty of Applied Computer Science, University of Augsburg, Germany. Electronic address: miriam.elia@informatik.uni-augsburg.de., Dirks I; Vrije Universiteit Brussel, Department of Electronics and Informatics, Pleinlaan 2, 1050 Brussels, Belgium; imec, Kapeldreef 75, 3001 Leuven, Belgium. Electronic address: ine.dirks@vub.be., Bossa MN; Vrije Universiteit Brussel, Department of Electronics and Informatics, Pleinlaan 2, 1050 Brussels, Belgium; imec, Kapeldreef 75, 3001 Leuven, Belgium., Berenguer AD; Vrije Universiteit Brussel, Department of Electronics and Informatics, Pleinlaan 2, 1050 Brussels, Belgium; imec, Kapeldreef 75, 3001 Leuven, Belgium., Mukherjee T; Vrije Universiteit Brussel, Department of Electronics and Informatics, Pleinlaan 2, 1050 Brussels, Belgium; imec, Kapeldreef 75, 3001 Leuven, Belgium., Vandemeulebroucke J; Vrije Universiteit Brussel, Department of Electronics and Informatics, Pleinlaan 2, 1050 Brussels, Belgium; imec, Kapeldreef 75, 3001 Leuven, Belgium., Sahli H; Vrije Universiteit Brussel, Department of Electronics and Informatics, Pleinlaan 2, 1050 Brussels, Belgium; imec, Kapeldreef 75, 3001 Leuven, Belgium., Deligiannis N; Vrije Universiteit Brussel, Department of Electronics and Informatics, Pleinlaan 2, 1050 Brussels, Belgium; imec, Kapeldreef 75, 3001 Leuven, Belgium., Gonidakis P; Vrije Universiteit Brussel, Department of Electronics and Informatics, Pleinlaan 2, 1050 Brussels, Belgium; imec, Kapeldreef 75, 3001 Leuven, Belgium., Huynh ND; Deakin University, Geelong, Australia., Razzak I; University of New South Wales, Sydney, Australia. Electronic address: imran.razzak@deakin.edu.au., Bouadjenek R; Deakin University, Geelong, Australia., Verdicchio M; IRCCS SYNLAB SDN, Naples, Italy. Electronic address: mario.verdicchio@synlab.it., Borrelli P; IRCCS SYNLAB SDN, Naples, Italy., Aiello M; IRCCS SYNLAB SDN, Naples, Italy., Meakin JA; Radboud university medical center, P.O. Box 9101, 6500HB Nijmegen, The Netherlands., Lemm A; Amazon Web Services, Marcel-Breuer-Str. 12, 80807 München, Germany., Russ C; Amazon Web Services, Marcel-Breuer-Str. 12, 80807 München, Germany., Ionasec R; Amazon Web Services, Marcel-Breuer-Str. 12, 80807 München, Germany., Paragios N; Keya medical technology co. ltd, Floor 20, Building A, 1 Ronghua South Road, Yizhuang Economic Development Zone, Daxing District, Beijing, PR China; TheraPanacea, 75004, Paris, France., van Ginneken B; Radboud university medical center, P.O. Box 9101, 6500HB Nijmegen, The Netherlands., Revel-Dubois MP; Department of Radiology, Université de Paris, APHP, Hôpital Cochin, 27 rue du Fg Saint Jacques, 75014 Paris, France.

المصدر: Medical image analysis [Med Image Anal] 2024 Jun 05; Vol. 97, pp. 103230. Date of Electronic Publication: 2024 Jun 05.

