المؤلفون: Yi, M., Zhu, W., Wu, P., Qiu, Y., Sun, G., Wang, L.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 14(7):1149-1155 Jul, 2024

المؤلفون: MD Ashif, Nowab Reza, Gengenbach, Ulrich, Sieber, Ingo

المصدر: 2024 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2024 Symposium on. :1-5 Jun, 2024

Relation: 2024 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)

المؤلفون: Rodríguez González, Raquel

المساهمون: University/Department: Universitat Internacional de Catalunya. Departament de Ciències Bàsiques

مرشدي الرسالة: Pérez Antoñanzas, Román, Delgado Garoña, Luis María

المصدر: TDX (Tesis Doctorals en Xarxa)

مصطلحات موضوعية: Silica, Hybrids, 3D Printing, Bone regeneration, Sol-gel, Inks, Silica-gelatin, Tissue engineering, Gelatin, Ciencias de la salud

وصف الملف: application/pdf

URL الوصول: http://hdl.handle.net/10803/688420

المؤلفون: Elsharief, M., Emran, A., Hassan, H., Sabuj, S.R., Jo, H.

المصدر: IEEE Transactions on Industrial Informatics IEEE Trans. Ind. Inf. Industrial Informatics, IEEE Transactions on. 20(6):8548-8558 Jun, 2024

المؤلفون: Dewan, Prachi, Singh, Mahender, Mittal, Manisha, Kaur, Harjot, Gandhi, Neeraj

المصدر: 2024 11th International Conference on Computing for Sustainable Global Development (INDIACom) Computing for Sustainable Global Development (INDIACom), 2024 11th International Conference on. :517-523 Feb, 2024

Relation: 2024 11th International Conference on Computing for Sustainable Global Development (INDIACom)

المؤلفون: Romero, Elbert Contreras, Sanchez Hernandez, Sergio, Acosta, Alex Morales

المصدر: 2023 IEEE Colombian Caribbean Conference (C3) Colombian Caribbean Conference (C3), 2023 IEEE. :1-5 Nov, 2023

Relation: 2023 IEEE Colombian Caribbean Conference (C3)

المؤلفون: Alluhaybi, A., Halliday, D., Szablewski, M., Bowen, L.

المصدر: IEEE Journal of Photovoltaics IEEE J. Photovoltaics Photovoltaics, IEEE Journal of. 14(2):240-245 Mar, 2024

المؤلفون: Gomez, A., Yelamanchi, B., Maurel, A., Martinez, A.C., Feldhausen, T., Shivakumar, J., Rojas, E., Lin, Y., Cortes, P., MacDonald, E., Roberson, D.A.

المصدر: IEEE Access Access, IEEE. 12:92295-92305 2024

المؤلفون: Mohan, Nihesh, Ahuir-Torres, Juan Ignacio, Bhogaraju, Sri Krishna, Kotadia, Hiren, Elger, Gordon

المصدر: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) Microelectronics and Packaging Conference & Exhibition (EMPC), 2023 24th European. :1-7 Sep, 2023

Relation: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)

المؤلفون: Metzger, William A., Davidson, Laura, Ouchen, Fahima, Aga, Roberto, Pandhi, Twinkle, Bartsch, Carrie, Heckman, Emily, Mian, Ahsan

المصدر: NAECON 2023 - IEEE National Aerospace and Electronics Conference Aerospace and Electronics Conference, NAECON 2023 - IEEE National. :1-5 Aug, 2023

Relation: NAECON 2023 - IEEE National Aerospace and Electronics Conference