يعرض 1 - 10 نتائج من 346 نتيجة بحث عن '"IC packaging"', وقت الاستعلام: 1.31s تنقيح النتائج
  1. 1
    مؤتمر
    High-Performance Polymer Microwave Fiber Coupler in eWLB Package for Sub-THz Communication

    المؤلفون: Liakonis, Vasileios, Papananos, Yannis, Wojnowski, Maciej, Hartner, Walter

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :748-753 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  2. 2
    مؤتمر
    Towards Additive Manufacturing Based Packaging of Mm-Wave Antenna Arrays and Beamformer ICs

    المؤلفون: Liu, Ruoke, Mumcu, Gokhan, Wang, Jing

    المصدر: 2024 IEEE Wireless and Microwave Technology Conference (WAMICON) Wireless and Microwave Technology Conference (WAMICON), 2024 IEEE. :1-3 Apr, 2024

    Relation: 2024 IEEE Wireless and Microwave Technology Conference (WAMICON)

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  3. 3
    دورية أكاديمية
    Flip-Chip Bonding for SiC Integrated Circuits With Gold Stud Bumps for High Temperature Up To 600 °C Applications

    المؤلفون: Li, F.

    المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 14(4):705-713 Apr, 2024

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  4. 4
    دورية أكاديمية
    Near-Optimal Scheduling for IC Packaging Operations Considering Processing-Time Variations and Factory Practices

    المؤلفون: Tsai, T., Yan, B., Luh, P.B., Yang, H., Bragin, M.A., Cheng, F.

    المصدر: IEEE Robotics and Automation Letters IEEE Robot. Autom. Lett. Robotics and Automation Letters, IEEE. 9(4):3878-3885 Apr, 2024

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  5. 5
    مؤتمر
    Complex Permittivity Extraction of IC-Package Materials beyond 110 GHz by Band-Limited Waveguide-Cavity Measurements

    المؤلفون: Pfahler, Tim, Gold, Gerald, Bachbauer, Felix, Schur, Jan, Vossiek, Martin

    المصدر: 2023 53rd European Microwave Conference (EuMC) Microwave Conference (EuMC), 2023 53rd European. :568-571 Sep, 2023

    Relation: 2023 53rd European Microwave Conference (EuMC)

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  6. 6
    دورية أكاديمية
    Accurate numerical simulations of capillary underfill process for flip-chip packages

    المؤلفون: Cheng, Yu-Chi, Chen, Yu-Hsien, Hung, Hao-Hsi, Hwang, Sheng-JyeAff1, IDs0036602402022x_cor4, Chen, Dao-Long, Chang, Hui-Jing, Huang, Bing-Yuan, Huang, Hung-Hsien, Wang, Chen-Chao, Hung, Chih-Pin

    المصدر: Engineering with Computers: An International Journal for Simulation-Based Engineering. :1-18

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  7. 7
    دورية أكاديمية
    Identification and Rating of Workforce Competencies for Manufacturing Process Engineers: Case Study of an IC Packaging Process Engineer

    المؤلفون: Kao, L., Chiu, C., Lu, C., Wu, C.

    المصدر: IEEE Transactions on Engineering Management IEEE Trans. Eng. Manage. Engineering Management, IEEE Transactions on. 70(1):196-208 Jan, 2023

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  8. 8
    دورية أكاديمية
    PEEC Modeling in 3D IC/Packaging Applications Based on Layered Green's Functions

    المؤلفون: Zhao, B., Bai, S., Fan, J., Achkir, B., Ruehli, A.

    المصدر: IEEE Transactions on Signal and Power Integrity IEEE Trans. Signal and Power Integr. Signal and Power Integrity, IEEE Transactions on. 2:23-31 2023

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  9. 9
    مؤتمر
    Machine Learning Assisted Counterfeit IC Detection through Non-destructive Infrared (IR) Spectroscopy Material Characterization

    المؤلفون: Xi, Chengjie, Jessurun, Nathan, True, John, Khan, Aslam A., Tehranipoor, Mark M., Asadizanjani, Navid

    المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :2249-2255 May, 2022

    Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

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  10. 10
    دورية أكاديمية
    Broadband Dielectric Properties of Integrated Circuit Packaging Materials Across the 6G Spectrum

    المؤلفون: McGarry, M.P., Lee, M.

    المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 12(9):1575-1582 Sep, 2022

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