نوع المنشور: Journal Article

بيانات الدورية: Publisher: Elsevier Country of Publication: Netherlands NLM ID: 9713490 Publication Model: Print-Electronic Cited Medium: Internet ISSN: 1361-8423 (Electronic) Linking ISSN: 13618415 NLM ISO Abbreviation: Med Image Anal Subsets: MEDLINE

المؤلفون: Luu TT; School of Mechanical Engineering, College of Engineering, Sungkyunkwan University, 2066, Seobu-ro, Jangan-gu, Suwon, Gyeonggi 16419, South Korea. bred96@skku.edu., Huynh ND; School of Mechanical Engineering, College of Engineering, Sungkyunkwan University, 2066, Seobu-ro, Jangan-gu, Suwon, Gyeonggi 16419, South Korea. bred96@skku.edu., Kim H; School of Mechanical Engineering, College of Engineering, Sungkyunkwan University, 2066, Seobu-ro, Jangan-gu, Suwon, Gyeonggi 16419, South Korea. bred96@skku.edu., Lin ZH; Department of Biomedical Engineering, National Taiwan University, Taipei, 10617, Taiwan., Choi D; School of Mechanical Engineering, College of Engineering, Sungkyunkwan University, 2066, Seobu-ro, Jangan-gu, Suwon, Gyeonggi 16419, South Korea. bred96@skku.edu.; Institute of Energy Science & Technology (SIEST), Sungkyunkwan Univeristy, 2066, Seobu-ro, Jangan-gu, Suwon, Gyeonggi 16419, South Korea.

المصدر: Nanoscale [Nanoscale] 2023 Sep 01; Vol. 15 (34), pp. 14205-14214. Date of Electronic Publication: 2023 Sep 01.

نوع المنشور: Journal Article

بيانات الدورية: Publisher: RSC Pub Country of Publication: England NLM ID: 101525249 Publication Model: Electronic Cited Medium: Internet ISSN: 2040-3372 (Electronic) Linking ISSN: 20403364 NLM ISO Abbreviation: Nanoscale Subsets: MEDLINE

المؤلفون: Huynh ND; School of Chemical Engineering, University of Ulsan, Daehak-ro 93, Nam-gu, Ulsan 44610, Republic of Korea., Choi WM; School of Chemical Engineering, University of Ulsan, Daehak-ro 93, Nam-gu, Ulsan 44610, Republic of Korea., Hur SH; School of Chemical Engineering, University of Ulsan, Daehak-ro 93, Nam-gu, Ulsan 44610, Republic of Korea.

المصدر: Nanomaterials (Basel, Switzerland) [Nanomaterials (Basel)] 2023 Aug 31; Vol. 13 (17). Date of Electronic Publication: 2023 Aug 31.

نوع المنشور: Journal Article

بيانات الدورية: Publisher: MDPI AG Country of Publication: Switzerland NLM ID: 101610216 Publication Model: Electronic Cited Medium: Print ISSN: 2079-4991 (Print) Linking ISSN: 20794991 NLM ISO Abbreviation: Nanomaterials (Basel) Subsets: PubMed not MEDLINE

