المؤلفون: Choudhary, Prashant Kumar, Chauhan, Shiv, Chengalvarayan, Raja, Gunti, Ranga Srinivas

المصدر: 2023 IEEE International Transportation Electrification Conference (ITEC-India) Transportation Electrification Conference (ITEC-India), 2023 IEEE International. :1-10 Dec, 2023

Relation: 2023 IEEE International Transportation Electrification Conference (ITEC-India)

المؤلفون: Krammer, Oliver, Hurtony, Tamas, Hadarits, Aron

المصدر: 2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME) Design and Technology in Electronic Packaging (SIITME), 2017 IEEE 23rd International Symposium for. :73-77 Oct, 2017

Relation: 2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME)

المؤلفون: Garami, Tamas, Krammer, Oliver

المصدر: 2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME) Design and Technology in Electronic Packaging (SIITME), 2015 IEEE 21st International Symposium for. :89-93 Oct, 2015

Relation: 2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME)

المؤلفون: Mokhtari, Omid, Nishikawa, Hiroshi

المصدر: 2013 14th International Conference on Electronic Packaging Technology Electronic Packaging Technology (ICEPT), 2013 14th International Conference on. :250-253 Aug, 2013

Relation: 2013 14th International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Garami, Tamas, Krammer, Oliver

المصدر: 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) Design and Technology in Electronic Packaging (SIITME), 2012 IEEE 18th International Symposium for. :129-132 Oct, 2012

Relation: 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME)

المؤلفون: Tay, S.L., Haseeb, A.S.M.A., Johan, M.R.

المصدر: 2010 12th Electronics Packaging Technology Conference Electronics Packaging Technology Conference (EPTC), 2010 12th. :433-436 Dec, 2010

Relation: 2010 12th Electronics Packaging Technology Conference - (EPTC 2010)

المؤلفون: Monroe, Alex^Aff1, Sanders, Paul

المصدر: International Journal of Metalcasting. 15(2):391-397

المؤلفون: Janasekaran, Shamini^Aff2, Yusof, Farazila^Aff3, Shukor, Mohd Hamdi Abdul^Aff3

المساهمون: Awang, Mokhtar, editor^Aff1

المصدر: The Advances in Joining Technology. :59-69

المؤلفون: Hong Jun Choi, Dong Woo Kang, Jun‐Woo Park, Jun‐Ho Park, Yoo‐Jin Lee, Yoon‐Cheol Ha, Sang‐Min Lee, Seog Young Yoon, Byung Gon Kim

المصدر: Advanced Science, Vol 9, Iss 1, Pp n/a-n/a (2022)

مصطلحات موضوعية: Ag‐Li, all‐solid‐state‐batteries, dendrite‐free, intermetallic layer, roll pressing, Science

وصف الملف: electronic resource

Relation: https://doaj.org/toc/2198-3844

URL الوصول: https://doaj.org/article/6f3e1b14c6ec4b8fa498ce02082ba006

المؤلفون: Liu, Y., Yin, L., Bliznakov, S., Kondos, P., Borgesen, P., Henderson, D. W., Parks, C., Wang, J., Cotts, E. J., Dimitrov, N.

المصدر: IEEE Transactions on Components and Packaging Technologies IEEE Trans. Comp. Packag. Technol. Components and Packaging Technologies, IEEE Transactions on. 33(1):127-137 Mar, 2010