المؤلفون: Sonar, Eshwari, Shukla, V. H.^{Aff1, IDs13197023058041_cor2}, Vaidya, V. M., Zende, R. J., Ingole, S. D.

المصدر: Journal of Food Science and Technology. 60(11):2868-2880

المؤلفون: Sharma, Rishi K, Gopalan, A, Singh, R N, Bhachawat, D, Ingole, S M

المصدر: In Procedia Structural Integrity 2024 60:264-276

المؤلفون: Ingole, S. B.

المصدر: 2017 International Conference on Intelligent Computing and Control Systems (ICICCS) Intelligent Computing and Control Systems (ICICCS), 2017 International Conference on. :215-220 Jun, 2017

Relation: 2017 International Conference on Intelligent Computing and Control Systems (ICICCS)

المؤلفون: Kumar, Nirmal^Aff13, Mishra, Varun^Aff13, Faisal, D.^Aff13, Chaudhary, R. K.^Aff13, Chaudhry, V.^Aff13, Ingole, S. M.^Aff13

المساهمون: Cavas-Martínez, Francisco, Series Editor^Aff1, Chaari, Fakher, Series Editor^Aff2, di Mare, Francesca, Series Editor^Aff3, Gherardini, Francesco, Series Editor^Aff4, Haddar, Mohamed, Series Editor^Aff5, Ivanov, Vitalii, Series Editor^Aff6, Kwon, Young W., Series Editor^Aff7, Trojanowska, Justyna, Series Editor^Aff8, Jonnalagadda, Krishna, editor^Aff9, Alankar, Alankar, editor^Aff10, Balila, Nagamani Jaya, editor^Aff11, Bhandakkar, Tanmay, editor^Aff12

المصدر: Advances in Structural Integrity : Structural Integrity Over Multiple Length Scales. :415-433

المؤلفون: Chaudhry, V.^{Aff1, IDs4140302100288x_cor1}, Ingole, S. M.

المصدر: Transactions of the Indian National Academy of Engineering: An International Journal of Engineering and Technology. 7(2):707-714

المؤلفون: Ingole, S. B., Sundaram, K. K.

المصدر: 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) Electronics Packaging and Technology Conference (EPTC), 2015 IEEE 17th. :1-6 Dec, 2015

Relation: 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC)

المؤلفون: Chaudhry, V.^Aff6, Jain, D. K.^Aff6, Ingole, S. M.^Aff6, Balasubrahmanian, A. K.^Aff6, Muktibodh, U. C.^Aff6

المساهمون: Prakash, Raghu V., editor^Aff1, Suresh Kumar, R., editor^Aff2, Nagesha, Atikukke, editor^Aff3, Sasikala, Gomathy, editor^Aff4, Bhaduri, Arun Kumar, editor^Aff5

المصدر: Structural Integrity Assessment : Proceedings of ICONS 2018. :825-837

المؤلفون: Ingole, S. M.^{Aff6, Aff7}, Navale, Y. H.^Aff6, Jadhav, Y. M.^Aff6, Salunkhe, A. S.^Aff6, Patil, V. B.^Aff6

المساهمون: Pawar, Prashant M., editor^Aff1, Ronge, Babruvahan P., editor^Aff2, Balasubramaniam, R., editor^Aff3, Vibhute, Anup S., editor^Aff4, Apte, Sulabha S., editor^Aff5

المصدر: Techno-Societal 2018 : Proceedings of the 2nd International Conference on Advanced Technologies for Societal Applications - Volume 2. :323-328

المؤلفون: Navale, Y. H.^Aff6, Ingole, S. M.^Aff6, Dhanawade, R. N.^Aff6, Salunkhe, A. S.^Aff6, Patil, V. B.^Aff6

المساهمون: Pawar, Prashant M., editor^Aff1, Ronge, Babruvahan P., editor^Aff2, Balasubramaniam, R., editor^Aff3, Vibhute, Anup S., editor^Aff4, Apte, Sulabha S., editor^Aff5

المصدر: Techno-Societal 2018 : Proceedings of the 2nd International Conference on Advanced Technologies for Societal Applications - Volume 2. :315-321

المؤلفون: Vyas, Akash, Menghani, Jyoti^Aff1, Patel, Pringal, More, Satish, Paul, C. P., Patnaik, Amar, Ingole, S. P.

المصدر: Transactions of the Indian Institute of Metals. 74(4):839-849