المؤلفون: Choi D; Department of Mechanical Engineering (Integrated Engineering Program), Kyung Hee University, Yongin, Gyeonggi 17104, South Korea., Lee Y; Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, 77 Massachusetts Avenue, Cambridge, Massachusetts 02139, United States.; Department of Mechanical Engineering, Soft Robotics Research Center, Seoul National University, Seoul 08826, South Korea.; Department of Mechanical Engineering, Gachon University, Seongnam 13120, Korea., Lin ZH; Department of Mechanical Engineering (Integrated Engineering Program), Kyung Hee University, Yongin, Gyeonggi 17104, South Korea.; Department of Biomedical Engineering, National Taiwan University, Taipei 10617, Taiwan.; Frontier Research Center on Fundamental and Applied Sciences of Matters, National Tsing Hua University, Hsinchu 30013, Taiwan., Cho S; Department of Mechanical Engineering (Integrated Engineering Program), Kyung Hee University, Yongin, Gyeonggi 17104, South Korea., Kim M; School of Advanced Materials Science & Engineering, Sungkyunkwan University, Suwon 16419, Republic of Korea.; SKKU Institute of Energy Science and Technology (SIEST), Sungkyunkwan University, 2066, Seobu-ro, Jangan-gu, Suwon, Gyeonggi 16419, South Korea., Ao CK; Department of Chemical and Biomolecular Engineering, National University of Singapore, 4 Engineering Drive 4, 117585, Singapore., Soh S; Department of Chemical and Biomolecular Engineering, National University of Singapore, 4 Engineering Drive 4, 117585, Singapore., Sohn C; Division of Advanced Materials Engineering, Jeonbuk National University, 567 Baekje-daero, Deokjin-gu, Jeonju, Jeonbuk 54896, South Korea.; Department of Energy Storage/Conversion Engineering of Graduate School (BK21 FOUR), Jeonbuk National University, 567 Baekje-daero, Deokjin-gu, Jeonju, Jeonbuk 54896, South Korea., Jeong CK; Division of Advanced Materials Engineering, Jeonbuk National University, 567 Baekje-daero, Deokjin-gu, Jeonju, Jeonbuk 54896, South Korea.; Department of Energy Storage/Conversion Engineering of Graduate School (BK21 FOUR), Jeonbuk National University, 567 Baekje-daero, Deokjin-gu, Jeonju, Jeonbuk 54896, South Korea., Lee J; Department of Physics, Inha University, 100 Inha-ro, Michuhol-gu, Incheon 22212, South Korea., Lee M; Department of Physics, Inha University, 100 Inha-ro, Michuhol-gu, Incheon 22212, South Korea., Lee S; School of Materials Science & Engineering, Yeungnam University, Gyeongsan, Gyeongbuk 38541, South Korea., Ryu J; School of Materials Science & Engineering, Yeungnam University, Gyeongsan, Gyeongbuk 38541, South Korea., Parashar P; Department of Biomedical Engineering, National Taiwan University, Taipei 10617, Taiwan., Cho Y; Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon 34141, Republic of Korea., Ahn J; Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon 34141, Republic of Korea., Kim ID; Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon 34141, Republic of Korea., Jiang F; School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Avenue, 639798, Singapore.; Institute of Flexible Electronics Technology of Tsinghua, Jiaxing, Zhejiang 314000, China., Lee PS; School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Avenue, 639798, Singapore., Khandelwal G; Nanomaterials and System Lab, Major of Mechatronics Engineering, Faculty of Applied Energy System, Jeju National University, Jeju 632-43, South Korea.; School of Engineering, University of Glasgow, Glasgow G128QQ, U. K., Kim SJ; Nanomaterials and System Lab, Major of Mechatronics Engineering, Faculty of Applied Energy System, Jeju National University, Jeju 632-43, South Korea., Kim HS; Electronic Materials Research Center, Korea Institute of Science and Technology (KIST), Seoul 02792, Republic of Korea.; Department of Physics, Inha University, Incheon 22212, Republic of Korea., Song HC; Electronic Materials Research Center, Korea Institute of Science and Technology (KIST), Seoul 02792, Republic of Korea.; KIST-SKKU Carbon-Neutral Research Center, Sungkyunkwan University (SKKU), Suwon 16419, Republic of Korea., Kim M; Department of Electrical Engineering, College of Engineering, Chungnam National University, 34134, Daehak-ro, Yuseong-gu, Daejeon 34134, South Korea., Nah J; Department of Electrical Engineering, College of Engineering, Chungnam National University, 34134, Daehak-ro, Yuseong-gu, Daejeon 34134, South Korea., Kim W; School of Mechanical Engineering, College of Engineering, Sungkyunkwan University, 2066, Seobu-ro, Jangan-gu, Suwon, Gyeonggi 16419, South Korea., Menge HG; Department of Mechanical Engineering, College of Engineering, Myongji University, 116 Myongji-ro, Cheoin-gu, Yongin, Gyeonggi 17058, Republic of Korea., Park YT; Department of Mechanical Engineering, College of Engineering, Myongji University, 116 