المؤلفون: Nomura, N., Itagaki, M., Aoyagi, Y.

المصدر: Proceedings of the 2004 IEEE International Frequency Control Symposium and Exposition, 2004. Frequency Control Symposium Frequency Control Symposium and Exposition, 2004. Proceedings of the 2004 IEEE International. :418-421 2004

Relation: Proceedings of the 2004 IEEE International Frequency Control Symposium And Exhibition

المؤلفون: Takaki, K., Takada, Y., Itagaki, M., Mukaigawa, S., Fujiwara, T., Ohshima, S., Takahashi, I., Kuwashima, T.

المصدر: Digest of Technical Papers. PPC-2003. 14th IEEE International Pulsed Power Conference (IEEE Cat. No.03CH37472) Pulsed power conference Pulsed Power Conference, 2003. Digest of Technical Papers. PPC-2003. 14th IEEE International. 2:1258-1261 Vol.2 2003

Relation: Digest of Technical Papers. PPC-2003. 14th IEEE International Pulsed Power Conference

المؤلفون: Takaki, I., Takada, Y., Itagaki, M., Mukaigawa, S., Fujiwara, T., Ohshima, S., Oyama, K., Takahashi, I., Kuwashima, T.

المصدر: Conference Record of the Twenty-Fifth International Power Modulator Symposium, 2002 and 2002 High-Voltage Workshop. Power modulator symposium and high-voltage workshop Power Modulator Symposium, 2002 and 2002 High-Voltage Workshop. Conference Record of the Twenty-Fifth International. :567-570 2002

Relation: Conference Record of the Twenty-Fifth International Power Modulator Symposium and 2002 High-Voltage Workshop. International Power Modulator Conference

المؤلفون: Taguchi, Y., Itagaki, M., Inoue, O., Kato, J., Eda, K.

المصدر: 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) Electronic components and technology Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th. :454-458 2000

Relation: 2000 Proceedings. 50th Electronic Components and Technology Conference

المؤلفون: Takezawa, H., Itagaki, M., Mitani, T., Bessho, Y., Eda, K.

المصدر: Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405) Advanced packaging materials: processes, properties and interfaces Advanced Packaging Materials: Processes, Properties and Interfaces, 1999. Proceedings. International Symposium on. :11-15 1999

Relation: Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces

المؤلفون: Itagaki, M., Amami, K., Tomura, Y., Yuhaku, S., Noda, O., Bessho, Y., Eda, K., Ishida, T.

المصدر: Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154) Multichip modules and high density packaging Multichip Modules and High Density Packaging, 1998. Proceedings. 1998 International Conference on. :236-241 1998

Relation: Proceedings 1998 International Conference on Multichip Modules and High Density Packaging

المؤلفون: Amami, K., Yuhaku, S., ShiI aishi, T., Itagaki, M., Bessho, Y., Eda, K., Ishida, T.

المصدر: IEMT/IMC Symposium, 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference] IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]. :164-168 1997

Relation: IEMT/IMC Symposium

المؤلفون: Itagaki, M., Bessho, Y., Eda, K., Ishida, T.

المصدر: Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium Electronics Manufacturing Technology Symposium, 1996., Nineteenth IEEE/CPMT. :156-161 1996

Relation: Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium

المؤلفون: Takaki, K., Mikami, Y., Itagaki, M., Mukaigawa, S., Fujiwara, T., Nakamura, S.

المصدر: IEEE Transactions on Plasma Science IEEE Trans. Plasma Sci. Plasma Science, IEEE Transactions on. 34(5):1709-1714 Oct, 2006

المؤلفون: Nishikawa, H., Tasaki, M., Nakatani, S., Hakotani, Y., Itagaki, M.

المصدر: Proceedings of Japan International Electronic Manufacturing Technology Symposium Electronic Manufacturing Technology Symposium, 1993., Proceedings of 1993 Japan International. :238-241 1993

Relation: Proceedings of Japan International Electronic Manufacturing Technology Symposium