يعرض 1 - 10 نتائج من 31 نتيجة بحث عن '"Hyung-Kyu Choi"', وقت الاستعلام: 1.88s تنقيح النتائج
  1. 1
    مؤتمر
    A Highly-Sensitive Differential-Mode Microchemical Sensor Using TFBARs with On-Chip Microheater for Volatile Organic Compound (VOC) Detection

    المؤلفون: Heon-Min Lee, Hong-Teuk Kim, Hyung-Kyu Choi, Hee-Chul Lee, Hyung-Ki Hong, Don-Hee Lee, Joung-Uk Bu, Euisik Yoon

    المصدر: 19th IEEE International Conference on Micro Electro Mechanical Systems Micro Electro Mechanical Systems, 2006. MEMS 2006 Istanbul. 19th IEEE International Conference on. :490-493 2006

    Relation: 19th IEEE International Conference on Micro Electro Mechanical Systems

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  2. 2
    مؤتمر
    High efficiency and linear dual chain power amplifier without/with automatic bias current control for CDMA handset applications

    المؤلفون: Hong-Teuk Kim, Ki-Hong Lee, Hyung-Kyu Choi, Ji-Youn Choi, Kyung-Hak Lee, Jin-Pil Kim, Gi-Hyon Ryu, Yong-Jocin Jeon, Choong-Soo Han, Keechul Kim, Kyungho Lee

    المصدر: 34th European Microwave Conference, 2004. Microwave Conference, 2004. 34th European. 1:337-340 2004

    Relation: 34th European Microwave Conference

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  3. 3
    مؤتمر
    A thermally driven tunable TFBAR bandpass filter

    المؤلفون: Hong-Teuk Kim, Heon-Min Lee, Hyung-Kyu Choi, Jae-Young Park, Jong-Uk Bu, Kyungho Lee

    المصدر: 34th European Microwave Conference, 2004. Microwave Conference, 2004. 34th European. 1:491-494 2004

    Relation: 34th European Microwave Conference

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  4. 4
    مؤتمر
    Flip chip interconnection using anisotropic conductive adhesives for RF and high frequency applications

    المؤلفون: Myung-Jin Yim, In ho Jung, Hyung-Kyu Choi, Kijoong Kim, Jia-Sang Hwang, Jin-Yong Ahn, Woonseong Kwon, Kyung Wook Paik

    المصدر: 53rd Electronic Components and Technology Conference, 2003. Proceedings. Electronic Components and Technology Conference, 2003. Proceedings. 53rd. :1398-1403 2003

    Relation: 53rd Electronic Components and Technology Conference, 2003. Proceedings.

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  5. 5
    مؤتمر
    A 5 to 27 GHz MMIC power amplifier

    المؤلفون: Kye-Ik Jeon, Jae-Hak Lee, Seung-Won Paek, Dong-Wook Kim, Won-Sang Lee, Chae-Rok Lim, Ho-Young Cha, Hyung-Kyu Choi, Ki-Woong Chung

    المصدر: 2000 IEEE MTT-S International Microwave Symposium Digest (Cat. No.00CH37017) Microwave symposium Microwave Symposium Digest. 2000 IEEE MTT-S International. 1:541-544 vol.1 2000

    Relation: 2000 IEEE MTT-S International Microwave Symposium Digest

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  6. 6
    دورية أكاديمية
    Flip chip interconnection with anisotropic conductive adhesives for RF and high-frequency applications

    المؤلفون: Myung Jin Yim, In Ho Jeong, Hyung-Kyu Choi, Jin-Sang Hwang, Jin-Yong Ahn, Woonseong Kwon, Kyung-Wook Paik

    المصدر: IEEE Transactions on Components and Packaging Technologies IEEE Trans. Comp. Packag. Technol. Components and Packaging Technologies, IEEE Transactions on. 28(4):789-796 Dec, 2005

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  7. 7
    Design of Safe Internal Network with the Use of Active Tracking System

    المؤلفون: Hyung-Kyu Choi, Seung-jung Shin

    المصدر: International Journal of Security and Its Applications. 8:291-300

    مصطلحات موضوعية: General Computer Science, Computer science, business.industry, Real-time computing, Tracking system, business

    URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::85568f00f49e226acd9c9c9ee6212f35
    https://doi.org/10.14257/ijsia.2014.8.2.30

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  8. 8
    Client ahead-of-time compiler for embedded Java platforms

    المؤلفون: Sunghyun Hong, Jin-Chul Kim, Soo-Mook Moon, Jin Woo Shin, Jaemok Lee, Hyeong-Seok Oh, Hyung-Kyu Choi

    المصدر: Software: Practice and Experience. 39:259-278

    مصطلحات موضوعية: Software

    URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::17aa870328b5cb4e37bc74f9412aaadb
    https://doi.org/10.1002/spe.897

    View record at Wiley
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  9. 9
    Flip chip interconnection with anisotropic conductive adhesives for RF and high-frequency applications

    المؤلفون: Kyung-Wook Paik, Hyung-Kyu Choi, Jin-Yong Ahn, Woon-Seong Kwon, Jin-Sang Hwang, Myung Jin Yim, In Ho Jeong

    المصدر: IEEE Transactions on Components and Packaging Technologies. 28:789-796

    مصطلحات موضوعية: Thermal copper pillar bump, Interconnection, Materials science, business.industry, Electrical engineering, Anisotropic conductive film, Hardware_PERFORMANCEANDRELIABILITY, Integrated circuit, RF module, Electronic, Optical and Magnetic Materials, law.invention, law, Hardware_INTEGRATEDCIRCUITS, Radio frequency, Electrical and Electronic Engineering, business, Flip chip, Electronic circuit

    URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::3d5f0c0034d42ac0b6fc635a7013c337
    https://doi.org/10.1109/tcapt.2005.859750

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  10. 10
    Java Memory Allocation with Lazy Worst Fit for Small Objects

    المؤلفون: Hyung-Kyu Choi, Soo-Mook Moon, Yoo C. Chung

    المصدر: The Computer Journal. 48:437-442

    مصطلحات موضوعية: Manual memory management, General Computer Science, Java, Computer science, Scala, strictfp, Parallel computing, computer.software_genre, Java concurrency, Real time Java, Pointer (computer programming), Operating system, computer, computer.programming_language, Garbage collection

    URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::6d0b96ec365725f8638ed61db1cfba76
    https://doi.org/10.1093/comjnl/bxh101

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