Myongji-ro, Cheoin-gu, Yongin, Gyeonggi 17058, Republic of Korea., Xu W; Research Centre for Humanoid Sensing, Zhejiang Lab, Hangzhou 311100, P. R. China., Hao J; Department of Applied Physics, The Hong Kong Polytechnic University, Hong Kong, P.R. China., Park H; Department of Energy Science and Engineering, Daegu Gyeongbuk Institute of Science and Technology (DGIST), Daegu 42988, Republic of Korea., Lee JH; Department of Energy Science and Engineering, Daegu Gyeongbuk Institute of Science and Technology (DGIST), Daegu 42988, Republic of Korea., Lee DM; School of Advanced Materials Science & Engineering, Sungkyunkwan University, Suwon 16419, Republic of Korea., Kim SW; School of Advanced Materials Science & Engineering, Sungkyunkwan University, Suwon 16419, Republic of Korea.; SKKU Institute of Energy Science and Technology (SIEST), Sungkyunkwan University, 2066, Seobu-ro, Jangan-gu, Suwon, Gyeonggi 16419, South Korea.; Samsung Advanced Institute for Health Sciences & Technology (SAIHST), Sungkyunkwan University, 115, Irwon-ro, Gangnam-gu, Seoul 06351, South Korea.; SKKU Advanced Institute of Nanotechnology (SAINT), Sungkyunkwan University, 2066, Seobu-ro, Jangan-gu, Suwon, Gyeonggi 16419, South Korea., Park JY; School of Advanced Materials Science & Engineering, Sungkyunkwan University, Suwon 16419, Republic of Korea., Zhang H; National Key Laboratory of Science and Technology on Micro/Nano Fabrication; Beijing Advanced Innovation Center for Integrated Circuits, School of Integrated Circuits, Peking University, Beijing 100871, China., Zi Y; Thrust of Sustainable Energy and Environment, The Hong Kong University of Science and Technology (Guangzhou), Nansha, Guangdong 511400, China., Guo R; Thrust of Sustainable Energy and Environment, The Hong Kong University of Science and Technology (Guangzhou), Nansha, Guangdong 511400, China., Cheng J; State Key Laboratory of Tribology in Advanced Equipment, Department of Mechanical Engineering, Tsinghua University, Beijing 100084, China., Yang Z; State Key Laboratory of Tribology in Advanced Equipment, Department of Mechanical Engineering, Tsinghua University, Beijing 100084, China., Xie Y; College of Automation & Artificial Intelligence, State Key Laboratory of Organic Electronics and Information Displays & Institute of Advanced Materials, Jiangsu Key Laboratory for Biosensors, Jiangsu National Synergetic Innovation Center for Advanced Materials, Nanjing University of Posts and Telecommunications, Nanjing, Jiangsu 210023, China., Lee S; School of Mechanical Engineering, Chung-ang University, 84, Heukseok-ro, Dongjak-gu, Seoul 06974, South Korea., Chung J; Department of Mechanical Design Engineering, Kumoh National Institute of Technology (KIT), 61 Daehak-ro, Gumi, Gyeongbuk 39177, South Korea., Oh IK; National Creative Research Initiative for Functionally Antagonistic Nano-Engineering, Department of Mechanical Engineering, School of Mechanical and Aerospace Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, South Korea., Kim JS; National Creative Research Initiative for Functionally Antagonistic Nano-Engineering, Department of Mechanical Engineering, School of Mechanical and Aerospace Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, South Korea., Cheng T; Beijing Institute of Nanoenergy and Nanosystems, Chinese Academy of Sciences, Beijing 101400, China., Gao Q; Beijing Institute of Nanoenergy and Nanosystems, Chinese Academy of Sciences, Beijing 101400, China., Cheng G; Key Lab for Special Functional Materials, Ministry of Education, National & Local Joint Engineering Research Center for High-efficiency Display and Lighting Technology, School of Materials Science and Engineering, and Collaborative Innovation Center of Nano Functional Materials and Applications, Henan University, Kaifeng 475004, China., Gu G; Key Lab for Special Functional Materials, Ministry of Education, National & Local Joint Engineering Research Center for High-efficiency Display and Lighting Technology, School of Materials Science and Engineering, and Collaborative Innovation Center of Nano Functional Materials and Applications, Henan University, Kaifeng 475004, China., Shim M; Department of Electronic Engineering, College of Engineering, Gyeongsang National University, 501, Jinjudae-ro, Gaho-dong, Jinju 52828, South Korea., Jung J; Department of Electrical Engineering, College of Information and Biotechnology, Ulsan National Institute of Science and Technology (UNIST), 50, UNIST-gil, Eonyang-eup, Ulju-gun, Ulsan 44919, South Korea., Yun C; Department of Electrical Engineering, College of Information and Biotechnology, Ulsan National Institute of Science and Technology (UNIST), 50, UNIST-gil, Eonyang-eup, Ulju-gun, Ulsan 44919, South Korea., Zhang C; CAS Center for Excellence in Nanoscience, Beijing Key Laboratory of Micro-nano