المؤلفون: Coll-Perales, B., Lucas-Estan, M.C., Altintas, O., Gozalvez, J., Khan, M. I., Sepulcre, M.

المصدر: 2024 IEEE Vehicular Networking Conference (VNC) Vehicular Networking Conference (VNC), 2024 IEEE. :109-112 May, 2024

Relation: 2024 IEEE Vehicular Networking Conference (VNC)

المؤلفون: Bindal, E., Singh, A.K.

المصدر: IEEE Access Access, IEEE. 12:35586-35596 2024

المؤلفون: Han, C., Gao, B., Qu, T., Li, Y., Bai, C., Guo, Y., Cai, C.

المصدر: IEEE Transactions on Applied Superconductivity IEEE Trans. Appl. Supercond. Applied Superconductivity, IEEE Transactions on. 33(8):1-7 Nov, 2023

المؤلفون: Dambri, O.A., Cherkaoui, S., Makrakis, D.

المصدر: IEEE Transactions on NanoBioscience IEEE Trans.on Nanobioscience NanoBioscience, IEEE Transactions on. 22(2):223-236 Apr, 2023

المؤلفون: Jang, Kyungbae, Kim, Hyunji, Seo, Hwajeong

المصدر: 2022 International Conference on Platform Technology and Service (PlatCon) Platform Technology and Service (PlatCon), 2022 International Conference on. :44-47 Aug, 2022

Relation: 2022 International Conference on Platform Technology and Service (PlatCon)

المؤلفون: Lee, Philip Tin Yun, Lee, Alice Jing, Chau, Michael, Deng, Bingjie

المصدر: Industrial Management & Data Systems, 2024, Vol. 124, Issue 6, pp. 2284-2311.

URL الوصول: http://www.emeraldinsight.com/doi/10.1108/IMDS-07-2023-0493

المؤلفون: Karunasena, Gayani^Aff15, Ang, Susan^Aff15, Gunatilake, Sachie^Aff16, Fasna, M. F. F.^Aff16

المساهمون: Dahiya, Bharat, Series Editor^Aff1, Kirby, Andrew, Editorial Board Member^Aff2, Friedberg, Erhard, Editorial Board Member^Aff3, Singh, Rana P. B., Editorial Board Member^Aff4, Yu, Kongjian, Editorial Board Member^Aff5, El Sioufi, Mohamed, Editorial Board Member^Aff6, Campbell, Tim, Editorial Board Member^Aff7, Hayashi, Yoshitsugu, Editorial Board Member^Aff8, Bai, Xuemei, Editorial Board Member^Aff9, Haase, Dagmar, Editorial Board Member^Aff10, Arimah, Ben C., Editorial Board Member^Aff11, Nandineni, Rama Devi, editor^Aff12, Ang, Susan, editor^Aff13, Mohd Nawawi, Norwina Binti, editor^Aff14

المصدر: Sustainable Resilient Built Environments : Proceedings of SRBE 2022, India. :605-615

المؤلفون: Perriello, Simone^Aff25, Barenghi, Alessandro^Aff25, Pelosi, Gerardo^Aff25

المساهمون: Goos, Gerhard, Series Editor^Aff1, Hartmanis, Juris, Founding Editor^Aff2, van Leeuwen, Jan, Series Editor^Aff3, Hutchison, David, Editorial Board Member^Aff4, Kanade, Takeo, Editorial Board Member^Aff5, Kittler, Josef, Editorial Board Member^Aff6, Kleinberg, Jon M., Editorial Board Member^Aff7, Kobsa, Alfred, Series Editor^Aff8, Mattern, Friedemann, Editorial Board Member^Aff9, Mitchell, John C., Editorial Board Member^Aff10, Naor, Moni, Editorial Board Member^Aff11, Nierstrasz, Oscar, Series Editor^Aff12, Pandu Rangan, C., Editorial Board Member^Aff13, Sudan, Madhu, Series Editor^Aff14, Terzopoulos, Demetri, Editorial Board Member^Aff15, Tygar, Doug, Editorial Board Member^Aff16, Weikum, Gerhard, Series Editor^Aff17, Vardi, Moshe Y, Series Editor^Aff18, Bertino, Elisa, Editorial Board Member^Aff19, Gao, Wen, Editorial Board Member^Aff20, Steffen, Bernhard, Editorial Board Member^Aff21, Yung, Moti, Editorial Board Member^Aff22, Woeginger, Gerhard, Editorial Board Member^Aff23, Andreoni, Martin, editor^Aff24

المصدر: Applied Cryptography and Network Security Workshops : ACNS 2024 Satellite Workshops, AIBlock, AIHWS, AIoTS, SCI, AAC, SiMLA, LLE, and CIMSS, Abu Dhabi, United Arab Emirates, March 5–8, 2024, Proceedings, Part II. 14587:8-28

المؤلفون: Ekta Bindal, Abhay Kumar Singh

المصدر: IEEE Access, Vol 12, Pp 35586-35596 (2024)

مصطلحات موضوعية: McEliece cryptosystem, linear codes, information-set decoding (ISD), IND-CPA, Electrical engineering. Electronics. Nuclear engineering, TK1-9971

وصف الملف: electronic resource

Relation: https://ieeexplore.ieee.org/document/10459023/; https://doaj.org/toc/2169-3536

URL الوصول: https://doaj.org/article/f6bc0dece7ff4c3f8b3d8ee96a7a37eb

المؤلفون: Zhang, J., Li, J., Chen, X., Li, Y.

المصدر: IEEE Geoscience and Remote Sensing Letters IEEE Geosci. Remote Sensing Lett. Geoscience and Remote Sensing Letters, IEEE. 18(1):13-17 Jan, 2021