يعرض 1 - 10 نتائج من 10,156 نتيجة بحث عن '"ICs"', وقت الاستعلام: 1.66s تنقيح النتائج
  1. 1
    دورية أكاديمية
    Abnormal Logical Representation Learning for Intrusion Detection in Industrial Control Systems

    المؤلفون: Xu, X., Lai, Y., Zhang, X., Dong, X.

    المصدر: IEEE Transactions on Industrial Informatics IEEE Trans. Ind. Inf. Industrial Informatics, IEEE Transactions on. 20(8):10624-10635 Aug, 2024

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  2. 2
    دورية أكاديمية
    Voltage Skew-Based Test Technique for Pre-Bond TSVs in 3-D ICs

    المؤلفون: Liu, J., Chen, Z., Chen, T., Wu, X., Liang, H., Yuan, X.

    المصدر: IEEE Transactions on Circuits and Systems II: Express Briefs IEEE Trans. Circuits Syst. II Circuits and Systems II: Express Briefs, IEEE Transactions on. 71(8):3930-3934 Aug, 2024

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  3. 3
    دورية أكاديمية
    Systematic Design Methodology for CMOS Millimeter-Wave Power Amplifiers With an E-Band Fully Differential Implementation in 16-nm FinFET

    المؤلفون: Lauritano, M., Baumgartner, P., Singh, P., Ulusoy, A.C., Guizan, C.M.

    المصدر: IEEE Transactions on Microwave Theory and Techniques IEEE Trans. Microwave Theory Techn. Microwave Theory and Techniques, IEEE Transactions on. 72(8):4650-4659 Aug, 2024

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  4. 4
    دورية أكاديمية
    Hier-3D: A Methodology for Physical Hierarchy Exploration of 3-D ICs

    المؤلفون: Bethur, N.E., Agnesina, A., Brunion, M., Garcia-Ortiz, A., Catthoor, F., Milojevic, D., Komalan, M., Cavalcante, M., Riedel, S., Benini, L., Lim, S.K.

    المصدر: IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst. Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on. 43(7):1957-1970 Jul, 2024

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  5. 5
    دورية أكاديمية
    CGAAD: Centrality- and Graph-Aware Deep-Learning Model for Detecting Cyberattacks Targeting Industrial Control Systems in Critical Infrastructure

    المؤلفون: Alrumaih, T.N.I., Alenazi, M.J.F.

    المصدر: IEEE Internet of Things Journal IEEE Internet Things J. Internet of Things Journal, IEEE. 11(13):24162-24182 Jul, 2024

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  6. 6
    دورية أكاديمية
    Fault Diagnosis for Resistive Random Access Memory and Monolithic Inter-Tier Vias in Monolithic 3-D Integration

    المؤلفون: Hung, S., Chaudhuri, A., Banerjee, S., Chakrabarty, K.

    المصدر: IEEE Transactions on Very Large Scale Integration (VLSI) Systems IEEE Trans. VLSI Syst. Very Large Scale Integration (VLSI) Systems, IEEE Transactions on. 32(7):1336-1349 Jul, 2024

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  7. 7
    دورية أكاديمية
    Large Memory Window Antifuse HfO₂-Based One-Resistor and One-OTP NVMs Featuring Excellent Disturbance Tolerance and Robust 200 °C Retention

    المؤلفون: Hsieh, D., Ni, J., Yeh, W., Hong, Z., Luo, H., Hsu, M., Cho, T., Chao, T.

    المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 71(4):2824-2829 Apr, 2024

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  8. 8
    مؤتمر
    Leveraging the MITRE ATT&CK Framework for Threat Identification and Evaluation in Industrial Control System Simulations

    المؤلفون: Ekisa, Conrad, O Briain, Diarmuid, Kavanagh, Yvonne

    المصدر: 2024 35th Irish Signals and Systems Conference (ISSC) Signals and Systems Conference (ISSC), 2024 35th Irish. :1-6 Jun, 2024

    Relation: 2024 35th Irish Signals and Systems Conference (ISSC)

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  9. 9
    مؤتمر
    Modelling and Simulating Advanced Cyber-threats to Industrial Control Systems with an Emulated Testbed

    المؤلفون: Ekisa, Conrad, Briain, Diarmuid O, Kavanagh, Yvonne

    المصدر: 2024 35th Irish Signals and Systems Conference (ISSC) Signals and Systems Conference (ISSC), 2024 35th Irish. :1-6 Jun, 2024

    Relation: 2024 35th Irish Signals and Systems Conference (ISSC)

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  10. 10
    مؤتمر
    System Design and Models for Active Materials

    المؤلفون: Ehrenhofer, Adrian, Bakardjiev, Petko, Wang, Yawen, Voigt, Andreas, Marschner, Uwe, Richter, Andreas, Wallmersperger, Thomas

    المصدر: 2024 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2024 Symposium on. :1-6 Jun, 2024

    Relation: 2024 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)

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