Energy and Sensor, Beijing Institute of Nanoenergy and Nanosystems, Chinese Academy of Sciences, Beijing 101400, China.; School of Nanoscience and Technology, University of Chinese Academy of Sciences, Beijing 100049, China., Liu G; CAS Center for Excellence in Nanoscience, Beijing Key Laboratory of Micro-nano Energy and Sensor, Beijing Institute of Nanoenergy and Nanosystems, Chinese Academy of Sciences, Beijing 101400, China.; School of Nanoscience and Technology, University of Chinese Academy of Sciences, Beijing 100049, China., Chen Y; Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, 77 Massachusetts Avenue, Cambridge, Massachusetts 02139, United States., Kim S; Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, 77 Massachusetts Avenue, Cambridge, Massachusetts 02139, United States., Chen X; School of Nanoscience and Technology, University of Chinese Academy of Sciences, Beijing 100049, China.; CAS Center for Excellence in Nanoscience, Beijing Institute of Nanoenergy and Nanosystems, Chinese Academy of Sciences, 100083 Beijing, China., Hu J; School of Nanoscience and Technology, University of Chinese Academy of Sciences, Beijing 100049, China.; CAS Center for Excellence in Nanoscience, Beijing Institute of Nanoenergy and Nanosystems, Chinese Academy of Sciences, 100083 Beijing, China., Pu X; School of Nanoscience and Technology, University of Chinese Academy of Sciences, Beijing 100049, China.; CAS Center for Excellence in Nanoscience, Beijing Institute of Nanoenergy and Nanosystems, Chinese Academy of Sciences, 100083 Beijing, China., Guo ZH; School of Nanoscience and Technology, University of Chinese Academy of Sciences, Beijing 100049, China.; CAS Center for Excellence in Nanoscience, Beijing Institute of Nanoenergy and Nanosystems, Chinese Academy of Sciences, 100083 Beijing, China., Wang X; Department of Materials Science and Engineering, University of Wisconsin-Madison, Madison, Wisconsin 53706, United States., Chen J; Department of Bioengineering, University of California, Los Angeles, Los Angeles, California 90095, United States., Xiao X; Department of Bioengineering, University of California, Los Angeles, Los Angeles, California 90095, United States., Xie X; School of Civil & Environmental Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States., Jarin M; School of Civil & Environmental Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States., Zhang H; College of Information and Computer, Taiyuan University of Technology, Taiyuan 030024, P. R. China., Lai YC; Department of Materials Science and Engineering, National Chung Hsing University, Taichung 40227, Taiwan.; i-Center for Advanced Science and Technology, National Chung Hsing University, Taichung 40227, Taiwan.; Innovation and Development Center of Sustainable Agriculture, National Chung Hsing University, Taichung 40227, Taiwan., He T; Department of Electrical and Computer Engineering, National University of Singapore, 4 Engineering Drive 3, 117576, Singapore., Kim H; School of Mechanical Engineering, College of Engineering, Sungkyunkwan University, 2066, Seobu-ro, Jangan-gu, Suwon, Gyeonggi 16419, South Korea., Park I; Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea., Ahn J; Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea., Huynh ND; School of Mechanical Engineering, College of Engineering, Sungkyunkwan University, 2066, Seobu-ro, Jangan-gu, Suwon, Gyeonggi 16419, South Korea., Yang Y; CAS Center for Excellence in Nanoscience, Beijing Key Laboratory of Micro-nano Energy and Sensor, Beijing Institute of Nanoenergy and Nanosystems, Chinese Academy of Sciences, Beijing 101400, China.; School of Nanoscience and Technology, University of Chinese Academy of Sciences, Beijing 100049, China.; Center on Nanoenergy Research, School of Physical Science and Technology, Guangxi University, Nanning 530004, P. R. China., Wang ZL; Beijing Institute of Nanoenergy and Nanosystems, Chinese Academy of Sciences, Beijing 101400, China.; School of Nanoscience and Technology, University of Chinese Academy of Sciences, Beijing 100049, China.; School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States., Baik JM; School of Advanced Materials Science & Engineering, Sungkyunkwan University, Suwon 16419, Republic of Korea.; SKKU Institute of Energy Science and Technology (SIEST), Sungkyunkwan University, 2066, Seobu-ro, Jangan-gu, Suwon, Gyeonggi 16419, South Korea.; KIST-SKKU Carbon-Neutral Research Center, Sungkyunkwan University (SKKU), Suwon 16419, Republic of Korea., Choi D; SKKU Institute of Energy Science and Technology (SIEST), Sungkyunkwan University, 2066, Seobu-ro, Jangan-gu, Suwon, Gyeonggi 16419, South Korea.; School of Mechanical Engineering, College of Engineering, Sungkyunkwan University, 2066, Seobu-ro, Jangan-gu, Suwon, Gyeonggi 16419, South Korea.

