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1مؤتمر
المؤلفون: Kosler, Florian, Hertweck, Raphael, Fleischer, Jurgen
المصدر: 2024 1st International Conference on Production Technologies and Systems for E-Mobility (EPTS) Production Technologies and Systems for E-Mobility (EPTS), 2024 1st International Conference on. :1-6 Jun, 2024
Relation: 2024 1st International Conference on Production Technologies and Systems for E-Mobility (EPTS)
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2مؤتمر
المؤلفون: Ou-khouya, Abdelkarim, Mes-adi, Hassane, Taoufiki, Meryem, Ibrahim, Imane Ait, El Harfouf, Amin, Herbazi, Rachid, Tahiri, Mohamed
المصدر: 2024 4th International Conference on Innovative Research in Applied Science, Engineering and Technology (IRASET) Innovative Research in Applied Science, Engineering and Technology (IRASET), 2024 4th International Conference on. :1-5 May, 2024
Relation: 2024 4th International Conference on Innovative Research in Applied Science, Engineering and Technology (IRASET)
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3مؤتمر
المؤلفون: Chou, Ching-Ting, Ding, Jian-Jiun, Chang, Meng-Lin
المصدر: 2024 IEEE 4th International Conference on Electronic Communications, Internet of Things and Big Data (ICEIB) Electronic Communications, Internet of Things and Big Data (ICEIB), 2024 IEEE 4th International Conference on. :19-23 Apr, 2024
Relation: 2024 IEEE 4th International Conference on Electronic Communications, Internet of Things and Big Data (ICEIB)
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4مؤتمر
المصدر: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :829-833 Dec, 2023
Relation: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
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5دورية أكاديمية
المؤلفون: Babu, V. Madhu, Kalali, Deekshith G., Patel, Mahesh, Reddy, G. Madhusudhan, Rao, K. Bhanu Sankara, Rajulapati, Koteswararao V.Aff1, IDs12666024034096_cor6
المصدر: Transactions of the Indian Institute of Metals. :1-10
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6مؤتمر
المؤلفون: Lee, Po-Yi, Chen, Kuo-Shen, Chiu, Tz-Cheng, Yang, Tian-Shiang, Ho, Ching-Jenq, Chen, Lien-Wen
المصدر: 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :285-286 Apr, 2024
Relation: 2024 International Conference on Electronics Packaging (ICEP)
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7مؤتمر
المؤلفون: Zhu, Xintong, Roslan, Amirul Afiq Hamizan M, Xie, Jun, Ong, Kian Kok, Yip, Kim Hong, Nistala, Ramesh Rao, Mo, Zhi Qiang
المصدر: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2023 IEEE International Symposium on the. :1-5 Jul, 2023
Relation: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
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8دورية أكاديمية
المؤلفون: Rodriguez De Vecchis, Pierangeli, Frederick, KaterinaAff1, Aff2, Elhassid, Drew, Chmielus, MarkusAff1, IDs40964024007195_cor4
المصدر: Progress in Additive Manufacturing. :1-9
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9دورية أكاديمية
المؤلفون: Karthik, M. K., Suresh Kumar, C.Aff1, IDs11668024019966_cor2, Sundararaj, M.
المصدر: Journal of Failure Analysis and Prevention. :1-12
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10دورية أكاديمية
المؤلفون: Yadav, Kamal Bahadur, Kumari, RenuAff1, IDs1166502409871z_cor2
المصدر: Journal of Materials Engineering and Performance. :1-16