المؤلفون: Nishida, Masataka, Noma, Hirokazu, Segawa, Kouta, Iwakura, Tetsuro, Yamaguchi, Masaki, Han, Younggun, Onozeki, Hitoshi, Mitsukura, Kazuyuki

المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :72-77 May, 2023

Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

المؤلفون: Nishida, Masataka, Noma, Hirokazu, Iwakura, Tetsuro, Yamaguchi, Masaki, Mitsukura, Kazuyuki

المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :867-872 May, 2022

Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

المؤلفون: Kasahara, Aya, Iwakura, Tetsuro, Kondo, Yusuke, Irino, Tetsuro, Shimizu, Hiroshi

المصدر: 2016 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2016 International Conference on. :43-47 Apr, 2016

Relation: 2016 International Conference on Electronics Packaging (ICEP)

المؤلفون: Yamada, Kumpei, Fujimoto, Daisuke, Iwakura, Tetsuro, Murai, Hikari, Kaneko, Youichi, Simizu, Hiroshi

المصدر: 2013 3rd IEEE CPMT Symposium Japan CPMT Symposium Japan (ICSJ), 2013 IEEE 3rd. :1-5 Nov, 2013

Relation: 2013 IEEE CPMT Symposium Japan (Formerly VLSI Packaging Workshop of Japan)

المؤلفون: Koyama, Kiyohito, Uematsu, Hideyuki, Sugimoto, Masataka, Taniguchi, Takashi, Inada, Teiichi, Iwakura, Tetsuro

المصدر: AIP Conference Proceedings; 7/7/2008, Vol. 1027 Issue 1, p526-527, 2p, 1 Chart, 3 Graphs

مصطلحات موضوعية: STRAIN hardening, POLYMERS, RHEOLOGY, TEMPERATURE control, FLUID dynamics