المصدر: ACS nano [ACS Nano] 2023 Jun 27; Vol. 17 (12), pp. 11087-11219. Date of Electronic Publication: 2023 May 23.

نوع المنشور: Journal Article; Review

بيانات الدورية: Publisher: American Chemical Society Country of Publication: United States NLM ID: 101313589 Publication Model: Print-Electronic Cited Medium: Internet ISSN: 1936-086X (Electronic) Linking ISSN: 19360851 NLM ISO Abbreviation: ACS Nano Subsets: PubMed not MEDLINE; MEDLINE

المؤلفون: Somasekhar L; Department of Biomedical, Chemical Engineering and Science, Florida Institute of Technology, Melbourne, Florida, USA., Huynh ND; Department of Biomedical, Chemical Engineering and Science, Florida Institute of Technology, Melbourne, Florida, USA., Vecheck A; Department of Biomedical, Chemical Engineering and Science, Florida Institute of Technology, Melbourne, Florida, USA., Kishore V; Department of Biomedical, Chemical Engineering and Science, Florida Institute of Technology, Melbourne, Florida, USA., Bashur CA; Department of Biomedical, Chemical Engineering and Science, Florida Institute of Technology, Melbourne, Florida, USA., Mitra K; Department of Biomedical, Chemical Engineering and Science, Florida Institute of Technology, Melbourne, Florida, USA.

المصدر: Journal of biomedical materials research. Part A [J Biomed Mater Res A] 2022 Mar; Vol. 110 (3), pp. 535-546. Date of Electronic Publication: 2021 Sep 05.

نوع المنشور: Journal Article; Research Support, U.S. Gov't, Non-P.H.S.

بيانات الدورية: Publisher: John Wiley & Sons Country of Publication: United States NLM ID: 101234237 Publication Model: Print-Electronic Cited Medium: Internet ISSN: 1552-4965 (Electronic) Linking ISSN: 15493296 NLM ISO Abbreviation: J Biomed Mater Res A Subsets: MEDLINE

مواضيع طبية MeSH: Bioprinting*/methods , Tissue Scaffolds*/chemistry, Alginates/chemistry ; Gelatin/chemistry ; Human Umbilical Vein Endothelial Cells ; Humans ; Hydrogels/chemistry ; Printing, Three-Dimensional ; Tissue Engineering/methods

