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1مؤتمر
المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :748-753 May, 2024
Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
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2مؤتمر
المؤلفون: Liu, Ruoke, Mumcu, Gokhan, Wang, Jing
المصدر: 2024 IEEE Wireless and Microwave Technology Conference (WAMICON) Wireless and Microwave Technology Conference (WAMICON), 2024 IEEE. :1-3 Apr, 2024
Relation: 2024 IEEE Wireless and Microwave Technology Conference (WAMICON)
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3دورية أكاديمية
المؤلفون: Li, F.
المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 14(4):705-713 Apr, 2024
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4دورية أكاديمية
المصدر: IEEE Robotics and Automation Letters IEEE Robot. Autom. Lett. Robotics and Automation Letters, IEEE. 9(4):3878-3885 Apr, 2024
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5مؤتمر
المؤلفون: Pfahler, Tim, Gold, Gerald, Bachbauer, Felix, Schur, Jan, Vossiek, Martin
المصدر: 2023 53rd European Microwave Conference (EuMC) Microwave Conference (EuMC), 2023 53rd European. :568-571 Sep, 2023
Relation: 2023 53rd European Microwave Conference (EuMC)
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6دورية أكاديمية
المؤلفون: Cheng, Yu-Chi, Chen, Yu-Hsien, Hung, Hao-Hsi, Hwang, Sheng-JyeAff1, IDs0036602402022x_cor4, Chen, Dao-Long, Chang, Hui-Jing, Huang, Bing-Yuan, Huang, Hung-Hsien, Wang, Chen-Chao, Hung, Chih-Pin
المصدر: Engineering with Computers: An International Journal for Simulation-Based Engineering. :1-18
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7دورية أكاديمية
المصدر: IEEE Transactions on Engineering Management IEEE Trans. Eng. Manage. Engineering Management, IEEE Transactions on. 70(1):196-208 Jan, 2023
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8دورية أكاديمية
المؤلفون: Zhao, B., Bai, S., Fan, J., Achkir, B., Ruehli, A.
المصدر: IEEE Transactions on Signal and Power Integrity IEEE Trans. Signal and Power Integr. Signal and Power Integrity, IEEE Transactions on. 2:23-31 2023
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9مؤتمر
المؤلفون: Xi, Chengjie, Jessurun, Nathan, True, John, Khan, Aslam A., Tehranipoor, Mark M., Asadizanjani, Navid
المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :2249-2255 May, 2022
Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
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10دورية أكاديمية
المؤلفون: McGarry, M.P., Lee, M.
المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 12(9):1575-1582 Sep, 2022