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المؤلفون: G. Audoit, J.-M. Fabbri, J. Bertheau, H. Dansas, Pierre Bleuet, E. Lay, Yves Dabin, Adeline Grenier, Georg Haberfehlner, B. Florin, P. Gergaud, Julie Villanova, Jean-Paul Barnes, R. Serra, Jérôme Laurencin
المصدر: Microscopy and Microanalysis. 19:726-739
مصطلحات موضوعية: Physics, Machining, Electron tomography, Condensed matter physics, business.industry, Microelectronics, Polishing, Sample preparation, Tomography, Ion milling machine, business, Instrumentation, Focused ion beam
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المؤلفون: Fiqiri Hodaj, F. Lorut, A. Thuaire, G. Audoit, J. Bertheau, Pierre Bleuet, J. Charbonnier, M. L. Djomeni Weleguela, Peter Cloetens, D. Ferreira Sanchez, Patrice Gergaud, O. Ulrich, Jean-Sébastien Micha
المصدر: SPIE Proceedings.
مصطلحات موضوعية: Materials science, business.industry, Synchrotron radiation, Iterative reconstruction, Synchrotron, law.invention, Characterization (materials science), Optics, law, Microelectronics, Tomography, business, Penetration depth, Raster scan
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::e603ab6088f6466b425640d703e553fc
https://doi.org/10.1117/12.2060825 -
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المؤلفون: N. Martin, J. Charbonnier, N. Hotellier, J. Bertheau, Pierre Bleuet, Peter Cloetens, Fiqiri Hodaj
المساهمون: STMicroelectronics [Crolles] (ST-CROLLES), Science et Ingénierie des Matériaux et Procédés (SIMaP), Université Joseph Fourier - Grenoble 1 (UJF)-Centre National de la Recherche Scientifique (CNRS)-Institut polytechnique de Grenoble - Grenoble Institute of Technology (Grenoble INP )-Institut de Chimie du CNRS (INC)-Institut National Polytechnique de Grenoble (INPG)
المصدر: Microelectronic Engineering
Microelectronic Engineering, Elsevier, 2014, 113, pp.123-129. ⟨10.1016/j.mee.2013.07.013⟩مصطلحات موضوعية: Materials science, Alloy, Intermetallic, Synchrotron radiation, 02 engineering and technology, engineering.material, 01 natural sciences, law.invention, law, 0103 physical sciences, Microelectronics, Electrical and Electronic Engineering, Composite material, ComputingMilieux_MISCELLANEOUS, 010302 applied physics, business.industry, Metallurgy, [CHIM.MATE]Chemical Sciences/Material chemistry, 021001 nanoscience & nanotechnology, Condensed Matter Physics, Microstructure, Atomic and Molecular Physics, and Optics, Synchrotron, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, Characterization (materials science), engineering, 0210 nano-technology, business, Flip chip
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المؤلفون: J. Bertheau, D. Laloum, G. Audoit, P. Bleuet, F. Lorut
المصدر: Micron (Oxford, England : 1993). 58
مصطلحات موضوعية: Thermal copper pillar bump, Materials science, Ion beam, business.industry, Scanning electron microscope, Resolution (electron density), General Physics and Astronomy, chemistry.chemical_element, Nanotechnology, Cell Biology, Copper, Optics, chemistry, Structural Biology, Microscopy, General Materials Science, Tomography, Thin film, business
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المؤلفون: Sylvain Joblot, Alisee Taluy, R. Franiatte, A. Jouve, S. Cheramy, J. Bertheau, N. Sillon, Alain Sylvestre, P. Ancey, Alexis Farcy
المساهمون: STMicroelectronics [Crolles] (ST-CROLLES), Laboratoire de Génie Electrique de Grenoble (G2ELab), Université Joseph Fourier - Grenoble 1 (UJF)-Institut polytechnique de Grenoble - Grenoble Institute of Technology (Grenoble INP )-Institut Polytechnique de Grenoble - Grenoble Institute of Technology-Centre National de la Recherche Scientifique (CNRS), Commissariat à l'énergie atomique et aux énergies alternatives - Laboratoire d'Electronique et de Technologie de l'Information (CEA-LETI), Direction de Recherche Technologique (CEA) (DRT (CEA)), Commissariat à l'énergie atomique et aux énergies alternatives (CEA)-Commissariat à l'énergie atomique et aux énergies alternatives (CEA)
المصدر: Electronic components and technology conference
Electronic components and technology conference, May 2013, Las Vegas, United Statesمصطلحات موضوعية: Interconnection, Yield (engineering), Materials science, [SPI.NRJ]Engineering Sciences [physics]/Electric power, 02 engineering and technology, 021001 nanoscience & nanotechnology, Residual, 01 natural sciences, 010305 fluids & plasmas, Soldering, 0103 physical sciences, Electronic engineering, Wafer, Composite material, 0210 nano-technology, Joint (geology), Wafer-level packaging, Flip chip, ComputingMilieux_MISCELLANEOUS
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::ec7dffb27deb9b1b0ba0a692a57f3b87
https://hal.archives-ouvertes.fr/hal-00846919 -
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المؤلفون: Pierre Bleuet, Perceval Coudrain, N. Hotellier, J. Bertheau, Roland Pantel, Fiqiri Hodaj, Jean Charbonnier
المصدر: 2013 IEEE 63rd Electronic Components and Technology Conference.
مصطلحات موضوعية: Materials science, Alloy, Metallurgy, Intermetallic, chemistry.chemical_element, engineering.material, Copper, Isothermal process, Reflow soldering, chemistry, Soldering, engineering, Eutectic bonding, Tin
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::2a2049e1a7e811c372fc57c922ec14ff
https://doi.org/10.1109/ectc.2013.6575715 -
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المؤلفون: J. Bertheau, N. Martin, J. Tabary, Pierre Bleuet, P. Hugonnard, J. Charbonnier, D. Laloum, F. Lorut
المصدر: The Review of scientific instruments. 84(2)
مصطلحات موضوعية: Thermal copper pillar bump, Materials science, business.industry, Scanning electron microscope, Resolution (electron density), Synchrotron radiation, Context (language use), Synchrotron, law.invention, Optics, law, Tomography, business, Instrumentation, Image resolution
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