المؤلفون: Kim H; Department of Mechanical Engineering (Integrated Engineering Program), Kyung Hee University, Yongin 17104, Republic of Korea., Hwang HJ; Department of Mechanical Engineering (Integrated Engineering Program), Kyung Hee University, Yongin 17104, Republic of Korea., Huynh ND; Department of Mechanical Engineering (Integrated Engineering Program), Kyung Hee University, Yongin 17104, Republic of Korea., Pham KD; Department of Mechanical Engineering (Integrated Engineering Program), Kyung Hee University, Yongin 17104, Republic of Korea., Choi K; Department of Mechanical Engineering, Korea Aerospace University, Goyang 10540, Republic of Korea., Ahn D; Division of Mechanical Engineering, Kongju National University, Cheonan 31080, Republic of Korea., Choi D; Department of Mechanical Engineering (Integrated Engineering Program), Kyung Hee University, Yongin 17104, Republic of Korea.

المصدر: Research (Washington, D.C.) [Research (Wash D C)] 2021 Mar 08; Vol. 2021, pp. 6426130. Date of Electronic Publication: 2021 Mar 08 (Print Publication: 2021).

نوع المنشور: Journal Article

بيانات الدورية: Publisher: American Association for the Advancement of Science Country of Publication: United States NLM ID: 101747148 Publication Model: eCollection Cited Medium: Internet ISSN: 2639-5274 (Electronic) Linking ISSN: 26395274 NLM ISO Abbreviation: Research (Wash D C) Subsets: PubMed not MEDLINE

المؤلفون: Pham TN; National Key Laboratory of Digital Control and System Engineering, Ho Chi Minh University of Technology, VNU-HCM, Ho Chi Minh City 700000, Vietnam.; Faculty of Mechanical Engineering, Ho Chi Minh University of Technology, VNU-HCM, Ho Chi Minh City 700000, Vietnam., Ho APH; Faculty of Electrical and Electronics Engineering, Ho Chi Minh University of Technology, VNU-HCM, Ho Chi Minh City 700000, Vietnam., Nguyen TV; Faculty of Mechanical Engineering, Nha Trang University, Khanh Hoa Province 650000, Vietnam., Nguyen HM; Saigon Center for Development of Industrial Technology and Machinery, Ho Chi Minh City 700000, Vietnam., Truong NH; Faculty of Electrical Engineering, Ba Ria-Vung Tau College of Technology, Ba Ria - Vung Tau Province 78000, Vietnam., Huynh ND; Faculty of Mechanical Engineering, Ho Chi Minh University of Technology, VNU-HCM, Ho Chi Minh City 700000, Vietnam., Nguyen TH; Faculty of Mechanical Engineering, Ho Chi Minh University of Technology, VNU-HCM, Ho Chi Minh City 700000, Vietnam., Dung LT; Division of Computational Physics, Institute for Computational Science, Ton Duc Thang University, Ho Chi Minh City 700000, Vietnam.; Faculty of Electrical and Electronics Engineering, Ton Duc Thang University, Ho Chi Minh City 700000, Vietnam.

المصدر: Sensors (Basel, Switzerland) [Sensors (Basel)] 2020 Apr 06; Vol. 20 (7). Date of Electronic Publication: 2020 Apr 06.

نوع المنشور: Journal Article

بيانات الدورية: Publisher: MDPI Country of Publication: Switzerland NLM ID: 101204366 Publication Model: Electronic Cited Medium: Internet ISSN: 1424-8220 (Electronic) Linking ISSN: 14248220 NLM ISO Abbreviation: Sensors (Basel) Subsets: PubMed not MEDLINE; MEDLINE

