يعرض 1 - 10 نتائج من 814 نتيجة بحث عن '"I. Charles"', وقت الاستعلام: 1.57s تنقيح النتائج
  1. 1
    مؤتمر
    Non-destructive Failure Analysis of Various Chip to Package Interaction Anomalies in FCBGA Packages Subjected to Temperature Cycle Reliability Testing

    المؤلفون: B. Reddy, Vishnu V., Ume, I. Charles, Williamson, Jaimal, Nguyen, Luu

    المصدر: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :1333-1338 May, 2019

    Relation: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

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  2. 2
    مؤتمر
    Non-destructive Inspection of Flip-Chip BGA Solder Ball Defects Using Two Laser Beam Probe Ultrasonic Inspection Technique

    المؤلفون: B. Reddy, Vishnu V., Ume, I. Charles, Mebane, Aaron, Imediegwu, Chidinma, Akinade, Kola, Chaudhuri, Amiya R., Rogers, Bryan, Hill, Mark, Guirguis, Cherif, Lee, Tae-Kyu

    المصدر: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2018 IEEE 68th. :764-770 May, 2018

    Relation: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC)

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  3. 3
    دورية أكاديمية

    لا يتم عرض هذه النتيجة على الضيوف.

    View this record from ISI Web of Science
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  4. 4
    Jack Fruit: An Estimation of Hunteria Umbellata Fruit Extract against Formalin Induced Nociception

    المؤلفون: Ifedi I. Charles, Ifedi O. Blessing, Nwafor C. Charles, Igwedibia C. Paul, Okoye O. Fidelis

    المصدر: Journal of Advances in Medicine and Medical Research. 35:31-38

    مصطلحات موضوعية: General Medicine

    URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::ebbebc17bfdb611e312f6243cf3c8c11
    https://doi.org/10.9734/jammr/2023/v35i115025

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  5. 5
    مؤتمر
    Effects of warpage on fatigue reliability of solder bumps: Experimental and analytical studies

    المؤلفون: Wei Tan, Ume, I. Charles, Ying Hung, Wu, C. F. Jeff

    المصدر: 2008 58th Electronic Components and Technology Conference Electronic Components and Technology Conference, 2008. ECTC 2008. 58th. :131-138 May, 2008

    Relation: 2008 58th Electronic Components and Technology Conference (ECTC 2008)

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  6. 6
    مؤتمر
    Thermomechanical reliability study of flip-chip solder bumps: Using laser ultrasound technique and finite element method

    المؤلفون: Yang, Jin, Ume, I. Charles

    المصدر: 2008 58th Electronic Components and Technology Conference Electronic Components and Technology Conference, 2008. ECTC 2008. 58th. :611-622 May, 2008

    Relation: 2008 58th Electronic Components and Technology Conference (ECTC 2008)

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  7. 7
    مؤتمر
    Board-Level Solder Joint Reliability Study of Land Grid Array Packages for RF Applications Using a Laser Ultrasound Inspection System

    المؤلفون: Yang, Jin, Zhang, Lizheng, Ume, I. Charles, Ghiu, Camil, White, George

    المصدر: 2007 Proceedings 57th Electronic Components and Technology Conference Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th. :1530-1535 Jun, 2007

    Relation: 2007 57th Electronic Components and Technology Conference

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  8. 8
    مؤتمر
    Warpage Measurement of Board Assemblies Using Projection Moire System with Improved Automatic Image Segmentation Algorithm

    المؤلفون: Tan, Wei, Ume, I. Charles

    المصدر: 2007 Proceedings 57th Electronic Components and Technology Conference Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th. :1769-1774 Jun, 2007

    Relation: 2007 57th Electronic Components and Technology Conference

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  9. 9
    Assessment of Financial Reporting on Investment Decision of Deposit Money Bank in Nigeria

    المؤلفون: J. Mambula I. Charles, Felix Francis, Clifford Tizhe Oaya Zirra

    المصدر: Archives of Business Research. 10:196-203

    مصطلحات موضوعية: Environmental Engineering

    URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::58260a785ec1a0240b95947647681880
    https://doi.org/10.14738/abr.1012.13687

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  10. 10
    Application of GeoGebra in Model Based Learning and Students' Academic Performance in Solid Geometry

    المؤلفون: Ekemini T. Akpan, Gladys I. Charles-Ogan, Edith C. Onyeka, Godwin D. James

    المصدر: International Journal of Science and Research (IJSR). 11:1054-1059

    مصطلحات موضوعية: General Medicine, General Chemistry

    URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::e5d5eba0398cf52a089c70be3e29e141
    https://doi.org/10.21275/sr221110054710

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