يعرض 1 - 10 نتائج من 356,422 نتيجة بحث عن '"Inoue A."', وقت الاستعلام: 1.13s تنقيح النتائج
  1. 1
    مؤتمر
    Vision-based hybrid object tracking for autonomous vehicles

    المؤلفون: Chuang, Hsiu-Min, Tsuchiya, Masamitsu, Araki, Satoru, Inoue, Riku, Ariyoshi, Tokitomo, Yasui, Yuji

    المصدر: 2024 IEEE Intelligent Vehicles Symposium (IV) Intelligent Vehicles Symposium (IV), 2024 IEEE. :722-729 Jun, 2024

    Relation: 2024 IEEE Intelligent Vehicle Symposium (IV)

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  2. 2
    مؤتمر
    1.2 kV-Class Double Gate CSTBT™ with Carrier Profile Control for Total Switching Loss Reduction of Turn-Off and Tum-On

    المؤلفون: Noguchi, Munetaka, Inoue, Atsufumi, Onda, Kohei, Tamaki, Tomohiro, Konishi, Kazuya, Furuhashi, Masayuki, Nishikawa, Kazuyasu

    المصدر: 2024 36th International Symposium on Power Semiconductor Devices and ICs (ISPSD) Power Semiconductor Devices and ICs (ISPSD), 2024 36th International Symposium on. :44-47 Jun, 2024

    Relation: 2024 36th International Symposium on Power Semiconductor Devices and ICs (ISPSD)

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  3. 3
    مؤتمر
    Dynamic Charge Imbalance in Superjunction IGBTs: Design, Simulation, and Experimental Validation

    المؤلفون: Tamaki, Tomohiro, Inoue, Atsufumi, Furuhashi, Masayuki, Hino, Shiro, Hashimoto, Makoto, Kawase, Mitsuhisa, Sudo, Yohei, Ogawa, Tsutomu, Nishikawa, Kazuyasu

    المصدر: 2024 36th International Symposium on Power Semiconductor Devices and ICs (ISPSD) Power Semiconductor Devices and ICs (ISPSD), 2024 36th International Symposium on. :558-561 Jun, 2024

    Relation: 2024 36th International Symposium on Power Semiconductor Devices and ICs (ISPSD)

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  4. 4
    مؤتمر
    Exploring Bonding Mechanism of SiCN for Hybrid Bonding

    المؤلفون: Ebiko, Sodai, Iacovo, Serena, Chew, Soon-Aik, Zhang, Boyao, Uedono, Akira, Inoue, Fumihiro

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1953-1957 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  5. 5
    مؤتمر
    Low Temperature Wafer Level Hybrid Bonding Enabled by Advanced SiCN and Surface Activation

    المؤلفون: Inoue, Fumihiro, Nagata, Atsushi, Fuse, Junya, Ebiko, Sodai, Sato, Ryosuke, Saito, Kenichi, Kondo, Yoshihiro, Kawauchi, Takuo, Park, Junghwan, Ahn, Chiwoo, Kim, Myeonghyeon, Kang, Jiho

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :69-75 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  6. 6
    مؤتمر
    D2W Hybrid Bonding System Achieving High-Accuracy and High-Throughput With Minimal Configurations

    المؤلفون: Mihara, Kentaro, Hare, Takashi, Sakai, Hirofumi, Aoki, Shimpei, Terada, Toyoharu, Murugesan, Mariappan, Hashimoto, Hiryuki, Kino, Hisashi, Tanaka, Tetsu, Fukushima, Takafumi, Inoue, Fumihiro, Uedono, Akira

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :420-426 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  7. 7
    مؤتمر
    Comparison of the Dependence of Wiring Lengths of Radiated Immunity of Harnesses Connecting Automotive Communication Equipment

    المؤلفون: Kagawa, Akito, Inoue, Mao, Matsushima, Tohlu, Fukumoto, Yuki

    المصدر: 2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa) Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa), 2024 IEEE Joint International Symposium on. :457-460 May, 2024

    Relation: 2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa)

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  8. 8
    مؤتمر
    Novel Multi-Level Coding and Architecture Enabling Fast Random Access for Flash Memory

    المؤلفون: Shibata, Noboru, Uchikawa, Hironori, Shibuya, Taira, Inoue, Hirofumi

    المصدر: 2024 IEEE International Memory Workshop (IMW) Memory Workshop (IMW), 2024 IEEE International. :1-4 May, 2024

    Relation: 2024 IEEE International Memory Workshop (IMW)

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  9. 9
    مؤتمر
    Heterogeneous Oxide Semiconductor FETs Comprising Planar FET and Vertical Channel FETs Monolithically Stacked on Si CMOS, Enabling 1-Mbit 3D DRAM

    المؤلفون: Inoue, H., Hirose, T., Mizuguchi, T., Komura, Y., Saito, T., Ito, M., Kimura, K., Onuki, T., Ando, Y., Sawai, H., Murakawa, T., Kunitake, H., Matsuzaki, T., Kimura, H., Ikeda, M., Yamazaki, S.

    المصدر: 2024 IEEE International Memory Workshop (IMW) Memory Workshop (IMW), 2024 IEEE International. :1-4 May, 2024

    Relation: 2024 IEEE International Memory Workshop (IMW)

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  10. 10
    مؤتمر
    Yet Another Example of ChatGPT’s Evasive Tactics During Long Conversations: Japanese Rock Song Lyrics Case

    المؤلفون: Selitskiy, Stanislav, Inoue, Chihiro

    المصدر: 2024 IEEE Conference on Cognitive and Computational Aspects of Situation Management (CogSIMA) Cognitive and Computational Aspects of Situation Management (CogSIMA), 2024 IEEE Conference on. :132-136 May, 2024

    Relation: 2024 IEEE Conference on Cognitive and Computational Aspects of Situation Management (CogSIMA)

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