المؤلفون: Bhatia D; Department of Mechanical Engineering, Kyung Hee University, 1732 Deogyeong-daero, Giheung-gu, Yongin-si, Gyeonggi-do, 17104, South Korea., Hwang HJ; Department of Mechanical Engineering, Kyung Hee University, 1732 Deogyeong-daero, Giheung-gu, Yongin-si, Gyeonggi-do, 17104, South Korea., Huynh ND; Department of Mechanical Engineering, Kyung Hee University, 1732 Deogyeong-daero, Giheung-gu, Yongin-si, Gyeonggi-do, 17104, South Korea., Lee S; School of Mechanical Engineering, Chung-Ang University, 84 Heukseuk-ro, Dongjak-gu, Seoul, 06974, South Korea., Lee C; Department of Mechanical Engineering, Kyung Hee University, 1732 Deogyeong-daero, Giheung-gu, Yongin-si, Gyeonggi-do, 17104, South Korea., Nam Y; Department of Mechanical Engineering, Kyung Hee University, 1732 Deogyeong-daero, Giheung-gu, Yongin-si, Gyeonggi-do, 17104, South Korea., Kim JG; Department of Mechanical Engineering, Kyung Hee University, 1732 Deogyeong-daero, Giheung-gu, Yongin-si, Gyeonggi-do, 17104, South Korea., Choi D; Department of Mechanical Engineering, Kyung Hee University, 1732 Deogyeong-daero, Giheung-gu, Yongin-si, Gyeonggi-do, 17104, South Korea. dchoi@khu.ac.kr.

المصدر: Scientific reports [Sci Rep] 2019 Jun 03; Vol. 9 (1), pp. 8223. Date of Electronic Publication: 2019 Jun 03.

نوع المنشور: Journal Article

بيانات الدورية: Publisher: Nature Publishing Group Country of Publication: England NLM ID: 101563288 Publication Model: Electronic Cited Medium: Internet ISSN: 2045-2322 (Electronic) Linking ISSN: 20452322 NLM ISO Abbreviation: Sci Rep Subsets: PubMed not MEDLINE

المؤلفون: Park HW; Department of Mechanical Engineering, Kyung Hee University, 1732 Deogyeong-daero, Giheung-gu, Yongin-Si, Gyeonggi-do 446-701, Korea. mnphwcj@gmail.com.; Department of Physics and Semiconductor Science, Dongguk University, Seoul 100-715, Korea. mnphwcj@gmail.com., Huynh ND; Department of Mechanical Engineering, Kyung Hee University, 1732 Deogyeong-daero, Giheung-gu, Yongin-Si, Gyeonggi-do 446-701, Korea. hdnghia567@gmail.com., Kim W; Department of Mechanical Engineering, Kyung Hee University, 1732 Deogyeong-daero, Giheung-gu, Yongin-Si, Gyeonggi-do 446-701, Korea. choice124@hanmail.net., Hwang HJ; Department of Mechanical Engineering, Kyung Hee University, 1732 Deogyeong-daero, Giheung-gu, Yongin-Si, Gyeonggi-do 446-701, Korea. chgw8584@hanmail.net., Hong H; Department of Physics and Semiconductor Science, Dongguk University, Seoul 100-715, Korea. ggm0218@naver.com., Choi K; Department of Physics and Semiconductor Science, Dongguk University, Seoul 100-715, Korea. cransia@hanmail.net., Song A; Department of Physics and Semiconductor Science, Dongguk University, Seoul 100-715, Korea. aeransong@dongguk.edu., Chung KB; Department of Physics and Semiconductor Science, Dongguk University, Seoul 100-715, Korea. kbchung@dongguk.edu., Choi D; Department of Mechanical Engineering, Kyung Hee University, 1732 Deogyeong-daero, Giheung-gu, Yongin-Si, Gyeonggi-do 446-701, Korea. dchoi@khu.ac.kr.

المصدر: Micromachines [Micromachines (Basel)] 2018 Aug 17; Vol. 9 (8). Date of Electronic Publication: 2018 Aug 17.

نوع المنشور: Journal Article

بيانات الدورية: Publisher: MDPI Country of Publication: Switzerland NLM ID: 101640903 Publication Model: Electronic Cited Medium: Print ISSN: 2072-666X (Print) Linking ISSN: 2072666X NLM ISO Abbreviation: Micromachines (Basel) Subsets: PubMed not MEDLINE