المؤلفون: Dong, C., Chen, L., Dai, S.

المصدر: IEEE Transactions on Intelligent Vehicles IEEE Trans. Intell. Veh. Intelligent Vehicles, IEEE Transactions on. 9(2):3581-3592 Feb, 2024

المؤلفون: P, Prasanth

المصدر: 2023 International Conference on Next Generation Electronics (NEleX) Next Generation Electronics (NEleX), 2023 International Conference on. :1-5 Dec, 2023

Relation: 2023 International Conference on Next Generation Electronics (NEleX)

المؤلفون: Zhang, Tianhan, Zhai, Xingli, Oiu, Weiqiang, Lv, Ting, Lin, Zhenzhi, Yang, Li

المصدر: 2022 IEEE Symposium Series on Computational Intelligence (SSCI) Computational Intelligence (SSCI), 2022 IEEE Symposium Series on. :1356-1361 Dec, 2022

Relation: 2022 IEEE Symposium Series on Computational Intelligence (SSCI)

المؤلفون: Kadam, Prajval, Sontakke, Mayur, Narale, Aniket, Agrawal, Rahul, Sorte, Swati

المصدر: 2022 International Conference on Electronics and Renewable Systems (ICEARS) Electronics and Renewable Systems (ICEARS), 2022 International Conference on. :186-191 Mar, 2022

Relation: 2022 International Conference on Electronics and Renewable Systems (ICEARS)

المؤلفون: Yuan, Xin^{Aff1, Aff2}, Wang, Qingye^{Aff1, Aff3, Aff4, IDs003430232334z_cor2}, Ma, Jie^{Aff1, Aff3, Aff4}, Hu, Shijian^{Aff1, Aff3, Aff4}, Hu, Dunxin^{Aff1, Aff3, Aff4, IDs003430232334z_cor5}

المصدر: Journal of Oceanology and Limnology. 42(2):468-483

المؤلفون: Satheesh Chandran, P. R.^{Aff1, Aff2}, Sunilkumar, S. V.^{Aff1, IDs00382023070041_cor2}

المصدر: Climate Dynamics: Observational, Theoretical and Computational Research on the Climate System. 62(3):1945-1963

المؤلفون: Purnapatra, Sandip, Das, Priyanka, Holsopple, Laura, Schuckers, Stephanie

المصدر: 2020 International Conference of the Biometrics Special Interest Group (BIOSIG) Biometrics Special Interest Group (BIOSIG), 2020 International Conference of the. :1-8 Sep, 2020

Relation: 2020 International Conference of the Biometrics Special Interest Group (BIOSIG)

المؤلفون: Ji Min Lee, Young Chan Ko, Byoung Geun Moon, Yong Ju Lee, Soon Wan Kweon, Hyoung Jin Kim

المصدر: BioResources, Vol 19, Iss 1, Pp 116-133 (2023)

مصطلحات موضوعية: facial tissue, physical softness model, pair-comparison test, interval scale value (isv), bulk softness, surface softness, tensile modulus (tm), surface roughness (ra and rmad), surface friction (μ ̅ and fmad), Biotechnology, TP248.13-248.65

وصف الملف: electronic resource

Relation: https://ojs.bioresources.com/index.php/BRJ/article/view/23021; https://doaj.org/toc/1930-2126

URL الوصول: https://doaj.org/article/dec799a24bc0490aba2dd6d0f9cd67a8

المؤلفون: Li, Yi^{Aff1, IDs11665022069716_cor1}, Guan, Yanjin^{Aff1, IDs11665022069716_cor2}, Liu, Ya, Zhai, Jiqiang, Lin, Jun

المصدر: Journal of Materials Engineering and Performance. 32(6):2626-2634

المؤلفون: Zhang, Xuegang^Aff16, Gan, Yu^Aff17, Jia, Ming^Aff16, Zhang, Yijing^{Aff16, Aff17, Aff18}

المساهمون: Goos, Gerhard, Founding Editor^Aff1, Hartmanis, Juris, Founding Editor^Aff2, Bertino, Elisa, Editorial Board Member^Aff3, Gao, Wen, Editorial Board Member^Aff4, Steffen, Bernhard, Editorial Board Member^Aff5, Yung, Moti, Editorial Board Member^Aff6, Kurosu, Masaaki, editor^Aff7, Yamamoto, Sakae, editor^Aff8, Mori, Hirohiko, editor^Aff9, Soares, Marcelo M., editor^Aff10, Rosenzweig, Elizabeth, editor^Aff11, Marcus, Aaron, editor^Aff12, Rau, Pei-Luen Patrick, editor^Aff13, Harris, Don, editor^Aff14, Li, Wen-Chin, editor^Aff15

المصدر: HCI International 2022 - Late Breaking Papers. Design, User Experience and Interaction : 24th International Conference on Human-Computer Interaction, HCII 2022, Virtual Event, June 26 – July 1, 2022, Proceedings. 13516:633-648