المؤلفون: Zhou, Hongyan, Zhan, Shibin, Zheng, Pengcheng, Zhang, Liping, Wu, Jinbo, Yao, Hulin, You, Tiangui, Ou, Xin

المصدر: 2022 IEEE 35th International Conference on Micro Electro Mechanical Systems Conference (MEMS) Micro Electro Mechanical Systems Conference (MEMS), 2022 IEEE 35th International Conference on. :1006-1009 Jan, 2022

Relation: 2022 IEEE 35th International Conference on Micro Electro Mechanical Systems Conference (MEMS)

المؤلفون: Zhou, Hongyan, Zhang, Shibin, Wu, Jinbo, Zheng, Pengcheng, Zhang, Liping, Xu, Hongtao, An, Zhenghua, You, Tiangui, Ou, Xin

المصدر: 2021 IEEE International Ultrasonics Symposium (IUS) Ultrasonics Symposium (IUS), 2021 IEEE International. :1-4 Sep, 2021

Relation: 2021 IEEE International Ultrasonics Symposium (IUS)

المؤلفون: Wenhui Xu, Tiangui You, Yibo Wang, Zhenghao Shen, Kang Liu, Lianghui Zhang, Huarui Sun, Ruijie Qian, Zhenghua An, Fengwen Mu, Tadatomo Suga, Genquan Han, Xin Ou, Yue Hao, Xi Wang

المصدر: Fundamental Research, Vol 1, Iss 6, Pp 691-696 (2021)

مصطلحات موضوعية: Thermal management, Heterogeneous integration, Wafer scale β-Ga2O3 on SiC, Ion-cutting technique, Schottky barrier diodes (SBDs), Transient thermoreflectance (TTR) measurements, Science (General), Q1-390

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2667325821002156; https://doaj.org/toc/2667-3258

URL الوصول: https://doaj.org/article/075092ddd9c341c4ab1275ff210bc314

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