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1دورية أكاديمية
المؤلفون: Ezhilarasu, G., Iyer, S.S.
المصدر: IEEE Nanotechnology Magazine IEEE Nanotechnology Mag. Nanotechnology Magazine, IEEE. 18(2):30-40 Apr, 2024
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2مؤتمر
المصدر: 2023 IEEE 17th International Conference on Industrial and Information Systems (ICIIS) Industrial and Information Systems (ICIIS), 2023 IEEE 17th International Conference on. :85-90 Aug, 2023
Relation: 2023 IEEE 17th International Conference on Industrial and Information Systems (ICIIS)
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3دورية أكاديمية
المؤلفون: Gorchichko, M., Zhang, E.X., Reaz, M., Li, K., Wang, P.F., Cao, J., Brewer, R.M., Schrimpf, R.D., Reed, R.A., Sierawski, B.D., Alles, M.L., Cox, J., Moran, S.L., Iyer, S.S., Fleetwood, D.M.
المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 70(6):3215-3222 Jun, 2023
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4دورية أكاديمية
المؤلفون: Nagi, S.S., Rathore, U., Sahoo, K., Ling, T., Iyer, S.S., Markovic, D.
المصدر: IEEE Journal of Solid-State Circuits IEEE J. Solid-State Circuits Solid-State Circuits, IEEE Journal of. 58(1):111-123 Jan, 2023
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5دورية أكاديمية
المؤلفون: Ouyang, G., Hanna, A., Benedict, S., Ezhilarasu, G., Alam, A., Irwin, R.W., Iyer, S.S.
المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 12(10):1692-1701 Oct, 2022
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6دورية أكاديمية
المؤلفون: Kannan, K.T., Vaisband, B., Sahoo, K., Iyer, S.S.
المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 12(7):1051-1062 Jul, 2022
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7دورية أكاديمية
المؤلفون: Shah, U., Ma, M., Barako, M.T., Bar-Cohen, A., Iyer, S.S., Fisher, T.S.
المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 11(10):1604-1614 Oct, 2021
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8دورية أكاديمية
المؤلفون: Jangam, S., Iyer, S.S.
المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 11(5):727-738 May, 2021
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9دورية أكاديمية
المؤلفون: Brewer, R.M., Zhang, E.X., Gorchichko, M., Wang, P.F., Cox, J., Moran, S.L., Ball, D.R., Sierawski, B.D., Fleetwood, D.M., Schrimpf, R.D., Iyer, S.S., Alles, M.L.
المصدر: IEEE Transactions on Nuclear Science IEEE Trans. Nucl. Sci. Nuclear Science, IEEE Transactions on. 68(5):677-686 May, 2021
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10دورية أكاديمية
المؤلفون: Nouri, S., Iyer, S.S.
المصدر: IEEE Electron Device Letters IEEE Electron Device Lett. Electron Device Letters, IEEE. 42(1):110-113 Jan, 2021